WO2009037941A1 - 基板の処理方法及び基板の処理システム - Google Patents
基板の処理方法及び基板の処理システム Download PDFInfo
- Publication number
- WO2009037941A1 WO2009037941A1 PCT/JP2008/064913 JP2008064913W WO2009037941A1 WO 2009037941 A1 WO2009037941 A1 WO 2009037941A1 JP 2008064913 W JP2008064913 W JP 2008064913W WO 2009037941 A1 WO2009037941 A1 WO 2009037941A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- substrate processing
- cassette
- processing apparatus
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/733,614 US8731701B2 (en) | 2007-09-20 | 2008-08-21 | Substrate treatment method and substrate treatment system |
CN2008801081121A CN101802978B (zh) | 2007-09-20 | 2008-08-21 | 基板处理方法和基板处理系统 |
KR1020107005732A KR101443420B1 (ko) | 2007-09-20 | 2008-08-21 | 기판의 처리 방법 및 기판의 처리 시스템 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007243457 | 2007-09-20 | ||
JP2007-243457 | 2007-09-20 | ||
JP2008153422A JP5065167B2 (ja) | 2007-09-20 | 2008-06-11 | 基板の処理方法及び基板の処理システム |
JP2008-153422 | 2008-06-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009037941A1 true WO2009037941A1 (ja) | 2009-03-26 |
Family
ID=40467762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/064913 WO2009037941A1 (ja) | 2007-09-20 | 2008-08-21 | 基板の処理方法及び基板の処理システム |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009037941A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109716250A (zh) * | 2016-09-20 | 2019-05-03 | 株式会社斯库林集团 | 基板处理管理装置、基板处理管理方法及基板处理管理程序 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002260995A (ja) * | 2001-03-05 | 2002-09-13 | Tokyo Electron Ltd | 基板処理装置及び基板処理装置における基板回収方法 |
JP2003037148A (ja) * | 2001-07-25 | 2003-02-07 | Tokyo Electron Ltd | 処理システム及び被処理体の管理方法 |
JP2004087795A (ja) * | 2002-08-27 | 2004-03-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理システム |
JP2004214350A (ja) * | 2002-12-27 | 2004-07-29 | Dainippon Screen Mfg Co Ltd | 基板処理システム、基板処理装置、および、基板処理システムの管理方法 |
-
2008
- 2008-08-21 WO PCT/JP2008/064913 patent/WO2009037941A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002260995A (ja) * | 2001-03-05 | 2002-09-13 | Tokyo Electron Ltd | 基板処理装置及び基板処理装置における基板回収方法 |
JP2003037148A (ja) * | 2001-07-25 | 2003-02-07 | Tokyo Electron Ltd | 処理システム及び被処理体の管理方法 |
JP2004087795A (ja) * | 2002-08-27 | 2004-03-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理システム |
JP2004214350A (ja) * | 2002-12-27 | 2004-07-29 | Dainippon Screen Mfg Co Ltd | 基板処理システム、基板処理装置、および、基板処理システムの管理方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109716250A (zh) * | 2016-09-20 | 2019-05-03 | 株式会社斯库林集团 | 基板处理管理装置、基板处理管理方法及基板处理管理程序 |
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