WO2009034827A1 - 粘着テープおよびその製造方法 - Google Patents

粘着テープおよびその製造方法 Download PDF

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Publication number
WO2009034827A1
WO2009034827A1 PCT/JP2008/065135 JP2008065135W WO2009034827A1 WO 2009034827 A1 WO2009034827 A1 WO 2009034827A1 JP 2008065135 W JP2008065135 W JP 2008065135W WO 2009034827 A1 WO2009034827 A1 WO 2009034827A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive tape
substrate
pressure
sensitive adhesive
producing
Prior art date
Application number
PCT/JP2008/065135
Other languages
English (en)
French (fr)
Inventor
Yoshio Terada
Shozo Kawazoe
Yoshinori Yoshida
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007235130A external-priority patent/JP5153271B2/ja
Priority claimed from JP2007246885A external-priority patent/JP5048436B2/ja
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to US12/677,405 priority Critical patent/US20100203323A1/en
Publication of WO2009034827A1 publication Critical patent/WO2009034827A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/31—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive effect being based on a Gecko structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Abstract

　被着体に対して必要な粘着力を有し、クリーニング部位に汚染を生じることなくサブミクロンレベルの異物も除去でき、耐熱性に優れ、高温下でも十分な粘着力と凝集力を発揮し、使用後に被着体から引き剥がす際に被着体に糊残りを生じることなく容易に剥離する事が可能な粘着テープおよびその製造方法を提供する。 　本発明の粘着テープは、支持体の表面に該表面からの仰角が９０度未満で突出した斜め柱状構造体の集合層を備え、該斜め柱状構造体のアスペクト比が１以上である。本発明の粘着テープの製造方法は、支持体の表面に該表面からの仰角が９０度未満で突出した斜め柱状構造体の集合層を備え、該斜め柱状構造体のアスペクト比が１以上である粘着テープの製造方法であって、該支持体の表面に該斜め柱状構造体を斜め蒸着法によって形成する。  
PCT/JP2008/065135 2007-09-11 2008-08-26 粘着テープおよびその製造方法 WO2009034827A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/677,405 US20100203323A1 (en) 2007-09-11 2008-08-26 Pressure-sensitive adhesive tape and method of producing the tape

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007235130A JP5153271B2 (ja) 2007-09-11 2007-09-11 粘着テープ
JP2007-235130 2007-09-11
JP2007246885A JP5048436B2 (ja) 2007-09-25 2007-09-25 粘着テープの製造方法
JP2007-246885 2007-09-25

Publications (1)

Publication Number Publication Date
WO2009034827A1 true WO2009034827A1 (ja) 2009-03-19

Family

ID=40451836

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065135 WO2009034827A1 (ja) 2007-09-11 2008-08-26 粘着テープおよびその製造方法

Country Status (3)

Country Link
US (1) US20100203323A1 (ja)
TW (1) TW200916550A (ja)
WO (1) WO2009034827A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11401711B2 (en) * 2017-03-31 2022-08-02 James Alan Klein Multilayer fire safety tape and related fire retardant building construction framing members

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000011342A (ja) * 1998-06-26 2000-01-14 Sony Corp クリーニングテープおよびその製造方法
JP2002219778A (ja) * 2001-01-25 2002-08-06 Daikyo Giken Kogyo Kk 剥離材及びその製造方法並びに粘着性物品
JP2007039476A (ja) * 2005-07-29 2007-02-15 Sekisui Chem Co Ltd 粘着テープ及びその製造方法並びに粘着テープ原反

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401587A (en) * 1990-03-27 1995-03-28 Kabushiki Kaisha Toyota Chuo Kenkyusho Anisotropic nanophase composite material and method of producing same
US8815385B2 (en) * 1999-12-20 2014-08-26 The Regents Of The University Of California Controlling peel strength of micron-scale structures
US6737160B1 (en) * 1999-12-20 2004-05-18 The Regents Of The University Of California Adhesive microstructure and method of forming same
US6872439B2 (en) * 2002-05-13 2005-03-29 The Regents Of The University Of California Adhesive microstructure and method of forming same
US20050186873A1 (en) * 2004-02-24 2005-08-25 Milliken & Company Treated textile substrate and method for making a textile substrate
JP4726420B2 (ja) * 2003-04-25 2011-07-20 日東電工株式会社 粘着テープ又はシートおよびその製造方法
KR20060002733A (ko) * 2003-04-30 2006-01-09 우베-니토 카세이 가부시키가이샤 광촉매 도공액, 광촉매막 및 광촉매 부재
US7811272B2 (en) * 2003-12-29 2010-10-12 Kimberly-Clark Worldwide, Inc. Nanofabricated gecko-like fasteners with adhesive hairs for disposable absorbent articles
WO2007032164A1 (ja) * 2005-09-12 2007-03-22 Nissan Motor Co., Ltd. 接着構造体及びその製造方法
CN102026802A (zh) * 2008-03-19 2011-04-20 日东电工株式会社 亲水性片材及基材表面的超亲水化方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000011342A (ja) * 1998-06-26 2000-01-14 Sony Corp クリーニングテープおよびその製造方法
JP2002219778A (ja) * 2001-01-25 2002-08-06 Daikyo Giken Kogyo Kk 剥離材及びその製造方法並びに粘着性物品
JP2007039476A (ja) * 2005-07-29 2007-02-15 Sekisui Chem Co Ltd 粘着テープ及びその製造方法並びに粘着テープ原反

Also Published As

Publication number Publication date
TW200916550A (en) 2009-04-16
US20100203323A1 (en) 2010-08-12

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