WO2009028689A1 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
WO2009028689A1
WO2009028689A1 PCT/JP2008/065597 JP2008065597W WO2009028689A1 WO 2009028689 A1 WO2009028689 A1 WO 2009028689A1 JP 2008065597 W JP2008065597 W JP 2008065597W WO 2009028689 A1 WO2009028689 A1 WO 2009028689A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
conductor pattern
forming direction
emitting element
emitting device
Prior art date
Application number
PCT/JP2008/065597
Other languages
English (en)
French (fr)
Inventor
Yuki Mori
Original Assignee
Kyocera Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007223467A external-priority patent/JP2010262946A/ja
Priority claimed from JP2008115304A external-priority patent/JP2010262948A/ja
Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Publication of WO2009028689A1 publication Critical patent/WO2009028689A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

　発光装置は、発光素子、第１導体パターンおよび第２導体パターンを含んでいる。発光素子は、第１電極および第２電極を含む実装面を有している。第１導体パターンは、第１形成方向を有しており、発光素子の実装領域内に含まれている。第２導体パターンは、第２形成方向を有している。第２形成方向は、第１形成方向と反対の方向である。第２導体パターンは、発光素子の実装領域内に含まれている。他の態様において、第１導体パターンは、第１形成方向を有しており、発光素子の実装領域内に含まれている。第２導体パターンは、第２形成方向を有している。第２形成方向は、第１形成方向に交わる方向である。第２導体パターンは、発光素子の実装領域内に含まれている。
PCT/JP2008/065597 2007-08-30 2008-08-29 発光装置 WO2009028689A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007223467A JP2010262946A (ja) 2007-08-30 2007-08-30 発光装置
JP2007-223467 2007-08-30
JP2008-115304 2008-04-25
JP2008115304A JP2010262948A (ja) 2008-04-25 2008-04-25 発光装置

Publications (1)

Publication Number Publication Date
WO2009028689A1 true WO2009028689A1 (ja) 2009-03-05

Family

ID=40387399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065597 WO2009028689A1 (ja) 2007-08-30 2008-08-29 発光装置

Country Status (2)

Country Link
TW (1) TWI389345B (ja)
WO (1) WO2009028689A1 (ja)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168235A (ja) * 1997-12-05 1999-06-22 Toyoda Gosei Co Ltd 発光ダイオード
JP2000286457A (ja) * 1999-01-29 2000-10-13 Toyoda Gosei Co Ltd 発光ダイオード
JP2002151739A (ja) * 2000-11-09 2002-05-24 Showa Denko Kk フリップチップ型半導体発光素子とその製造方法及び発光ダイオードランプ並びに表示装置、フリップチップ型半導体発光素子用電極
JP2002335015A (ja) * 2001-05-09 2002-11-22 Rohm Co Ltd 半導体発光素子
JP2003046142A (ja) * 2001-08-01 2003-02-14 Sanyo Electric Co Ltd 発光装置及びそれに用いる支持台
JP2005191097A (ja) * 2003-12-24 2005-07-14 Kawaguchiko Seimitsu Co Ltd 半導体パッケージ
JP2006156668A (ja) * 2004-11-29 2006-06-15 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2006156506A (ja) * 2004-11-25 2006-06-15 Matsushita Electric Ind Co Ltd 半導体発光装置、照明装置、携帯通信機器、カメラ、及び製造方法
JP2006303509A (ja) * 2005-04-21 2006-11-02 Crf Soc Consortile Per Azioni 発光ダイオードを有する透明デバイスの製造方法
JP2007027521A (ja) * 2005-07-20 2007-02-01 Hitachi Displays Ltd 液晶表示装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168235A (ja) * 1997-12-05 1999-06-22 Toyoda Gosei Co Ltd 発光ダイオード
JP2000286457A (ja) * 1999-01-29 2000-10-13 Toyoda Gosei Co Ltd 発光ダイオード
JP2002151739A (ja) * 2000-11-09 2002-05-24 Showa Denko Kk フリップチップ型半導体発光素子とその製造方法及び発光ダイオードランプ並びに表示装置、フリップチップ型半導体発光素子用電極
JP2002335015A (ja) * 2001-05-09 2002-11-22 Rohm Co Ltd 半導体発光素子
JP2003046142A (ja) * 2001-08-01 2003-02-14 Sanyo Electric Co Ltd 発光装置及びそれに用いる支持台
JP2005191097A (ja) * 2003-12-24 2005-07-14 Kawaguchiko Seimitsu Co Ltd 半導体パッケージ
JP2006156506A (ja) * 2004-11-25 2006-06-15 Matsushita Electric Ind Co Ltd 半導体発光装置、照明装置、携帯通信機器、カメラ、及び製造方法
JP2006156668A (ja) * 2004-11-29 2006-06-15 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2006303509A (ja) * 2005-04-21 2006-11-02 Crf Soc Consortile Per Azioni 発光ダイオードを有する透明デバイスの製造方法
JP2007027521A (ja) * 2005-07-20 2007-02-01 Hitachi Displays Ltd 液晶表示装置

Also Published As

Publication number Publication date
TW200915627A (en) 2009-04-01
TWI389345B (zh) 2013-03-11

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