WO2009028239A1 - Structure de montage de dispositif à semi-conducteur et procédé de montage de dispositif à semi-conducteur - Google Patents
Structure de montage de dispositif à semi-conducteur et procédé de montage de dispositif à semi-conducteur Download PDFInfo
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- WO2009028239A1 WO2009028239A1 PCT/JP2008/058720 JP2008058720W WO2009028239A1 WO 2009028239 A1 WO2009028239 A1 WO 2009028239A1 JP 2008058720 W JP2008058720 W JP 2008058720W WO 2009028239 A1 WO2009028239 A1 WO 2009028239A1
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
La présente invention concerne une structure et un procédé de montage d'une puce nue ou d'un boîtier de la taille d'une puce ayant une grande fiabilité de connexion. Particulièrement, une bosse pour connecter électriquement un plot d'électrode d'un élément à semi-conducteur et un plot d'électrode d'un tableau de connexions se compose d'une pluralité de particules conductrices, chacune des particules étant obtenue en formant une couche métallique autour d'une partie centrale composée d'une première résine. Les couches métalliques en tant que couches les plus extérieures des particules conductrices sont fondues et associent les particules conductrices les unes aux autres, et les particules conductrices sont recouvertes et protégées par une seconde résine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009530009A JP5333220B2 (ja) | 2007-08-27 | 2008-05-12 | 半導体装置の実装構造及び半導体装置の実装方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-220010 | 2007-08-27 | ||
JP2007220010 | 2007-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009028239A1 true WO2009028239A1 (fr) | 2009-03-05 |
Family
ID=40386969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058720 WO2009028239A1 (fr) | 2007-08-27 | 2008-05-12 | Structure de montage de dispositif à semi-conducteur et procédé de montage de dispositif à semi-conducteur |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5333220B2 (fr) |
WO (1) | WO2009028239A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140335A1 (fr) * | 2009-06-01 | 2010-12-09 | 株式会社村田製作所 | Procédé pour la fabrication d'un substrat |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11812562B2 (en) * | 2021-08-30 | 2023-11-07 | International Business Machines Corporation | Creating a standoff for a low-profile component without adding a process step |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02280334A (ja) * | 1989-04-21 | 1990-11-16 | Citizen Watch Co Ltd | 半導体装置及びその製造方法 |
JPH05259166A (ja) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | デンドライトバンプ及びその作製方法 |
JP2000323511A (ja) * | 1999-05-12 | 2000-11-24 | Mitsui High Tec Inc | 面実装用接続部材 |
JP2004296806A (ja) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP2007201106A (ja) * | 2006-01-25 | 2007-08-09 | Fujitsu Ltd | 半導体素子接続バンプ及び半導体装置 |
-
2008
- 2008-05-12 WO PCT/JP2008/058720 patent/WO2009028239A1/fr active Application Filing
- 2008-05-12 JP JP2009530009A patent/JP5333220B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02280334A (ja) * | 1989-04-21 | 1990-11-16 | Citizen Watch Co Ltd | 半導体装置及びその製造方法 |
JPH05259166A (ja) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | デンドライトバンプ及びその作製方法 |
JP2000323511A (ja) * | 1999-05-12 | 2000-11-24 | Mitsui High Tec Inc | 面実装用接続部材 |
JP2004296806A (ja) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP2007201106A (ja) * | 2006-01-25 | 2007-08-09 | Fujitsu Ltd | 半導体素子接続バンプ及び半導体装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140335A1 (fr) * | 2009-06-01 | 2010-12-09 | 株式会社村田製作所 | Procédé pour la fabrication d'un substrat |
JP5182421B2 (ja) * | 2009-06-01 | 2013-04-17 | 株式会社村田製作所 | 基板の製造方法 |
US8794499B2 (en) | 2009-06-01 | 2014-08-05 | Murata Manufacturing Co., Ltd. | Method for manufacturing substrate |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009028239A1 (ja) | 2010-11-25 |
JP5333220B2 (ja) | 2013-11-06 |
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