WO2009028239A1 - Structure for mounting semiconductor device and method for mounting semiconductor device - Google Patents

Structure for mounting semiconductor device and method for mounting semiconductor device Download PDF

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Publication number
WO2009028239A1
WO2009028239A1 PCT/JP2008/058720 JP2008058720W WO2009028239A1 WO 2009028239 A1 WO2009028239 A1 WO 2009028239A1 JP 2008058720 W JP2008058720 W JP 2008058720W WO 2009028239 A1 WO2009028239 A1 WO 2009028239A1
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WO
WIPO (PCT)
Prior art keywords
conductive particles
semiconductor device
mounting semiconductor
resin
electrode pad
Prior art date
Application number
PCT/JP2008/058720
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Ouchi
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009530009A priority Critical patent/JP5333220B2/en
Publication of WO2009028239A1 publication Critical patent/WO2009028239A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

Disclosed are a structure and method for mounting a bare chip or a chip size package with high connection reliability. Specifically, a bump for electrically connecting an electrode pad of a semiconductor element and an electrode pad of a wiring board is composed of a plurality of conductive particles, each of which is obtained by forming a metal layer around a core portion which is composed of a first resin. The metal layers as the outermost layers of the conductive particles are melted and combine the conductive particles together, and the conductive particles are covered and protected by a second resin.
PCT/JP2008/058720 2007-08-27 2008-05-12 Structure for mounting semiconductor device and method for mounting semiconductor device WO2009028239A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009530009A JP5333220B2 (en) 2007-08-27 2008-05-12 Semiconductor device mounting structure and semiconductor device mounting method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007220010 2007-08-27
JP2007-220010 2007-08-27

Publications (1)

Publication Number Publication Date
WO2009028239A1 true WO2009028239A1 (en) 2009-03-05

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WO (1) WO2009028239A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140335A1 (en) * 2009-06-01 2010-12-09 株式会社村田製作所 Method for manufacturing a substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11812562B2 (en) * 2021-08-30 2023-11-07 International Business Machines Corporation Creating a standoff for a low-profile component without adding a process step

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02280334A (en) * 1989-04-21 1990-11-16 Citizen Watch Co Ltd Semiconductor device and manufacture thereof
JPH05259166A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Dendrite bump and its manufacturing method
JP2000323511A (en) * 1999-05-12 2000-11-24 Mitsui High Tec Inc Bonding member for surface mounting
JP2004296806A (en) * 2003-03-27 2004-10-21 Seiko Epson Corp Semiconductor device and its manufacturing process
JP2007201106A (en) * 2006-01-25 2007-08-09 Fujitsu Ltd Semiconductor element connection bump and semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02280334A (en) * 1989-04-21 1990-11-16 Citizen Watch Co Ltd Semiconductor device and manufacture thereof
JPH05259166A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Dendrite bump and its manufacturing method
JP2000323511A (en) * 1999-05-12 2000-11-24 Mitsui High Tec Inc Bonding member for surface mounting
JP2004296806A (en) * 2003-03-27 2004-10-21 Seiko Epson Corp Semiconductor device and its manufacturing process
JP2007201106A (en) * 2006-01-25 2007-08-09 Fujitsu Ltd Semiconductor element connection bump and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140335A1 (en) * 2009-06-01 2010-12-09 株式会社村田製作所 Method for manufacturing a substrate
JP5182421B2 (en) * 2009-06-01 2013-04-17 株式会社村田製作所 Substrate manufacturing method
US8794499B2 (en) 2009-06-01 2014-08-05 Murata Manufacturing Co., Ltd. Method for manufacturing substrate

Also Published As

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JPWO2009028239A1 (en) 2010-11-25
JP5333220B2 (en) 2013-11-06

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