WO2009027459A2 - Sonnensensor zur erfassung der einfallsrichtung und der intensität von sonnenstrahlung - Google Patents
Sonnensensor zur erfassung der einfallsrichtung und der intensität von sonnenstrahlung Download PDFInfo
- Publication number
- WO2009027459A2 WO2009027459A2 PCT/EP2008/061293 EP2008061293W WO2009027459A2 WO 2009027459 A2 WO2009027459 A2 WO 2009027459A2 EP 2008061293 W EP2008061293 W EP 2008061293W WO 2009027459 A2 WO2009027459 A2 WO 2009027459A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensors
- solar radiation
- housing
- sensor
- sun
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 58
- 238000001514 detection method Methods 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000004033 plastic Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920004142 LEXAN™ Polymers 0.000 description 3
- 239000004418 Lexan Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 101100390736 Danio rerio fign gene Proteins 0.000 description 2
- 101100390738 Mus musculus Fign gene Proteins 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02024—Position sensitive and lateral effect photodetectors; Quadrant photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4228—Photometry, e.g. photographic exposure meter using electric radiation detectors arrangements with two or more detectors, e.g. for sensitivity compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S3/00—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received
- G01S3/78—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received using electromagnetic waves other than radio waves
- G01S3/781—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S3/00—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received
- G01S3/78—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received using electromagnetic waves other than radio waves
- G01S3/782—Systems for determining direction or deviation from predetermined direction
- G01S3/783—Systems for determining direction or deviation from predetermined direction using amplitude comparison of signals derived from static detectors or detector systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J2001/4266—Photometry, e.g. photographic exposure meter using electric radiation detectors for measuring solar light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- Sun sensor for detecting the direction of incidence and the intensity of solar radiation
- the invention relates to a Son ⁇ ensensor for detecting the direction of incidence and the intensity of solar radiation.
- a possible application for a sun sensor is a car air conditioner, in which the heating of the vehicle interior should be detected as a result of the sun for compensation purposes,
- the object of the invention is to provide a sun sensor for detecting the direction of incidence and the intensity of solar radiation, via a simplified Ko ⁇ strutechnischshus and economically producible and cost-mountable sensor elements has.
- the invention proposes a sun sensor for detecting the direction of incidence and the intensity of solar radiation, wherein the sun sensor is provided with a housing made of a plastic material permeable to at least part of the solar radiation, wherein the housing has a domed solar radiation incidence side and the housing optically acts as a lens and has an internal focal plane defined by its lens characteristic, and at least two photosensors embedded in the plastic material of the housing, the photosensors each having at least a portion of the solar radiation for which the plastic material is permeable , sensitive sensor surfaces and the sensor surfaces of the photosensors are arranged in substantially a common plane which, viewed from the sun radiation Einfalisseite before or behind the focal plane (and substantially parallel the incident direction of the solar radiation can be determined on the basis of the intensities of the solar radiation received by the sensor surfaces of the photosensors.
- At least two photosensors are embedded in a plastic mass of a housing.
- This case may be, for example, a case similar to that known from leaded photodiodes (THT technology).
- TCT technology leaded photodiodes
- the used plastic material is permeable to at least a portion of the sun's radiation (eg, IR content).
- the housing has a sun radiation exposable, curved, ie spherical solar radiation incident side.
- the housing acts optically as a lens whose characteristic defines a focal plane, which is disposed within the housing and within which the focal point of the incident solar radiation is located or - moves depending on the direction Einsein.
- This focal plane is substantially perpendicular to the optical axis of the sun sensor.
- Each photosensor of the sun sensor according to the invention has a sensor surface which is sensitive to that part of the solar radiation for which the plastic material of the housing is permeable.
- the sensor surfaces of the at least two photosensors essentially lie in a common plane, which in turn is arranged outside the focal plane, that is to say when the solar radiation incidence side of the housing is viewed in front of or behind the focal plane.
- the arrangement of the sensor surfaces of the photosensors is such that the optical axis is centered thereto.
- each photosensor receives differently large solar radiation intensities depending on the direction of the infeed of the solar radiation. From the combination of the individual signals of the photosensors, it is then possible to deduce the direction of incidence of the solar radiation. Furthermore, information about the intensity of the solar radiation results.
- An essential feature of the solar sensor according to the invention is that all the photosensors are arranged substantially planar in a common (standard) housing, wherein they are specifically embedded in plastic material, as is known from commercially available light-emitting diodes and photodiodes ago.
- the arrangement of the photosensors outside the focal plane has the advantage that at different angles of incidence of the radiation to the optical axis of the sun sensor (Lot to the housing surface) as large a proportion of the radiation impinges on the sensor surfaces of the photosensors, the solar radiation but a - depending on the angle of incidence - Different irradiation of the individual photosensors result.
- at least two photosensors are required. However, it is expedient to provide three or more photosensors.
- photosensors In the case of three photosensors, these are arranged in such a way that their sensor surfaces are rotated by 120 ° relative to one another and staggered. In four photosensors their sensor surfaces are arranged in the manner of a matrix in a rectangular shape. If more than four photosensors are present, they are arranged such that their sensor surfaces define an overall area with an outer contour of a (possibly equilateral) polygon.
- Vorteiihaft represent the (semiconductor) photosensors are arranged and / or formed on a common substrate, wherein the photosensors are designed as photodiodes or IR sensors.
- a common (Halbieiter-) substrate d, h., By the joint production of the photosensors), a calibration or calibration of the photosensors is not required.
- electrical connection elements project out of the housing and are electrically connected to the photosensors, wherein the connection elements are designed as connection elements of a plug.
- the sun sensor according to the invention neither additional optical fibers, nor diffuser elements, nor Lexan caps are required. Also, it is not necessary to perform a Einmessvorgang the photosensors to each other.
- Another advantage of the solar sensor according to the invention is that all functional elements are integrated into a photo-optical component and thus the entire desired optical properties of the (2D / 3D) solar sensor only by the component itself - without additional additional structural components - are generated.
- the features or advantages of the solar sensor according to the invention can be listed as follows: At least two photosensitive sensors (photosensors) arranged in a common housing are arranged in a planar manner and used to detect the solar radiation, resulting in a single integral component. -
- the optically transparent housing can contain filter and diffuser materials that allow selective detection of the solar radiation with regard to the wavelength (filter) and also a homogenization of the incident radiation (diffuser). With three photosensors, these are positioned in a 120 ° arrangement.
- the photosensors are positioned in a 90 ° arrangement in the form of a square when four photosensors are provided. With more than four sensors, these are arranged in the form of an equilateral polygon corresponding to the number of photosensors.
- the photosensors are arranged on a leadframe (connection elements) or another support structure which makes it possible to pick up the electrical signals at the individual photosensors; the leadframe can immediately have the function of a plug, with which the component can be electrically connected to an electronics.
- the leadframe in THT or SMD technology can be electrically connected to an external circuit board by standard soldering techniques for signal utilization.
- the housing is made of standard plastic materials as they are known per se for optical components (eg daylight barrier character- istics).
- the housing can be manufactured using standard optical component manufacturing techniques.
- the housing ensures that the incident solar intensity and also the direction of irradiation of the sun at the location of the solar sensor can be determined from the geometric configuration of the solar sensor.
- the ratio of direct solar radiation to indirect (diffuser) solar radiation can be determined.
- FIGS. 1 and 2 are a side and a plan view of a sun sensor with two photosensors according to a first embodiment of the invention
- FIGS. 3 and 4 are side and top views of a sun sensor having three photosensors according to a first embodiment of the invention.
- FIGS. 5 and 6 are a side and a plan view of a sun sensor with four photosensors according to a first embodiment of the invention
- the sun sensor 10 has a (solid material) housing 12 made of a plastic material, which is transparent to IR radiation in this embodiment and the daylight substantially blocks.
- the solar radiation exposable incident side 14 of the housing 12 is curved or spherically formed and has a shape that gives the housing 12 in this area a lens characteristic,
- FIGS. 1 and 2 Another embodiment of a sun sensor 10 "is shown in Figures 5 and 6.
- those elements of the sun sensor 10" which correspond to the elements of the sun sensor 10 of FIGS. 1 and 2 are the same, identical or identical to these, are provided with the same reference numerals.
- the sun sensor 10 In contrast to the sun sensors 10 and 10 ', the sun sensor 10 "has four photosensors 16 arranged in a rectangle, each of which is connected to a different connection element via a bonding wire 22.
- the mode of operation of the sun sensors described here is based on the idea of placing a plurality of photodiodes in a standard housing for optical sensors in such a way that they respond to the incident solar radiation in different but in combination of the unique, unique manner. From the individual signals can then in a calculation method that in a Mtkrocontroller (not shown) directly in the sun sensor or implemented in a separate electronics, the Einfalisraum the solar radiation and their intensity are built.
- the photodiodes 16 are arranged planar in the common plane 19, wherein two, three, four or more photodiodes can be used.
- Possible geometric arrangements in the plane are an equilateral triangle in the case of three sensors and the arrangement in square or in the case of four sensors.
- Cross-section is an arrangement of four sensors to be preferred because these four sensors can then be arranged and fabricated contiguously on a single substrate.
- the different irradiation of the individual photodiodes as a function of the angle of incidence of the solar radiation is produced by the lens characteristic of the optically acting as a lens housing 12 from transparent to the radiation of interest material (plastic material), which may be enriched with filter or diffuser materials.
- the lens characteristic is achieved by a curvature (for example spherical formation) of the housing surface at its entry surface 14, wherein the radius of the curvature is to be selected as a function of the vertical and horizontal photosensor position and in dependence on the size of the sensor surfaces 18.
- the sensor surfaces 18 of the photosensors 16 are not in the plane of the focus (see plane 26 in Figures 1, 3 and 5) of the incident solar radiation over the incident side 14, but longitudinally the optical axis 28 (see also Figures 1, 3 and 5) before or after the focal plane 26 is located. This ensures that at different angles of incidence of the solar radiation to the solder (optical axis 28) of the housing surface as large a proportion of solar radiation hits the sensor surfaces 18 of all photodiodes 16, the solar radiation but still a - depending on from the angle of incidence! - Has different degrees of irradiation of the individual photodiodes result.
- Kunststoffmateriais and the position of the individual photodiodes 16 within the housing 12 (horizontal and vertical arrangement and position and size of the photodiodes 16 and their sensor surfaces 18 to each other and centric course of the optical axis 28 to the arrangement and location of the sensor surfaces
- the sensor surfaces 18 of the individual photodiodes 16 have a very low to ideally no sensitivity tolerance if, due to the manufacturing method, the photodiodes 16 are manufactured from the same substrate. For this reason, tolerances of the photodiodes 16 among each other are negligible. This means that the outlay for the adjustment of the photodiodes 16, which can differ from each other with respect to their sensitivity by up to 20% in the case of conventional sun sensors, can be significantly reduced or completely eliminated. LIST OF REFERENCE NUMBERS
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Air-Conditioning For Vehicles (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/674,370 US8785858B2 (en) | 2007-08-29 | 2008-08-28 | Solar sensor for the detection of the direction of incidence and the intensity of solar radiation |
EP08803319A EP2181313A2 (de) | 2007-08-29 | 2008-08-28 | Sonnensensor zur erfassung der einfallsrichtung und der intensität von sonnenstrahlung |
JP2010522369A JP2010537214A (ja) | 2007-08-29 | 2008-08-28 | 太陽輻射の入射方向及び強度を検出するための太陽センサ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007041002.8 | 2007-08-29 | ||
DE102007041002 | 2007-08-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009027459A2 true WO2009027459A2 (de) | 2009-03-05 |
WO2009027459A3 WO2009027459A3 (de) | 2009-05-28 |
Family
ID=40377492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/061293 WO2009027459A2 (de) | 2007-08-29 | 2008-08-28 | Sonnensensor zur erfassung der einfallsrichtung und der intensität von sonnenstrahlung |
Country Status (5)
Country | Link |
---|---|
US (1) | US8785858B2 (de) |
EP (1) | EP2181313A2 (de) |
JP (1) | JP2010537214A (de) |
KR (1) | KR20100049677A (de) |
WO (1) | WO2009027459A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2469282C1 (ru) * | 2011-06-02 | 2012-12-10 | Учреждение Российской академии наук Институт мониторинга климатических и экологических систем Сибирского отделения Российской академии наук (ИМКЭС СО РАН) | Актинометрический приемник болометрического типа |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202009001069U1 (de) * | 2009-01-28 | 2009-04-09 | Visteon Global Technologies Inc., Van Buren | Sensor zur Ermittlung der Temperatur im Innenraum eines Kraftfahrzeugs, Klimabedienteil für eine Kfz-Klimanlage und Vorrichtung zur Ermittlung der Temperatur in einem Kfz |
DE102015221970A1 (de) | 2015-11-09 | 2017-05-11 | Bayerische Motoren Werke Aktiengesellschaft | Projektionsvorrichtung für ein Kraftfahrzeug |
DE102018001181B3 (de) | 2018-02-15 | 2019-07-11 | Azur Space Solar Power Gmbh | Sonnenstandssensor |
EP3537118B1 (de) * | 2018-03-08 | 2024-04-03 | MEAS France | Strahlungssensor, fahrzeugsensoranordnung und montageverfahren |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04231808A (ja) | 1990-12-28 | 1992-08-20 | Sharp Corp | 傾き角検出器 |
DE10102353A1 (de) | 2001-01-19 | 2002-08-01 | Osram Opto Semiconductors Gmbh | LED-Signalmodul |
JP2002296107A (ja) | 2001-03-30 | 2002-10-09 | Stanley Electric Co Ltd | 日照センサ |
EP1460448A2 (de) | 2003-03-19 | 2004-09-22 | Behr-Hella Thermocontrol GmbH | Vorrichtung zum Erfassen des Standes einer Lichtquelle, Verfahren zum Abgleichen der Vorrichtung und Verfahren zum Erfassen des Standes einer Lichtquelle |
DE102004053958B3 (de) | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58192366A (ja) | 1982-05-07 | 1983-11-09 | Hitachi Ltd | 受光素子内蔵集積回路装置 |
DE4041770C1 (de) | 1990-12-24 | 1992-07-16 | Hella Kg Hueck & Co, 4780 Lippstadt, De | |
JPH06201459A (ja) * | 1992-11-09 | 1994-07-19 | Omron Corp | 日射センサー |
JP2827763B2 (ja) | 1992-11-16 | 1998-11-25 | 松下電器産業株式会社 | 自動車用空調装置の日射センサ |
JPH07103818A (ja) * | 1993-09-30 | 1995-04-21 | Matsushita Electric Works Ltd | 方向検出方法及びその検出方法を使用した方向検出装置 |
US5400964A (en) * | 1993-11-29 | 1995-03-28 | Delco Electronics Corporation | Infra-red comfort sensor |
FR2726080B1 (fr) * | 1994-10-25 | 1997-01-10 | Electricfil | Capteur optoelectronique pour mesurer l'intensite et la direction d'incidence d'un faisceau lumineux |
JPH09243354A (ja) * | 1996-03-12 | 1997-09-19 | N K K Plant Kensetsu Kk | 太陽位置検出センサー |
JPH09311070A (ja) | 1996-05-23 | 1997-12-02 | Matsushita Electric Ind Co Ltd | 車輌用日射センサ |
US6521882B1 (en) | 1998-03-27 | 2003-02-18 | Denso Corporation | Optical sensor with directivity controlled |
JP3882378B2 (ja) | 1998-03-27 | 2007-02-14 | 株式会社デンソー | 光センサ |
KR100457972B1 (ko) | 2002-07-09 | 2004-11-18 | 주식회사 오토전자 | 차량용 광센서 |
US7718948B2 (en) * | 2006-12-04 | 2010-05-18 | Palo Alto Research Center Incorporated | Monitoring light pulses |
-
2008
- 2008-08-28 KR KR1020107006883A patent/KR20100049677A/ko not_active Application Discontinuation
- 2008-08-28 EP EP08803319A patent/EP2181313A2/de not_active Withdrawn
- 2008-08-28 US US12/674,370 patent/US8785858B2/en active Active
- 2008-08-28 JP JP2010522369A patent/JP2010537214A/ja active Pending
- 2008-08-28 WO PCT/EP2008/061293 patent/WO2009027459A2/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04231808A (ja) | 1990-12-28 | 1992-08-20 | Sharp Corp | 傾き角検出器 |
DE10102353A1 (de) | 2001-01-19 | 2002-08-01 | Osram Opto Semiconductors Gmbh | LED-Signalmodul |
JP2002296107A (ja) | 2001-03-30 | 2002-10-09 | Stanley Electric Co Ltd | 日照センサ |
EP1460448A2 (de) | 2003-03-19 | 2004-09-22 | Behr-Hella Thermocontrol GmbH | Vorrichtung zum Erfassen des Standes einer Lichtquelle, Verfahren zum Abgleichen der Vorrichtung und Verfahren zum Erfassen des Standes einer Lichtquelle |
DE102004053958B3 (de) | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2469282C1 (ru) * | 2011-06-02 | 2012-12-10 | Учреждение Российской академии наук Институт мониторинга климатических и экологических систем Сибирского отделения Российской академии наук (ИМКЭС СО РАН) | Актинометрический приемник болометрического типа |
Also Published As
Publication number | Publication date |
---|---|
US8785858B2 (en) | 2014-07-22 |
US20110240862A1 (en) | 2011-10-06 |
KR20100049677A (ko) | 2010-05-12 |
JP2010537214A (ja) | 2010-12-02 |
EP2181313A2 (de) | 2010-05-05 |
WO2009027459A3 (de) | 2009-05-28 |
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