WO2009019966A1 - 三次元計測装置及び基板検査機 - Google Patents

三次元計測装置及び基板検査機 Download PDF

Info

Publication number
WO2009019966A1
WO2009019966A1 PCT/JP2008/062985 JP2008062985W WO2009019966A1 WO 2009019966 A1 WO2009019966 A1 WO 2009019966A1 JP 2008062985 W JP2008062985 W JP 2008062985W WO 2009019966 A1 WO2009019966 A1 WO 2009019966A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging
measured
inspecting machine
dimensional measurement
board inspecting
Prior art date
Application number
PCT/JP2008/062985
Other languages
English (en)
French (fr)
Inventor
Takahiro Mamiya
Original Assignee
Ckd Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corporation filed Critical Ckd Corporation
Priority to US12/669,433 priority Critical patent/US8436890B2/en
Priority to CN2008801015952A priority patent/CN101889190B/zh
Priority to KR1020097023245A priority patent/KR101152842B1/ko
Priority to DE112008002148.1T priority patent/DE112008002148B4/de
Publication of WO2009019966A1 publication Critical patent/WO2009019966A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

　測定可能な高さレンジを大きくでき、かつ、高精度な計測を実現することができるとともに、撮像回数を最小限に抑制することができ、ひいては、計測（或いは検査）効率の向上を実現することのできる三次元計測装置及び基板検査機を提供する。基板検査機１はクリームハンダの印刷されたプリント基板Ｋを載置するためのコンベア２と、斜め上方から所定の光パターンを照射する照射手段３と、前記照射された領域を撮像するＣＣＤカメラ４と、制御装置７とを備える。位相シフト法により計測対象部の高さが計測されるのであるが、これに先だって、空間コード化法によって、計測対象部に対応する縞に相当する空間コード番号が特定される。また、予めライブラリデータが読み込まれ、計測対象部のおおよその高さに基づいて空間コード化法用の撮像回数が決定される。最小限の撮像回数で精度の高い三次元計測を実現できる。
PCT/JP2008/062985 2007-08-08 2008-07-18 三次元計測装置及び基板検査機 WO2009019966A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/669,433 US8436890B2 (en) 2007-08-08 2008-07-18 Three-dimensional measuring device and board inspection device
CN2008801015952A CN101889190B (zh) 2007-08-08 2008-07-18 三维测量装置和基板检查机
KR1020097023245A KR101152842B1 (ko) 2007-08-08 2008-07-18 삼차원 계측 장치 및 기판 검사기
DE112008002148.1T DE112008002148B4 (de) 2007-08-08 2008-07-18 Verfahren zum dreidimensionalen Messen der Höhe eines Objektteils

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-206112 2007-08-08
JP2007206112A JP4931728B2 (ja) 2007-08-08 2007-08-08 三次元計測装置及び基板検査機

Publications (1)

Publication Number Publication Date
WO2009019966A1 true WO2009019966A1 (ja) 2009-02-12

Family

ID=40341203

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062985 WO2009019966A1 (ja) 2007-08-08 2008-07-18 三次元計測装置及び基板検査機

Country Status (7)

Country Link
US (1) US8436890B2 (ja)
JP (1) JP4931728B2 (ja)
KR (1) KR101152842B1 (ja)
CN (1) CN101889190B (ja)
DE (1) DE112008002148B4 (ja)
TW (1) TWI384194B (ja)
WO (1) WO2009019966A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002152A1 (en) * 2010-06-29 2012-01-05 Canon Kabushiki Kaisha Three-dimensional measurement apparatus, three-dimensional measurement method, and storage medium
CN102322823A (zh) * 2011-09-13 2012-01-18 四川大学 基于相位级次自编码的光学三维测量方法

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112012026605B1 (pt) * 2010-05-18 2020-03-24 Nippon Steel Corporation Método para medir a planura de material em folha e método para manufaturar a folha de aço ao utilizar o mesmo
JP5443303B2 (ja) * 2010-09-03 2014-03-19 株式会社サキコーポレーション 外観検査装置及び外観検査方法
US9007602B2 (en) * 2010-10-12 2015-04-14 Canon Kabushiki Kaisha Three-dimensional measurement apparatus, three-dimensional measurement method, and computer-readable medium storing control program
JP5611022B2 (ja) * 2010-12-20 2014-10-22 キヤノン株式会社 三次元計測装置及び三次元計測方法
JP5822463B2 (ja) 2010-12-28 2015-11-24 キヤノン株式会社 三次元計測装置、三次元計測方法、およびプログラム
US20120176478A1 (en) * 2011-01-11 2012-07-12 Sen Wang Forming range maps using periodic illumination patterns
US8447099B2 (en) 2011-01-11 2013-05-21 Eastman Kodak Company Forming 3D models using two images
US8452081B2 (en) 2011-01-11 2013-05-28 Eastman Kodak Company Forming 3D models using multiple images
JP5683002B2 (ja) * 2011-02-01 2015-03-11 Ｊｕｋｉオートメーションシステムズ株式会社 ３次元測定装置、３次元測定方法及びプログラム
US9069175B2 (en) 2011-04-08 2015-06-30 Kairos Instruments, Llc Adaptive phase contrast microscope
JP6170281B2 (ja) * 2011-05-10 2017-07-26 キヤノン株式会社 三次元計測装置、三次元計測装置の制御方法、およびプログラム
US9982995B2 (en) * 2011-05-24 2018-05-29 Koninklijke Philips N.V. 3D scanner using structured lighting
JP5430612B2 (ja) * 2011-05-31 2014-03-05 Ｃｋｄ株式会社 三次元計測装置
US8611642B2 (en) 2011-11-17 2013-12-17 Apple Inc. Forming a steroscopic image using range map
US9041819B2 (en) 2011-11-17 2015-05-26 Apple Inc. Method for stabilizing a digital video
JP5709009B2 (ja) * 2011-11-17 2015-04-30 Ckd株式会社 三次元計測装置
JP5918984B2 (ja) * 2011-12-06 2016-05-18 キヤノン株式会社 情報処理装置、情報処理装置の制御方法、およびプログラム
JP5643241B2 (ja) * 2012-02-14 2014-12-17 Ckd株式会社 三次元計測装置
JP5995484B2 (ja) 2012-03-30 2016-09-21 キヤノン株式会社 三次元形状測定装置、三次元形状測定方法、及びプログラム
JP5994419B2 (ja) * 2012-06-21 2016-09-21 富士通株式会社 検査方法及び検査装置
US9074886B2 (en) 2012-07-09 2015-07-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Line-width measurement device and measurement method using the same
CN102768017B (zh) * 2012-07-09 2014-06-25 深圳市华星光电技术有限公司 线宽量测装置及其方法
US8994943B2 (en) * 2012-11-30 2015-03-31 Infineon Technologies Ag Selectivity by polarization
FI125913B (en) * 2013-03-25 2016-04-15 Mikkelin Ammattikorkeakoulu Oy A state-defining object for computer-aided design
JP6334861B2 (ja) * 2013-07-16 2018-05-30 株式会社キーエンス 外観検査装置、外観検査方法及び外観検査プログラム並びにコンピュータで読み取り可能な記録媒体
US9459094B2 (en) 2013-09-12 2016-10-04 Hong Kong Applied Science and Technology Research Institute Company Limited Color-encoded fringe pattern for three-dimensional shape measurement
JP6420572B2 (ja) * 2014-06-13 2018-11-07 キヤノン株式会社 計測装置およびその方法
DE102015109721B3 (de) * 2015-06-17 2016-09-15 DAVID 3D Solutions GbR (vertret. Gesellsch. Herr Dr. Simon Winkelbach, 38116 Braunschweig) Streifenprojektionsverfahren, Streifenprojektionsvorrichtung und Computerprogrammprodukt
KR101602377B1 (ko) * 2015-08-13 2016-03-15 주식회사 이오비스 3차원 형상 측정 방법
JP6259806B2 (ja) * 2015-12-24 2018-01-10 Ckd株式会社 三次元計測装置
CN106091981B (zh) * 2016-05-27 2018-09-04 西安交通大学 用于高动态范围物体的区域投影光学三维轮廓测量方法
TWI758383B (zh) * 2017-07-19 2022-03-21 日商日本電產理德股份有限公司 攝影裝置、凸塊檢查裝置以及攝影方法
JP6557319B2 (ja) * 2017-12-25 2019-08-07 株式会社キーエンス 三次元画像処理装置、三次元画像処理装置用ヘッド部、三次元画像処理方法、三次元画像処理プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器
JP7040147B2 (ja) 2018-03-09 2022-03-23 セイコーエプソン株式会社 制御装置、ロボット、ロボットシステム，及び、物体を認識する方法
CN110400152A (zh) * 2018-04-17 2019-11-01 鹏鼎控股(深圳)股份有限公司 用于印刷电路板的品质追溯系统
JP6571831B2 (ja) * 2018-04-26 2019-09-04 株式会社キーエンス 外観検査装置
JP6571830B2 (ja) * 2018-04-26 2019-09-04 株式会社キーエンス 外観検査装置
JP7000380B2 (ja) * 2019-05-29 2022-01-19 Ckd株式会社 三次元計測装置及び三次元計測方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454208A (en) * 1987-08-25 1989-03-01 O G Joho Syst Kk Shape detecting method
JPH05332737A (ja) * 1991-03-15 1993-12-14 Yukio Sato 形状計測装置
JPH11148810A (ja) * 1997-09-09 1999-06-02 Ckd Corp 形状計測装置
JP2001243468A (ja) * 1999-12-24 2001-09-07 Sanyo Electric Co Ltd 三次元モデリング装置、方法及び媒体並びに三次形状データ記録装置、方法及び媒体
JP2005003409A (ja) * 2003-06-10 2005-01-06 Kokan Keisoku Kk ３次元曲面形状の測定装置及び測定方法
JP2005091176A (ja) * 2003-09-17 2005-04-07 Ricoh Co Ltd 光学的形状計測装置
JP2006177781A (ja) * 2004-12-22 2006-07-06 Matsushita Electric Works Ltd ３次元形状計測方法並びに３次元形状計測装置、３次元形状計測用プログラム
JP2007192608A (ja) * 2006-01-18 2007-08-02 Roland Dg Corp 三次元形状の測定方法およびその装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03295405A (ja) * 1990-04-12 1991-12-26 Fanuc Ltd ３次元位置及び姿勢の計測方法
IT1296825B1 (it) * 1997-12-02 1999-08-02 Uni Degli Studi Brescia Procedimento per la misura di profili a tre dimensioni mediante proiezione di luce strutturata
JP3922784B2 (ja) 1998-01-27 2007-05-30 松下電工株式会社 ３次元形状計測装置
JP2000292134A (ja) * 1999-04-07 2000-10-20 Minolta Co Ltd ３次元情報入力カメラ
US6750899B1 (en) * 2000-01-07 2004-06-15 Cyberoptics Corporation Solder paste inspection system
JP2002081924A (ja) 2000-07-05 2002-03-22 Ckd Corp 三次元計測装置
JP2002081942A (ja) 2000-09-06 2002-03-22 Kenwood Corp ナビゲーション装置
JP2002164066A (ja) * 2000-11-22 2002-06-07 Mitsubishi Heavy Ind Ltd 積層型熱交換器
WO2007061632A2 (en) * 2005-11-09 2007-05-31 Geometric Informatics, Inc. Method and apparatus for absolute-coordinate three-dimensional surface imaging

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454208A (en) * 1987-08-25 1989-03-01 O G Joho Syst Kk Shape detecting method
JPH05332737A (ja) * 1991-03-15 1993-12-14 Yukio Sato 形状計測装置
JPH11148810A (ja) * 1997-09-09 1999-06-02 Ckd Corp 形状計測装置
JP2001243468A (ja) * 1999-12-24 2001-09-07 Sanyo Electric Co Ltd 三次元モデリング装置、方法及び媒体並びに三次形状データ記録装置、方法及び媒体
JP2005003409A (ja) * 2003-06-10 2005-01-06 Kokan Keisoku Kk ３次元曲面形状の測定装置及び測定方法
JP2005091176A (ja) * 2003-09-17 2005-04-07 Ricoh Co Ltd 光学的形状計測装置
JP2006177781A (ja) * 2004-12-22 2006-07-06 Matsushita Electric Works Ltd ３次元形状計測方法並びに３次元形状計測装置、３次元形状計測用プログラム
JP2007192608A (ja) * 2006-01-18 2007-08-02 Roland Dg Corp 三次元形状の測定方法およびその装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002152A1 (en) * 2010-06-29 2012-01-05 Canon Kabushiki Kaisha Three-dimensional measurement apparatus, three-dimensional measurement method, and storage medium
JP2012013453A (ja) * 2010-06-29 2012-01-19 Canon Inc 三次元計測装置、三次元計測方法、及びプログラム
KR101461068B1 (ko) * 2010-06-29 2014-11-13 캐논 가부시끼가이샤 삼차원 계측장치, 삼차원 계측방법 및 기억매체
US8970853B2 (en) 2010-06-29 2015-03-03 Canon Kabushiki Kaisha Three-dimensional measurement apparatus, three-dimensional measurement method, and storage medium
EP2889575A1 (en) * 2010-06-29 2015-07-01 Canon Kabushiki Kaisha Three-dimensional measurement apparatus, three-dimensional measurement method, and storage medium
CN102322823A (zh) * 2011-09-13 2012-01-18 四川大学 基于相位级次自编码的光学三维测量方法

Also Published As

Publication number Publication date
TWI384194B (zh) 2013-02-01
DE112008002148T5 (de) 2010-06-17
KR101152842B1 (ko) 2012-06-12
CN101889190B (zh) 2012-10-17
JP2009042015A (ja) 2009-02-26
JP4931728B2 (ja) 2012-05-16
DE112008002148B4 (de) 2016-01-21
US20100194855A1 (en) 2010-08-05
TW200916719A (en) 2009-04-16
KR20100051589A (ko) 2010-05-17
US8436890B2 (en) 2013-05-07
CN101889190A (zh) 2010-11-17

Similar Documents

Publication Publication Date Title
WO2009019966A1 (ja) 三次元計測装置及び基板検査機
CN101782375B (zh) 三维测量装置
US7019848B2 (en) Three-dimensional measuring instrument, filter striped plate, and illuminating means
JP2006053147A5 (ja)
KR101158323B1 (ko) 기판 검사방법
TW200519349A (en) Three dimensional measuring device
US9885669B2 (en) Method of inspecting a substrate
EP2685242B1 (en) Vision testing device with enhanced image clarity
US20100208062A1 (en) Method and device for exact measurement of objects
KR101196219B1 (ko) 3차원 형상 측정장치의 높이 측정방법 및 이를 이용한 3차원 형상 측정장치
TW200745505A (en) Method and system for measuring the shape of a reflective surface
CN103123255A (zh) 三维测量装置
KR20130137660A (ko) 삼차원 계측 장치
KR20110086222A (ko) 3차원 형상 측정장치
MX2017008749A (es) Aparato de medicion tridimensional.
JP6292825B2 (ja) 基板処理装置
CN106465580B (zh) 元件数据生成装置、表面安装机及元件数据生成方法
JP6097389B2 (ja) 検査装置および検査方法
JP6198312B2 (ja) ３次元測定装置、３次元測定方法および基板の製造方法
CN102628678B (zh) 三维测量装置、三维测量方法
KR101405427B1 (ko) 단일주기격자를 이용한 멀티 모아레 비전검사장치
CN108605432A (zh) 表面安装机、识别误差校正方法
CN106767437B (zh) Pcb元器件在线3d尺寸测量装置及方法
US10659699B2 (en) Apparatus and method for reconstructing a three-dimensional profile of a target surface
KR20090120383A (ko) 표면형상 측정장치

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880101595.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08778277

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097023245

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12669433

Country of ref document: US

RET De translation (de og part 6b)

Ref document number: 112008002148

Country of ref document: DE

Date of ref document: 20100617

Kind code of ref document: P

122 Ep: pct application non-entry in european phase

Ref document number: 08778277

Country of ref document: EP

Kind code of ref document: A1