WO2009019931A1 - 光学部品用封止材及び発光装置 - Google Patents

光学部品用封止材及び発光装置 Download PDF

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Publication number
WO2009019931A1
WO2009019931A1 PCT/JP2008/060540 JP2008060540W WO2009019931A1 WO 2009019931 A1 WO2009019931 A1 WO 2009019931A1 JP 2008060540 W JP2008060540 W JP 2008060540W WO 2009019931 A1 WO2009019931 A1 WO 2009019931A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting device
sealing material
optical component
polymer
Prior art date
Application number
PCT/JP2008/060540
Other languages
English (en)
French (fr)
Inventor
Kouki Hatsuda
Hiroshi Samukawa
Katsuhiko Komuro
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to US12/440,503 priority Critical patent/US8076437B2/en
Priority to CN2008800008063A priority patent/CN101547959B/zh
Publication of WO2009019931A1 publication Critical patent/WO2009019931A1/ja
Priority to HK10101499.2A priority patent/HK1135123A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　光取り出し効率が高いポリマーからなる封止材を用いた発光装置を提供する。本実施の形態における発光装置は、発光素子と、上記発光素子が封止された封止部とを備え、上記封止部は、下記式（１）で表される１種又は２種以上の構成単位を有し、屈折率が１．５５以上の重合体からなる。式（１）において、Ｒは、水素原子、アルキル基、又はフェニル基であり、Ｙは、炭素数１乃至６のアルキル基又は炭素数１乃至６のアルキルオキシ基であり、Ｚは、所定の条件を満たす芳香族化合物である。 【化１】
PCT/JP2008/060540 2007-08-07 2008-06-09 光学部品用封止材及び発光装置 WO2009019931A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/440,503 US8076437B2 (en) 2007-08-07 2008-06-09 Encapsulant material for optical component and light-emitting device
CN2008800008063A CN101547959B (zh) 2007-08-07 2008-06-09 光学元件用密封材料及发光装置
HK10101499.2A HK1135123A1 (en) 2007-08-07 2010-02-10 Sealing material for optical component and light-emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007205939A JP5318383B2 (ja) 2007-08-07 2007-08-07 光学部品封止材及び発光装置
JP2007-205939 2007-08-07

Publications (1)

Publication Number Publication Date
WO2009019931A1 true WO2009019931A1 (ja) 2009-02-12

Family

ID=40341167

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060540 WO2009019931A1 (ja) 2007-08-07 2008-06-09 光学部品用封止材及び発光装置

Country Status (5)

Country Link
US (1) US8076437B2 (ja)
JP (1) JP5318383B2 (ja)
CN (1) CN101547959B (ja)
HK (1) HK1135123A1 (ja)
WO (1) WO2009019931A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012529186A (ja) * 2009-06-05 2012-11-15 ダウ コーニング コーポレーション 個別要素の光学特性を調整することによる光電池モジュールの製造方法
JP5421799B2 (ja) * 2010-01-18 2014-02-19 パナソニック株式会社 Ｌｅｄユニット
DE102010024545B4 (de) 2010-06-22 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
EP2587560A1 (en) * 2011-10-26 2013-05-01 Forschungsverbund Berlin e.V. Light emitting diode
JP6293555B2 (ja) * 2014-03-31 2018-03-14 愛知時計電機株式会社 受信器
JP6628473B2 (ja) * 2014-12-26 2020-01-08 日亜化学工業株式会社 発光装置

Citations (10)

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Publication number Priority date Publication date Assignee Title
JPS62127321A (ja) * 1985-11-21 1987-06-09 バスフ　アクチェン　ゲゼルシャフト 新規なカルバゾ−ル置換ポリシロキサン
JPS63199736A (ja) * 1987-02-05 1988-08-18 チバーガイギー　アクチエンゲゼルシヤフト カルバゾール含有導電性ポリシロキサン
JPH02127432A (ja) * 1988-11-07 1990-05-16 Kanegafuchi Chem Ind Co Ltd カルバゾール基含有硬化性組成物
JPH06256520A (ja) * 1993-03-05 1994-09-13 Shin Etsu Chem Co Ltd 導電性重合体及びその製造方法
WO2004082362A2 (en) * 2003-03-18 2004-09-30 Nitto Denko Corporation Methods for extending amorphous photorefractive material lifetimes
WO2005019308A1 (en) * 2003-08-20 2005-03-03 Dow Corning Corporation Carbazolyl-functional linear polysiloxanes, silicone composition, and organic light-emitting diode
WO2005019307A1 (en) * 2003-08-20 2005-03-03 Dow Corning Corporation Carbazolyl-functional cyclosiloxane, silicone composition, and organic light-emitting diode
JP2005100710A (ja) * 2003-09-22 2005-04-14 Fuji Photo Film Co Ltd 有機電界発光素子
WO2005096408A1 (en) * 2004-03-16 2005-10-13 Dow Corning Corporation Hole transport material comprising polysiloxanes
JP2008138207A (ja) * 2006-12-01 2008-06-19 Rohm & Haas Co アリール（チオ）エーテルアリールポリシロキサン組成物およびその製造方法および使用方法

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AR206211A1 (es) * 1973-06-27 1976-07-07 Xerox Corp Composicion fotoconductiva y miembro de formacion de imagen que la incluye
US5414069A (en) * 1993-02-01 1995-05-09 Polaroid Corporation Electroluminescent polymers, processes for their use, and electroluminescent devices containing these polymers
JP4066229B2 (ja) 2001-02-14 2008-03-26 株式会社カネカ 硬化剤、硬化性組成物、光学材料用組成物、光学材料、その製造方法、並びに、それを用いた液晶表示装置及びｌｅｄ
GB0118473D0 (en) * 2001-07-28 2001-09-19 Dow Corning High refractive index polysiloxanes and their preparation
DE60234367D1 (de) * 2001-09-10 2009-12-24 Pioneer Corp Dielektrizitätskonstantenmessvorrichtung und dielektrizitätskonstantenmessverfahren
US6723816B2 (en) * 2001-11-02 2004-04-20 Bausch & Lomb Incorporated High refractive index aromatic-based siloxane difunctional macromonomers
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127321A (ja) * 1985-11-21 1987-06-09 バスフ　アクチェン　ゲゼルシャフト 新規なカルバゾ−ル置換ポリシロキサン
JPS63199736A (ja) * 1987-02-05 1988-08-18 チバーガイギー　アクチエンゲゼルシヤフト カルバゾール含有導電性ポリシロキサン
JPH02127432A (ja) * 1988-11-07 1990-05-16 Kanegafuchi Chem Ind Co Ltd カルバゾール基含有硬化性組成物
JPH06256520A (ja) * 1993-03-05 1994-09-13 Shin Etsu Chem Co Ltd 導電性重合体及びその製造方法
WO2004082362A2 (en) * 2003-03-18 2004-09-30 Nitto Denko Corporation Methods for extending amorphous photorefractive material lifetimes
WO2005019308A1 (en) * 2003-08-20 2005-03-03 Dow Corning Corporation Carbazolyl-functional linear polysiloxanes, silicone composition, and organic light-emitting diode
WO2005019307A1 (en) * 2003-08-20 2005-03-03 Dow Corning Corporation Carbazolyl-functional cyclosiloxane, silicone composition, and organic light-emitting diode
JP2005100710A (ja) * 2003-09-22 2005-04-14 Fuji Photo Film Co Ltd 有機電界発光素子
WO2005096408A1 (en) * 2004-03-16 2005-10-13 Dow Corning Corporation Hole transport material comprising polysiloxanes
JP2008138207A (ja) * 2006-12-01 2008-06-19 Rohm & Haas Co アリール（チオ）エーテルアリールポリシロキサン組成物およびその製造方法および使用方法

Also Published As

Publication number Publication date
US20100059774A1 (en) 2010-03-11
HK1135123A1 (en) 2010-05-28
CN101547959B (zh) 2012-11-28
JP5318383B2 (ja) 2013-10-16
US8076437B2 (en) 2011-12-13
CN101547959A (zh) 2009-09-30
JP2009040846A (ja) 2009-02-26

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