WO2009016189A1 - Method to electrodeposit metals using ionic liquids in the presence of an additive - Google Patents

Method to electrodeposit metals using ionic liquids in the presence of an additive Download PDF

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Publication number
WO2009016189A1
WO2009016189A1 PCT/EP2008/059962 EP2008059962W WO2009016189A1 WO 2009016189 A1 WO2009016189 A1 WO 2009016189A1 EP 2008059962 W EP2008059962 W EP 2008059962W WO 2009016189 A1 WO2009016189 A1 WO 2009016189A1
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WO
WIPO (PCT)
Prior art keywords
ammonium chloride
group
metal
anion
ionic liquid
Prior art date
Application number
PCT/EP2008/059962
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English (en)
French (fr)
Inventor
Boris Kuzmanovic
Lamberdine Johanna Willemina Maria Nabuurs-Willems
Cornelis Johannes Govardus Van Strien
Franz Winfried Welter
Johanna Christina Speelman
Original Assignee
Akzo Nobel N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel N.V. filed Critical Akzo Nobel N.V.
Priority to DE602008004255T priority Critical patent/DE602008004255D1/de
Priority to AT08786597T priority patent/ATE493523T1/de
Priority to CN2008801010499A priority patent/CN101765681B/zh
Priority to JP2010518655A priority patent/JP2010535283A/ja
Priority to PL08786597T priority patent/PL2171131T3/pl
Priority to EP08786597A priority patent/EP2171131B1/de
Priority to CA2695488A priority patent/CA2695488A1/en
Priority to US12/671,830 priority patent/US20100252446A1/en
Publication of WO2009016189A1 publication Critical patent/WO2009016189A1/en
Priority to HK10109690.2A priority patent/HK1143194A1/xx

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing

Definitions

  • the present invention relates to a method to electrodeposit a metal on a substrate using an ionic liquid as the electrolyte in the presence of an additive, and to the use of said additive to increase the layer thickness of the deposited metal layer.
  • An ionic liquid is a salt in which the ions are poorly coordinated, which results in these solvents being liquid at temperatures below 100°C. Many are liquid even at room temperature. At least one ion in an ionic liquid has a delocalized charge and one component is organic, which prevents the formation of a stable crystal lattice. Ionic liquids generally have very low vapour pressure and thus, in contrast to many conventional solvents, produce virtually no hazardous vapours. It is known that, in general, ionic liquids may be used in many applications, e.g. as reaction solvents, extraction solvents, electrolytes in batteries and electrodeposition, catalysts, heat exchange fluids, as additives in coatings.
  • Well-known systems include those formed from alkylpyridinium halides or dialkylimidazolium halides with an aluminium halide, and those based on choline chloride and a (hydrated) metal salt such as chromium(lll) chloride. These systems have been utilized as electrolytes in electroplating, as described for example in EP 0 404 188 and EP 1 322 591. Further, WO 2002/026381 discloses ionic liquids (eutectic mixtures) of choline chloride and a (hydrated) metal salt such as chromium(lll) chloride and the use thereof in electrodeposition and electropolishing.
  • the mixtures consist of choline chloride and the (hydrated) metal salt in a ratio of ammonium to metal ion of between 1 :1 and 1 :2.5 and are specifically said to be suitable for depositing chromium, cobalt, zinc or silver on a metal substrate.
  • PCT/EP/2007/051329 describes a method to electroplate or electropolish a metal on a substrate wherein an ionic liquid selected from the group of N + RiR 2 R 3 R 4 XOr N + R 5 R 6 R 7 R 8 Y " is employed as electrolyte, and a metal salt added to the ionic liquid is employed as the metal source or a metal anode is used as the metal source, wherein any one of Ri to Rs independently represents a hydrogen, alkyl, cycloalkyl, aryl, or aralkyl group that may be substituted with a group selected from OH, Cl, Br, F, I, phenyl, NH 2 , CN, NO 2 , COOR 9 , CHO, COR 9 , or OR 9 , at least one of R 5 to Rs is a fatty alkyl chain, and one or more of R 5 to Rs can be a (poly)oxyalkylene group wherein the alkylene is a Ci to C 4 al
  • ionic liquids as electrolytes in electrodeposition processes has several advantages.
  • Conventional chromic acid plating processes are extremely hazardous because they mainly rely on hexavalent chromium, which is highly toxic and carcinogenic.
  • Ionic liquids may eliminate the necessity to use hexavalent chromium and allow the use of trivalent chromium, which is considered to be far less dangerous.
  • conventional chromium plating baths require the use of strong acids, which poses significant disposal problems, while the use of ionic liquids generally enables such disposal difficulties to be minimized or even eliminated.
  • ionic liquids are non-volatile, so they do not cause atmospheric pollution. AIN 3239 R
  • metal layers For some applications, such as decorative plating, having thin metal layers is acceptable. However, for applications where the metal layer needs to provide protection against wear or abrasion, or to improve hardness (functional plating), metal layers much thicker than 200 nm are required. More particularly, layers of several micrometers or even several tens of micrometers are desirable.
  • the present invention relates to the use of amorphous silica, graphite powder, or a mixture thereof as additive in a process to electroplate or electropolish a metal on a substrate wherein an ionic liquid is employed as the electrolyte to increase metal layer thickness.
  • Additives have been added to the ionic liquid comprising electrolyte for several reasons.
  • US 7,196,221 discloses the use of brightening agents to improve the appearance of the coatings obtained in ionic liquid solvents/- electrolytes during metal plating and electropolishing processes, and in particular in chromium plating processes.
  • the brightening agents include thiourea, saccharin, vanillin, allyl urea, nicotinic acid, citric acid, gelatin, 2- mercaptobenzothiazole, tetraethylammonium fluoride dihydrate or tetramethyl- ammonium hydroxide pentahydrate.
  • WO 2006/074523 relates to a process for the recovery of platinum group metal, which comprises electrodeposition of the platinum group metal from an ionic AIN 3239 R
  • US 6,552,843 which is concerned with devices, such as adjustable mirrors, smart windows, optical attenuators, and displays, for controlling the reflectance and/or transmission of electromagnetic radiation, discloses a reversible electrodeposition optical modulation device employing an ionic liquid electrolyte.
  • the ionic liquid electrolyte is comprised of a mixture of an ionic organic compound and the salt of an electrodepositable metal.
  • the ionic organic compound comprises a heterocyclic cation such as N-alkylpyrrolidinium, pyrrolidinium, 1 -alkyl-3-methylimidazolium, N-alkylpyridinium, 2-alkyl-1- pyrrolinium, 1 -alkylimidazolium.
  • the electrodepositable metal is silver, copper, tin, zinc, palladium, bismuth, cadmium, mercury, indium, lead, antimony, thallium, and alloys thereof. It is mentioned that said ionic liquid electrolyte may be rendered more viscous, semi-solid or solid by addition of organic or inorganic gelling agents. Inorganic or organic materials, including suspended carbon and dissolved dyes, may be added to the electrolyte to impart a desired colour or to reduce background reflection.
  • electrodeposition in this application should be understood to include both electroplating and electropolishing.
  • electroplating is meant the process of using electrical current to coat an electrically conductive object with a layer of metal. The preferred result is a thin, smooth, even coat of metal on the object.
  • the primary application of electroplating is to deposit a layer of a metal having some desired property (e.g., abrasion and wear resistance, corrosion protection, lubricity, improvement of aesthetic qualities, etc.) onto a surface lacking that property.
  • Another application uses electroplating to build up thickness on undersized parts.
  • electropolishing is meant smoothing and AIN 3239 R
  • the additive used according to the present invention to increase the thickness of the deposited metal layer is amorphous silica, graphite powder, or a mixture thereof.
  • amorphous silica is meant to include colloidal silica particles in any form, where the colloidal silica particles, which are also referred to as silica sols, may be derived from e.g. precipitated silica, silica gels, pyrogenic silica (fumed silica), micro silica (silica fume) or mixtures thereof.
  • Colloidal silica according to the present invention may be modified and can contain other elements such as amines, aluminium and/or boron, which can be present in the particles and/or the continuous phase.
  • the colloidal silica particles can be dispersed in a substantially aqueous solvent, suitably in the presence of stabilizing cations such as K + , Na + , Li + , NH 4 + , organic cations, primary, secondary, tertiary, and quaternary amines, and mixtures thereof, so as to form an aqueous silica sol.
  • stabilizing cations such as K + , Na + , Li + , NH 4 + , organic cations, primary, secondary, tertiary, and quaternary amines, and mixtures thereof.
  • organic solvents e.g. lower alcohols, acetone or mixtures thereof, also denoted as organo-silica sols
  • the silica content in the sol is from about 5 to about 80% by weight.
  • Aqueous silica sols suitable for use according to the present invention are e.g. commercially available from Akzo Nobel.
  • Suitable organo-silica sols are e.g. commercially available from Nissan Chemical Industries.
  • graphite powder is meant finely divided carbon powder or carbon black, e.g. commercially available from Degussa.
  • the additive is preferably used in a quantity of at least 0.01 wt%, more preferably of at least 0.05 wt%, and most preferably of at least 0.1 wt%, based on the total weight of the electrolyte.
  • electrolyte stands for the total electrolyte mixture, i.e. including dissolved metal salts and additives.
  • the layer thickness can be increased at least 10 times, more preferably at least 20 times, and most preferably at least 40 times, when compared to electrodeposition without said additive(s).
  • the ionic liquid employed as electrolyte is preferably selected from the group consisting of N + RiR 2 RsR 4 X " , N + R 5 R 6 R 7 Rs Y " , and mixtures thereof, wherein any one of Ri to Rs independently represents a hydrogen, alkyl, cycloalkyl, aryl, or aralkyl group that may be substituted with a group selected from OH, Cl, Br, F, I, phenyl, NH 2 , CN, NO 2 , COOR 9 , CHO, COR 9 , or OR 9 , wherein at least one of Ri to R 4 is an, optionally branched, fatty alkyl chain, wherein R 2 can be a (C 2 -Cs alkyl)-N + Ri 6 Ri 7 Ris group with Ri 6 , Ri 7 , Ris being similar to Ri, R 3 , R 4 , respectively, or a Ci to C 4 alkyl chain, and wherein one or more of Ri to Rs can be a (
  • X " is selected from the group of F “ , Cl “ , Br “ , I “ ; the group of
  • R10COO anions wherein R10 may be hydrogen, a CrC 22 alkyl, alkenyl or aromatic group; the group of RnSO 4 " anions wherein Rn may be absent, in which case the cation is divalent, hydrogen, a CrC 22 alkyl, alkenyl or aromatic AIN 3239 R
  • a fatty alkyl chain is meant to include saturated and/or unsaturated chains and contains 8 to 22 carbon atoms; preferably, it contains 10 to 22 carbon atoms, most preferably 12 to 20 carbon atoms.
  • an ionic liquid of the formula N + RiR 2 RsR 4 X " is used with Ri, R 3 , and R 4 being as mentioned above and with R 2 being a (C 2 -C6 alkyl)- N + Ri 6 Ri7Ri8 group.
  • R16, R17, and Ris are identical to Ri, R 2 and R 4 , respectively, with at least one of them being an, optionally branched, fatty alkyl chain, resulting in a gemini-type structure (i.e. a symmetrical diquaternary ammonium compound).
  • Y " is based on a compound known as a sweetener.
  • N + R 5 R 6 R 7 Rs is an amine wherein the groups R 5 to Rs are hydrogen or an alkyl or cycloalkyl, optionally substituted with OH or Cl; more preferably, at least three thereof are an alkyl, more preferably a Ci to C 4 alkyl.
  • the ionic liquid is selected from any one of choline sacchahnate, choline acesulphamate, hexadecyltrimethyl ammonium chloride, octadecyltrimethyl ammonium chloride, cocotrimethyl ammonium chloride, tallowtrimethyl ammonium chloride, hydrogenated tallowtrimethyl ammonium chloride, hydrogenated palmtrimethyl ammonium chloride, oleyltrimethyl ammonium chloride, soyathmethyl ammonium chloride, cocobenzyldimethyl ammonium chloride, C12-16-alkylbenzyldimethyl ammonium chloride, AIN 3239 R
  • ionic liquids suitable for use according to the present invention can be prepared by a simple reaction of salts, for example by a metathesis reaction of choline chloride and sodium saccharinate (acesulphamate) to form a choline saccharinate (acesulphamate) ionic liquid, or by quaternization of the corresponding amines.
  • the molar ratio of the ammonium cation of the ionic liquid to the metal cation of the metal salt is preferably between 1 ,000:1 and 3:1. More preferred is a molar ratio of the ammonium cation of the ionic liquid to the metal cation of the metal salt of between 500:1 and 5:1 , most preferred is a molar ratio between 100:1 and 7:1 , this providing a good-quality metal layer, excellent dissolution of the metal in the AIN 3239 R
  • one of the metals chromium, aluminium, titanium, zinc or copper, or an alloy thereof is deposited. More preferably, chromium or aluminium is deposited, most preferably chromium.
  • This metal deposition can be done from a metal salt dissolved in the electrolyte, for example a metal halide, preferably, but not limited to, a metal chloride. It can also be performed using a pure metal which is applied as anode (i.e. a chromium, aluminium, titanium, zinc, or copper anode). In the embodiment where a metal anode is used, the anode may be in the form of metal pieces, chunks, chips or any other suitable form known to the skilled person.
  • the substrate which can be electroplated or electropolished according to the present invention can be any conductive object.
  • it is an object which is solid metal, such as a carbon steel object, or it comprises conductive elements such as a composite material object.
  • the present invention furthermore relates to a method to electroplate or electropolish a metal on a metal substrate wherein an ionic liquid ionic liquid is selected from the group consisting of N + RiR 2 RsR 4 X " , N + R 5 R 6 R 7 Rs Y " , and mixtures thereof, wherein any one of Ri to Rs independently represents a hydrogen, alkyl, cycloalkyl, aryl, or aralkyl group that may be substituted with a group selected from OH, Cl, Br, F, I, phenyl, NH 2 , CN, NO 2 , COOR 9 , CHO, CORg, or ORg, wherein at least one of Ri to R 4 is an, optionally branched, fatty alkyl chain, wherein R 2 can be a (C 2 -C 6 alkyl)-N + Ri 6 Ri 7 Ri 8 group with Ri 6 , Ri 7 , Ris being similar to Ri, R 3 , R 4 , respectively, or a Ci to
  • Y " is an anion having a sulfonylimide anion or an N-acyl sulphonylimide anion (-CO-N " -SO2-) functionality, wherein a metal salt added to said ionic liquid or a metal anode is employed as metal source, and wherein said ionic liquid comprises at least 0.01 wt%, based on the total weight of electrolyte, of an additive selected from the group consisting of amorphous silica, graphite powder, and of a mixture thereof.
  • the additive is preferably used in the quantities as described above.
  • the electrodeposition is preferably performed at temperatures below 90 0 C and more preferably at room temperature, in open electrodeposition vessels, but electrodeposition is not limited to these conditions.
  • Comparative Example 1 Electroplating of chromium from CrCb hexahydrate salt onto carbon steel in cocoalkylmethyl [polyoxy- ethylene(15)] ammonium chloride with no additives Chromium (III) chloride hexahydrate salt was added to cocoalkylmethyl [polyoxyethylene(15)] ammonium chloride ionic liquid containing 0.2 wt% of water and the mixture was agitated at a temperature of about 50 0 C until the solid salt dissolved. In the prepared solution the concentration of chromium (III) chloride hexahydrate was 75 g/kg. About 250 ml of that solution was poured into the Hull cell equipped with an electrical heating element which had a length of 65 mm on the anode side and AIN 3239 R
  • the substrate plate Prior to introduction into the bath, the substrate plate was cleaned with a commercial scouring powder, washed in demineralized water, in acetone and after that in ethanol, and finally in a 4 M-HCI aqueous solution. When both plates were connected and introduced into the cell, the voltage difference was set to 30 V. The current flow was monitored on a meter connected in series. After several hours of electroplating, the cathode was disconnected from the power source and taken out of the cell. The plate was washed in water and acetone and then dried. Chemical analysis by scanning electron microscopy combined with X-ray dispersion (SEM/EDX) of the substrate was performed. It confirmed deposition of chromium onto the carbon steel. The deposited layer thickness was measured using a thickness measurement device obtained from Fischer, Germany. The thickness was found to be lower than 0.5 ⁇ m.
  • Example 2 Electroplating of chromium from CrCb hexahydrate salt onto carbon steel in cocoalkylmethyl [polyoxyethylene(15)] ammonium chloride with addition of 0.2 wt% amorphous silica
  • Example 2 To the prepared solution of chromium (III) chloride hexahydrate salt in coco- alkylmethyl [polyoxyethylene(15)] ammonium chloride ionic liquid as described in Example 1 was added an amorphous silica aqueous colloidal solution which contained 8 wt% of active compound.
  • About 250 ml of that solution was poured into the Hull cell described in Example 1. The cell was heated to a temperature of about 80 0 C. AIN 3239 R
  • Example 2 The same pretreatment of the carbon steel substrate (cathode) as in Example 1 was performed, and again platinized titanium plate was applied as the anode. The potential difference was set to 30 V. The liquid was agitated using a centrally positioned top-entering impeller. The current flow between the electrodes was monitored on a meter connected in series.
  • the cathode was disconnected from the power source and taken out of the cell.
  • the plate was washed in water and acetone and then dried.
  • Chemical analysis by scanning electron microscopy combined with X-ray dispersion (SEM/EDX) of the substrate confirmed deposition of chromium onto the carbon steel plate.
  • the deposited layer thickness measured using a thickness measurement device (Fischer, Germany), was found to be as high as 8 ⁇ m in certain regions of the substrate, which was significantly thicker than when no additive was used. As is typical for the Hull cell experiments, the layer thickness varied with the position on the substrate - in this case from 1 ⁇ m to 8 ⁇ m. To confirm these measurements a cross-cut metallographic analysis was also done. The sample of the substrate was embedded in epoxy resin and the deposit was evaluated under the microscope. The layer thickness determined in this way was in agreement with the thickness measurement device results.
  • Example 3 Electroplating of chromium from CrCb hexahydrate salt onto carbon steel in cocoalkylmethyl [polyoxyethylene(15)] ammonium chloride with addition of 0.4 wt% amorphous silica
  • Example 2 To the prepared solution of chromium (III) chloride hexahydrate salt in coco- alkylmethyl [polyoxyethylene(15)] ammonium chloride ionic liquid as described in Example 1 was added an amorphous silica aqueous colloidal solution which contained 8 wt% of active compound. The concentration of the amorphous silica in the prepared solution, expressed as the quantity of the active compound, was 4 g/kg. About 250 ml of that solution was poured into the Hull cell described in Example 1. The cell was heated to a temperature of about 80 0 C. AIN 3239 R
  • Example 2 The same pretreatment of the carbon steel substrate (cathode) as in Example 1 was performed, and again platinized titanium plate was applied as the anode. The potential difference was set to 30 V. The liquid was agitated using a centrally positioned top-entering impeller. The current flow between the electrodes was monitored on a meter connected in series.
  • the cathode was disconnected from the power source and taken out of the cell.
  • the plate was washed in water and acetone and then dried.
  • Chemical analysis by scanning electron microscopy combined with X-ray dispersion (SEM/EDX) of the substrate confirmed deposition of chromium onto the carbon steel plate.
  • the deposited layer thickness measured using a thickness measurement device (Fischer, Germany) and by cross-cut metallographic analysis, was found to be ranging from 1 to 9 ⁇ m.
  • Example 4 Electroplating of chromium from CrCb hexahydrate salt onto carbon steel in coco alkyl methyl [polyoxyethylene(15)] ammonium chloride with addition of 1 wt% of carbon black
  • the cell was heated to a temperature of about 70 0 C.
  • the potential difference was set to 30 V.
  • the liquid was agitated using a centrally positioned top-entering impeller.
  • the current flow between the electrodes was monitored on a meter connected in series.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
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  • Electrolytic Production Of Metals (AREA)
PCT/EP2008/059962 2007-08-02 2008-07-30 Method to electrodeposit metals using ionic liquids in the presence of an additive WO2009016189A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE602008004255T DE602008004255D1 (de) 2007-08-02 2008-07-30 Verfahren zur elektrodeponierung von metallen mithilfe ionischer flüssigkeiten unter verwendung eines zusatzstoffs
AT08786597T ATE493523T1 (de) 2007-08-02 2008-07-30 Verfahren zur elektrodeponierung von metallen mithilfe ionischer flüssigkeiten unter verwendung eines zusatzstoffs
CN2008801010499A CN101765681B (zh) 2007-08-02 2008-07-30 在添加剂存在下使用离子液体电沉积金属的方法
JP2010518655A JP2010535283A (ja) 2007-08-02 2008-07-30 添加剤存在下でのイオン液体を用いる金属電着方法
PL08786597T PL2171131T3 (pl) 2007-08-02 2008-07-30 Sposób elektroosadzania metali przy użyciu cieczy jonowych w obecności dodatku
EP08786597A EP2171131B1 (de) 2007-08-02 2008-07-30 Verfahren zur elektrodeponierung von metallen mithilfe ionischer flüssigkeiten unter verwendung eines zusatzstoffs
CA2695488A CA2695488A1 (en) 2007-08-02 2008-07-30 Method to electrodeposit metals using ionic liquids in the presence of an additive
US12/671,830 US20100252446A1 (en) 2007-08-02 2008-07-30 Method to Electrodeposit Metals Using Ionic Liquids in the Presence of an Additive
HK10109690.2A HK1143194A1 (en) 2007-08-02 2010-10-13 Method to electrodeposit metals using ionic liquids in the presence of an additive

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP07113717 2007-08-02
EP07113717.8 2007-08-02
US95443407P 2007-08-07 2007-08-07
US60/954,434 2007-08-07

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WO2009016189A1 true WO2009016189A1 (en) 2009-02-05

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PCT/EP2008/059962 WO2009016189A1 (en) 2007-08-02 2008-07-30 Method to electrodeposit metals using ionic liquids in the presence of an additive

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US (1) US20100252446A1 (de)
EP (1) EP2171131B1 (de)
JP (1) JP2010535283A (de)
CN (1) CN101765681B (de)
AT (1) ATE493523T1 (de)
CA (1) CA2695488A1 (de)
DE (1) DE602008004255D1 (de)
ES (1) ES2358967T3 (de)
HK (1) HK1143194A1 (de)
PL (1) PL2171131T3 (de)
TW (1) TWI359880B (de)
WO (1) WO2009016189A1 (de)

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WO2010105299A1 (en) * 2009-03-17 2010-09-23 Commonwealth Scientific And Industrial Research Organisation Electrorecovery of metals
EP2280095A2 (de) 2009-07-30 2011-02-02 Ewald Dörken Ag Verfahren zur elektrochemischen Beschichtung eines Werkstücks
EP3147390A1 (de) 2012-06-08 2017-03-29 Onderzoekscentrum voor Aanwending van Staal N.V. Verfahren zur herstellung einer metallbeschichtung

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CN102888630B (zh) * 2011-07-20 2015-11-18 中国科学院过程工程研究所 一种离子液体/添加剂体系低温电沉积制备纳米铝或纳米铝镀层的方法
US9758884B2 (en) * 2012-02-16 2017-09-12 Stacey Hingley Color control of trivalent chromium deposits
DE102012104707A1 (de) * 2012-05-31 2013-12-05 Benteler Automobiltechnik Gmbh Verfahren zum Herstellen eines Abgaswärmetauschers
CN102839403B (zh) * 2012-09-10 2015-02-25 太原理工大学 一种离子液体中电镀铝的方法
CN103484900A (zh) * 2013-09-18 2014-01-01 湖南工业大学 一种离子液体中直接电沉积晶态纳米晶无微裂纹铬镀层的方法
WO2015088859A2 (en) 2013-12-10 2015-06-18 Lei Chen Electrodeposited nickel-chromium alloy
EP3080338B1 (de) 2013-12-10 2018-10-03 Lei Chen Nickel-chrom-aluminium-verbundstoff durch elektrolytische abscheidung
EP3080323B1 (de) 2013-12-11 2019-05-15 United Technologies Corporation Galvanogeformte nickel-chromlegierung
CN104294327B (zh) * 2014-10-20 2016-07-13 中国科学院过程工程研究所 一种离子液体电解液及用该电解液制备光亮铝镀层的方法
CN105220216B (zh) * 2015-09-28 2017-08-25 中国科学院兰州化学物理研究所 一种铝或铝合金电化学抛光方法
TWI662162B (zh) * 2016-11-15 2019-06-11 財團法人工業技術研究院 一種電鍍方法及其系統
JP7072796B2 (ja) * 2018-02-19 2022-05-23 国立大学法人 名古屋工業大学 調光部材
US20210156041A1 (en) * 2019-11-22 2021-05-27 Hamilton Sundstrand Corporation Metallic coating and method of application
US12050389B2 (en) 2020-10-23 2024-07-30 The Regents Of The University Of Colorado, A Body Corporate Electrolyte additive for controlling morphology and optics of reversible metal films
CN118028962A (zh) * 2024-02-23 2024-05-14 广东倍亮科技有限公司 离子液体在金属固体电解抛光中的应用

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JP2010535283A (ja) 2010-11-18
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