Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
  • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
  • F21V23/026—Fastening of transformers or ballasts
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
  • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
  • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
  • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V3/00—Globes; Bowls; Cover glasses
  • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
  • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
  • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V3/00—Globes; Bowls; Cover glasses
  • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
  • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
  • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]

Definitions

• the invention relates to a light source.
• LEDs Light-emitting diodes develop a high level of heat in high-current applications, which significantly reduces their service life and, in addition, limits the possible uses of light-emitting diodes.
• the heat acts on the supply board, which ensures the operation of the light-emitting diodes, and thus thermally loads them as well as the components arranged thereon.
• the object of the invention is to avoid the abovementioned disadvantages and, in particular, to provide a luminous means which enables the use of light-emitting diodes in handy and heat-resistant luminous means.
• a light source comprising: - at least one lighting unit;
• thermoelectric unit - A heat sink, wherein the heat sink is arranged such that heat from the at least one lighting unit can be derived; - A supply board that is separate from the light unit.
• This solution enables efficient heat dissipation from the at least one lighting unit via the heat sink, wherein the power supply board for operating the at least one light unit is advantageously designed separately and thus thermally relieved of the strong heat of at least one light emitting diode.
• a development consists in that the heat sink has at least one holding means for the supply board.
• the heat sink can have a mechanical support for the supply board and thus ensure that the supply board is arranged at a distance from the at least one lighting unit.
• a mechanical support can be realized for example in the form of notches on or in the heat sink.
• the mechanical support is designed as a clamping construction such that only a small surface of the heat sink is in direct contact with the supply board and therefore only little to almost no heat can be dissipated from the heat sink to the supply board.
• the at least one lighting unit is arranged on a circuit board.
• a plurality of lighting units of different types and shapes e.g., technology,
• Size or color can be arranged on the board so that the luminosity of the lamp accordingly mixes and / or amplified.
• the board of the light source is a double-sided board whose bottom is thermally coupled to the heat sink.
• the underside of the board may have at least one copper surface which is in direct contact with the heat sink.
• this is an electrical insulation between the top and bottom through the board (plastic) itself.
• the lighting means has a socket which is thermally coupled to the heat sink.
• a position of the at least one lighting unit in the lighting means is adjustable.
• a transparent plastic piston with predetermined optical properties can be arranged above the at least one lighting unit, so that the light emitted by the at least one lighting unit with a specific emission characteristic leaves the lighting means.
• the design of the heat sink allows, for example, a positioning of the at least one light source within the plastic piston.
• the heat sink is made in one piece or in several parts.
• the heat sink may be designed as a cooling lug and / or comprise one or more cooling vanes.
• the heat sink may comprise at least one holding means.
• a flexible embodiment of the heat sink enables the versatile implementation of the advantages described herein. Due to the effective thermal relief of the at least one lighting unit, it is possible to extend the life of the lamp or to increase its maximum light output.
• the heat sink has a holding device for at least one optical system.
• the optical system may include a lens for diffusing the light to a bulb.
• the lens can be used for targeted dispersion of light.
• the optical system is preferably arranged above the at least one lighting unit.
• Fig.l is a schematic decomposition of a luminous means comprising a light-emitting diode and means for heat dissipation;
• Fig.l shows the representation of a schematic decomposition of a lighting means.
• a lighting unit, in Fig.l formed as light emitting diode 101 is disposed on a double-sided circuit board 102.
• the underside of the board 102 has a large copper surface and is thermally conductively connected to a heat sink 103.
• the light-emitting diode 101 emits light through a preferably at least partially transparent or frosted piston 108, which preferably comprises plastic or glass.
• the heat generated by the light emitting diode 101 is at least partially dissipated to the heat sink 103.
• the heat sink 103 includes a plurality of cooling vanes 104, which are preferably fixedly connected to the heat sink 103 and made of a thermally conductive material.
• the cooling vanes 104 may be made of the same material as the heat sink 103.
• a supply board 106 includes, for example, the power supply for the light emitting diode 101 and is spaced therefrom.
• the cooling lugs 104 have mechanical holding means 107 for fixing the supply board 106.
• the mechanical retention means 107 may be implemented by engaging the cooling vanes 104 into notches on the supply board 106. After engagement with these notches, the cooling lugs 104 may include bends (e.g., tapers) that allow for clamping support of the supply board 106.
• bends e.g., tapers
• cooling lugs 104 have thermal contacts 109, which produce a thermal connection with a socket 105 and thus enable heat dissipation from the light-emitting diode 101 to the socket 105.
• the heat sink 103 includes cooling vanes 104 for mechanical support and / or locking of the supply circuit board 106.
• the cooling vanes 104 or additional cooling vanes or supports 110 can be used to mechanically fix the circuit board 102.
• the circuit board 102 can be exchanged.
• any number of light emitting diodes may be disposed on a circuit board 102 to be replaced since the power board 106 preferably includes a power source.
• FIG. 2 shows enlarged the heat sink 103 with the cooling vanes 104 according to Fig.l.
• the heat sink 103 has three cooling vanes 104 and three fastening means 110.
• the heat sink 103 is made of several parts of the same thermally conductive material.
• the fastening means 110 are provided for fixing the circuit board 102.
• the cooling vanes 104 have holding means 107 for fixing the supply circuit board 106. Furthermore, the cooling vanes 104 show thermal contacts 109 for engagement in the socket 105.
• FIG. 3 shows a section through the lighting means in an assembled state.
• the explanations regarding the reference numbers correspond to those for Fig.l and Fig.2.

Landscapes

• Engineering & Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optics & Photonics (AREA)
• Power Engineering (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Priority Applications (3)

Applications Claiming Priority (1)

Publications (1)

Family

ID=39233111

Family Applications (1)

Country Status (3)

Cited By (4)

Families Citing this family (1)

Citations (4)

Family Cites Families (1)

• 2007
  • 2007-07-20 EP EP07787773.6A patent/EP2171352B1/de active Active
  • 2007-07-20 CN CN2007900001351U patent/CN202040773U/zh not_active Expired - Lifetime
  • 2007-07-20 WO PCT/EP2007/057521 patent/WO2009012806A1/de active Application Filing

Patent Citations (4)

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