WO2009012672A1 - Sous-ensemble optique d'émetteur pour une communication par fibre optique - Google Patents

Sous-ensemble optique d'émetteur pour une communication par fibre optique Download PDF

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Publication number
WO2009012672A1
WO2009012672A1 PCT/CN2008/071098 CN2008071098W WO2009012672A1 WO 2009012672 A1 WO2009012672 A1 WO 2009012672A1 CN 2008071098 W CN2008071098 W CN 2008071098W WO 2009012672 A1 WO2009012672 A1 WO 2009012672A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser diode
assembly
emitting
light
concentrating
Prior art date
Application number
PCT/CN2008/071098
Other languages
English (en)
Chinese (zh)
Inventor
Strong Tain Liao
Yu-Sheng Liao
Hsiu Shing Liao Sun
Original Assignee
Aeco Optoelectronics (Shenzhen) Co. Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aeco Optoelectronics (Shenzhen) Co. Ltd filed Critical Aeco Optoelectronics (Shenzhen) Co. Ltd
Publication of WO2009012672A1 publication Critical patent/WO2009012672A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G02B6/322—Optical coupling means having lens focusing means positioned between opposed fibre ends and having centering means being part of the lens for the self-positioning of the lightguide at the focal point, e.g. holes, wells, indents, nibs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

Definitions

  • the present invention relates to a fiber optic communication device, and more particularly to a light emitting sub-module (TOS) for optical fiber communication
  • TOS light emitting sub-module
  • FIG. 1 is a sectional view of a package structure of a commonly used light-emitting sub-module for a single-mode fiber.
  • the edge of the fixing cover 92 is correspondingly welded to the groove dug by the base 9, thereby forming a space 93 between the fixed cover 92 and the base 9, and the laser
  • the diode 91 is located in this space 93, and is filled with nitrogen gas in the space 93 to prevent oxidation of the laser diode 91 and interference with light.
  • the fixing cover 92 is disposed through a hole, and the hole is embedded in a focusing ball 95, so that the light emitted by the laser diode 91 can be collectively coupled to the optical core of the fiber ceramic ferrule 8 to become coaxial.
  • Metal packaged laser diode assembly 10 is disposed through a hole, and the hole is embedded in a focusing ball 95, so that the light emitted by the laser diode 91 can be collectively coupled to the optical core of the fiber ceramic ferrule 8 to become coaxial.
  • the laser diode assembly 10 is placed inside the metal base 2 and fixed by a metal fitting or fixing glue 3, a fixing sleeve 4 is fixedly coupled with the metal base 2, and a hollow ceramic sleeve 5 is coaxially arranged. Inside the sleeve 4, it is used to access the transmission fiber.
  • FIG. 2 Another common package structure cross-sectional view of a light-emitting sub-module for a multi-mode fiber, as shown in FIG. 2, the laser diode assembly 10 is assembled with a light concentrating group connector ( Metal) 27, adhered between the laser diode assembly 10 and the light concentrating group connector 27 with a sealing adhesive 33, and combined into a light emitting sub-module.
  • a light concentrating group connector Metal
  • the production cost is too high, and after careful research and trial improvement, the invention is finally born, its primary purpose
  • the invention provides an optical transmission sub-module package structure improved by an optical fiber transmission module, which can provide an optical fiber communication light source device with low production cost and high precision transmission with high precision.
  • the technical problem to be solved by the present invention is to construct a light-emitting sub-module for a fiber-optic transmission module, which can provide production cost, in view of the high cost and complicated production process of the above-mentioned conventional light-emitting sub-module.
  • a fiber optic communication light source device that is inexpensive and simple in production process.
  • a light emitting sub-module for optical fiber communication comprising: a fiber concentrating assembly joint and a laser diode assembly bonded to the optical fiber;
  • the fiber concentrating assembly joint is a transparent joint, and a shaft of the concentrating light is disposed at an axial center for collecting light emitted by the laser diode assembly;
  • the laser diode assembly is coupled to the fiber concentrating assembly and the light emitted by the laser diode assembly is coupled to the optical core of the optical fiber by the concentrating sphere.
  • the laser diode assembly may be a side-emitting type laser diode assembly or a surface-emitting type laser diode assembly;
  • the laser diode assembly includes a light source assembly
  • the light source assembly comprises a side-emitting laser diode or a surface-emitting laser diode chip, at least two supports, wire bonding, and epoxy resin packaging;
  • the side-emitting type laser diode or the surface-emitting type laser diode chip is fixed on one of the brackets, and the side-emitting type laser diode or the surface-emitting type laser diode chip and other places
  • the brackets are connected by the wire bonding; the epoxy resin package wraps the one end of the bracket carrying the side-emitting laser diode or the surface-emitting laser diode chip, and only exposes the bracket The other end.
  • the laser diode assembly may be a side-emitting type laser diode assembly or a surface-emitting type laser diode assembly;
  • the laser diode assembly includes a light source assembly; the light source assembly includes a base, a side-emitting laser diode mounted on the base or a surface-emitting laser diode chip, and sleeved in the a fixing cover on the periphery of the side-emitting type laser diode or the surface-emitting laser diode chip; the edge of the fixing cover is soldered to the groove of the pedestal, and is located at the side-emitting type laser diode or surface A through hole is formed at the position of the laser diode chip; the hole may be embedded in a flat or curved glass or omitted glass.
  • the laser diode assembly further includes a sleeve disposed outside the light source assembly
  • the optical fiber concentrating assembly joint is an optical fiber concentrating assembly joint made of a transparent plastic material integrally formed.
  • At least one groove is provided in an outer wall of the fiber concentrating assembly.
  • the material of the casing in the light-emitting sub-module of the present invention is one of nickel stainless steel or plastic.
  • optical concentrating joint of the light emitting sub-module of the present invention directly passes the seal with the epoxy resin package
  • the front end of the optical fiber concentrating assembly connector forms an accommodating space for accessing one end of the epoxy resin package of the laser diode assembly, and the concentrating ball is disposed at the Included in the space.
  • a metal member for soldering the two is provided between the laser diode assembly and the fiber concentrating assembly.
  • the light-emitting sub-module embodying the present invention has at least the following beneficial effects:
  • the present invention sets the concentrating sphere at the axis of the light concentrating assembly joint to form a fiber concentrating assembly joint, and the laser diode assembly Combined with fiber optic concentrating unit connectors for cost-saving results, in addition to high-speed transmission equivalent to common technology, and achieving fast and mass-produced performance, reducing the cost of fiber-optic transmission modules and increasing product Competitiveness.
  • Figure 1 is a cross-sectional view of a package structure of a light-emitting sub-module of a commonly used single-mode fiber.
  • FIG. 2 is a cross-sectional view showing the package structure of a light-emitting submodule of a commonly used multimode fiber.
  • Figure 3 is a cross-sectional view showing a first embodiment of the light-emitting sub-module of the present invention.
  • FIG. 4 is a cross-sectional view showing a second embodiment of the light-emitting submodule of the present invention.
  • Figure 5 is a cross-sectional view showing a third embodiment of the light-emitting sub-module of the present invention.
  • Figure 6 is a cross-sectional view showing a fourth embodiment of the light-emitting sub-module of the present invention.
  • Figure 7 is a cross-sectional view showing a fifth embodiment of the light-emitting sub-module of the present invention.
  • the light-emitting sub-module of the present invention mainly comprises: a fiber concentrating assembly joint 60, a light source assembly, a metal member 70, and a casing 50.
  • the light source assembly includes a side-emitting or surface-emitting laser diode chip 32, a wire bonding 40, and two or more metal brackets 110.
  • a side-emitting type laser diode 32 is used.
  • the top end of one of the metal brackets 110 is combined with the side-emitting laser diode chip 32, and the side-emitting laser diode chip 32 is connected to the other brackets 110 by a wire bonding 40, and then the bracket 110 is loaded with a side-emitting laser.
  • One end of the diode chip 32 is integrally covered with an epoxy resin package 322, and only the other end of the bracket 110 is exposed to connect the current and the signal source.
  • the cover 50 is covered on the periphery of the epoxy resin 322 to form an epoxy resin packaged laser diode assembly 111.
  • the side-emitting laser diode assembly 111 is mounted on the side of the side-emitting laser diode chip 32 with a fiber concentrating assembly joint 60.
  • the fiber concentrating assembly connector 60 is integrally formed of a transparent plastic material, and the front end is an accommodating space 315 connected to the side-emitting type laser diode assembly 111.
  • a concentrating sphere 311 is disposed in the accommodating space 315, and a gap is formed between the concentrating sphere 311 and the side-emitting type laser diode assembly 111, so that the side-emitting type laser diode assembly 111 emits a light source, and then condenses the light through the optical fiber.
  • the concentrating spheres 311 of the set of joints 60 allow light to be collectively coupled into the optical core of the fiber-optic ceramic ferrule 8.
  • the outer wall of the fiber concentrating assembly connector 60 is provided with one or a plurality of retractable grooves 35 for external fixation, and the optical concentrating assembly connector 60 and the metal member 70 are buried or glued to the casing 50.
  • the joints are welded together to form a complete light-emitting sub-module for fiber-optic communication transmission.
  • FIG. 4 it is a second embodiment of the light-emitting sub-module of the present invention, which differs from the first embodiment in the connection between the optical fiber concentrating assembly connector 60 and the casing 50. 33 solid glue, other structures are the same as the first embodiment, and are not mentioned.
  • FIG. 5 it is a third embodiment of the light-emitting sub-module of the present invention, wherein the laser diode assembly uses a surface-emitting laser diode chip, and the package rubber 322 of the side-emitting laser diode chip 32.
  • the outer casing omits the casing 50, and the joint between the optical fiber concentrating assembly 60 and the side-emitting laser diode chip 32 is modified by the encapsulation 33, as shown in FIG. 5; the other structure is the same as that of the first embodiment. Do not praise.
  • FIG. 6 is a fourth embodiment of the light-emitting sub-module of the present invention, wherein the light source assembly uses a package structure similar to that of the light source assembly of FIG. 1, including a base 9, mounted on the base 9
  • the edge of the fixing cover 92 is welded to the groove of the base 9 and the hole is formed at the position of the side-emitting laser diode chip 91.
  • a plane or curved glass can be embedded in the hole, or the hole is not Embedding glass.
  • the focusing sphere in Fig. 1 is omitted, and the concentrating sphere 311 on the fiber concentrating assembly joint 60 is condensed.
  • the seam of the fiber concentrating assembly connector 60 and the casing 50 is modified by the sealing adhesive 33, as shown in FIG.
  • Other structures are basically the same as those of the first embodiment, and are not described.
  • FIG. 7 it is a fifth embodiment of the light-emitting sub-module of the present invention, and its structure is basically the same as that of the fourth embodiment, with the difference that: the optical fiber concentrating assembly joint 60 and the metal member 70 are embedded. The shot or glued joint is then joined to the seam of the casing 50 by laser welding, as shown in FIG.
  • the laser diode package assembled in the light emission sub-module has a simple structure and a high yield.
  • the invention can improve the laser diode package structure of the single-mode or multi-mode fiber transmission module. It is easy to concentrate the illuminating source from the fiber concentrating assembly to the optical fiber core.
  • the invention designs the concentrating sphere to be disposed at the axis of the light concentrating assembly joint, and combines the side-emitting and surface-emitting laser diode assembly with the fiber concentrating assembly, and not only achieves the change of the packaging mode, but also achieves In the same high-speed transmission, the cost is greatly reduced, and the production speed is also greatly improved.
  • the case is not only a major innovation in the technical thinking and industry, but also can enhance the above-mentioned multiple functions in a more common way.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un sous-ensemble optique d'émetteur pour une communication par fibre optique qui comprend une sphère de concentration de lumière disposée au niveau de l'axe central d'un connecteur d'ensemble de concentration de lumière par câble optique afin de former un connecteur d'ensemble de concentration de lumière par câble optique ; ledit sous-ensemble servant à connecter une diode laser à émission latérale ou à émission de surface audit connecteur d'ensemble de concentration de lumière par câble optique.
PCT/CN2008/071098 2007-07-26 2008-05-27 Sous-ensemble optique d'émetteur pour une communication par fibre optique WO2009012672A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2007201217961U CN201114082Y (zh) 2007-07-26 2007-07-26 用于光纤通讯的光发射次模块
CN200720121796.1 2007-07-26

Publications (1)

Publication Number Publication Date
WO2009012672A1 true WO2009012672A1 (fr) 2009-01-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/071098 WO2009012672A1 (fr) 2007-07-26 2008-05-27 Sous-ensemble optique d'émetteur pour une communication par fibre optique

Country Status (2)

Country Link
CN (1) CN201114082Y (fr)
WO (1) WO2009012672A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101102161B (zh) * 2007-07-26 2011-05-11 智科光光电（深圳）有限公司 用于光纤通讯的光发射次模块
WO2021208100A1 (fr) * 2020-04-17 2021-10-21 华为技术有限公司 Ensemble émetteur de lumière et système de communication optique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6061493A (en) * 1998-09-01 2000-05-09 Methode Electronics, Inc. Optical subassembly with attenuating plug
CN1654997A (zh) * 2004-02-02 2005-08-17 Jds尤尼弗思公司 具有陶瓷封装的小型光学分组件
CN2826459Y (zh) * 2005-08-29 2006-10-11 前源科技股份有限公司 光次模组
JP2006295003A (ja) * 2005-04-13 2006-10-26 Sumitomo Electric Ind Ltd レーザモジュール、およびレーザモジュールを作製する方法
CN101102161A (zh) * 2007-07-26 2008-01-09 智科光光电（深圳）有限公司 用于光纤通讯的光发射次模块
CN201060294Y (zh) * 2007-04-29 2008-05-14 圣威光电科技发展股份有限公司 光纤传输模块的发光二极管结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6061493A (en) * 1998-09-01 2000-05-09 Methode Electronics, Inc. Optical subassembly with attenuating plug
CN1654997A (zh) * 2004-02-02 2005-08-17 Jds尤尼弗思公司 具有陶瓷封装的小型光学分组件
JP2006295003A (ja) * 2005-04-13 2006-10-26 Sumitomo Electric Ind Ltd レーザモジュール、およびレーザモジュールを作製する方法
CN2826459Y (zh) * 2005-08-29 2006-10-11 前源科技股份有限公司 光次模组
CN201060294Y (zh) * 2007-04-29 2008-05-14 圣威光电科技发展股份有限公司 光纤传输模块的发光二极管结构
CN101102161A (zh) * 2007-07-26 2008-01-09 智科光光电（深圳）有限公司 用于光纤通讯的光发射次模块

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