M342609 八、新型說明： 【新型所屬之技術領域】 一種光纖通訊的光發射次模組封裝結構改良，特別是一種用 於用於光纖通訊的光發射次模組(T0SA，Transmte Sub_M342609 VIII. New Description: [New Technology Field] A fiber optic communication optical emission sub-module package structure is improved, especially a light-emitting sub-module for optical fiber communication (T0SA, Transmte Sub_)
Assembly)的封裝結構。 ' 【先前技術】 '在目前光纖祕中-般已制雷射二極體做為光源組件，如 泰第圖所示’為習用之用於單模(single，de)光纖的光發射次 模組的封裝結構剖面圖，將雷射二極體91固定至基座9之表面 上，接著，將固定蓋92之邊緣對應焊接在基座9挖設的凹槽 上，藉以在固定蓋92與基座9之間形成一空間93，而雷射二極 體錄，空間93中，並於該空間93内填充氣氣，防止雷射 一極體91氧化及受到光線干擾。其中，固定蓋犯開設有貫穿一 孔洞，而該孔洞並嵌入一聚焦球95，藉以使雷射二極體91所發 ㈣光可聚_合至先纖陶賴芯8的光芯中，而成為_金屬 • 封裝的雷射二極體組件10。該雷射二極體組件10係置設在金屬 ; f座Y的内部，並利用金屬繁配或固定膠3加以固定，一固定套 筒4 )系與金屬基座2結合固定，-中空喊套管5係同軸地配置 在套筒4内部，用以接入傳輸光纖。 1 士另一習用之用於多模（mul ti —m〇de)光纖的光發射次模組的封 K翻面圖，如第二圖所示，將雷射二極體組件iq組裝上光 、線聚光組接頭（金屬）27，在雷射二極體組件1〇及光線聚光組 接頭（金屬）27之間用封裝膠33黏著，結合成光發射次模組。 而上述之習用光發射次模組的封裝結構，由於雷射二極體91 M342609 •㈣錄面’卫料易產生較高的熱量，必須加強其抗氧化能 力’故外層必須以金屬材質做固定蓋92封襄，並且固定蓋犯需 挖孔洞，並嵌入聚焦球95，其製作過程繁複，並且，金屬結合間 必須多次人工焊接加工，再在固定蓋92的空間内填充氮氣以防 止雷射二極體91氧化，生產過程繁複；另外，製造封裝的材料 均需應用貴金屬或金屬等高成本的原料，因此成本居高不下，無 法陕速生產產月匕無法快速提升，亟需改進，以增強產品之競 - 力。 _ 有4監於此，本案創作人基於多年從事相關產品設計研發工作 之經驗，有感於上述習用品之生產成本過高，經潛心研究，試作 改良，終使本創作得以誕生，其首要之目的，乃在提供一種光纖 通訊的光發射次模組封裝結構改良，其係可提供一種生產成本低 廉且達到精料狀高速傳輸之錢通絲職置。 【新型内容】 本創作之主要目的係針對上述習㈣光發射次模組的成本 ，生產過程繁複的缺陷，創作一種用於光纖傳輸模組的光發射 人模組可提供生產成本低廉且生產過程簡單的光纖通訊光源裝 .置。 為達上述目的，本創作包括：一與光纖接合的光纖聚光組接 頭和-雷射二極體組件，光纖聚光組接頭為可透光之接頭，其轴 心設有-聚光雜，用於轉雷射二極敝件發㈣級，雷射 二極體組件與光光組接馳結合，其中雷射二極體組件與光 纖聚光組接頭各自用金屬構件膠固連結或埋入射出，兩組件之間 封裝通過雷射焊接封裝連結，並且雷射二極體組件發出的光線通 M342609 光_光芯+，財，二極體組件可 為側的雷射二極體組件或面射型的雷射二極體組件。 璧^糾雷射二極體組件係包括—光源組件，光源組件包含一 謝i雷射—極體或面射型雷射二極體晶片，相定在I中一支 雷射二極體或面射型雷射二極體晶片與其他的 間通過打線連接，以及環氧樹脂封裝，將支架承載侧射型 =-極體或簡型雷射二極體晶片的_端包覆起僅外露 支架的另一端。 或者’雷射二極體組件係包括一光源組件，光源組件包含一 侧射^雷=極體或面射型雷射二極體晶片，安裝金屬基座上， 、口疋蓋，套*又在侧射型雷射二極體或面射型雷射二極體晶 片週邊，固定蓋的邊緣焊接在基座挖設的凹槽上，並且位於侧射 型雷射=極體或面射型雷射二極體晶片位置處開設貫穿的孔洞， 孔洞可肷入一平面或曲面玻璃或省略玻璃。 藉由本創作將聚光球體設置在光線聚光組接頭軸心處，而成 :光纖聚光組接頭，並將雷射二極體組件與光纖聚光組接頭結 合，以達到較節省成本之效果，除了仍可達到高速傳輸之外，並 可達到快速且可大量生產的效能，降低光纖傳輸模組的成本，增 加產品的競爭力。 本創作之其他特點及具體實施例可於以下配合附圖之詳細說 明中，進一步了解0 【實施方式】 請參閱第三圖所示，係本創作之光纖通訊的光發射次模組封 裝結構改良的第一實施例，主要係包含：一光纖聚光組接頭6〇、 M342609 光源組件80、金屬構件70以及金暴套殼50 ;該光源組件8〇包括側 射型或面射型雷射二極體晶片32、打線40以及二支或多支金屬支 架110，在本實施例中，採用侧射型雷射二極體32 ;其中，一支 金屬支架110的頂端與侧射型雷射二極體晶片32結合，並且侧射 型雷射二極體晶片32與其他支架11〇之間通過打線4〇連接，然後 將支木110承載侧射型雷射二極體晶片32的一端以環氧樹脂封裝 322整體包覆起來，僅外露出支架ho的另一端，用以連接電流與信 號源，並且在環氧樹脂322的週圍包覆金屬套殼50，而成為環氧樹 脂封裝322的雷射二極體組件111。該侧射型雷射二極體組件111 靠近侧射型雷射二極體晶片32的一侧安裝光纖聚光組接頭6〇，光 纖聚光組接頭60為透明塑膠材質一體成形制成，前端為一容置空 間315，與侧射型雷射二極體組件in相連接。在容置空間315内 没一聚光球體311，並且在聚光球體3Π與侧射型雷射二極體組件 111之間具有間隙，從而侧射型雷射二極體組件1丨丨發出光源，再 經由光纖聚光組接頭60的聚光球體311，使光線可聚集耦合至光 纖陶瓷插芯8的光芯中。光纖聚光組接頭6〇外壁設有一個或數個 可卡固的溝槽35，以利外部的固定，光纖聚光組接頭6〇與金屬構 件70間以埋入射出或膠固連結金屬套殼5〇之接縫處以焊接連結， 成為完整的用於光纖通訊傳輸的光發射次模組。 請參閱第四圖所示，係本創作之光纖通訊的光發射次模組封 裝結構改良的第二實施例，其與第一實施例的區別在於光纖聚光 組接頭60與金屬套殼50之間的連接採用封裝膠33固膠，其他結構 與第一實施例相同，容不贅述。 請參閱第五圖所示，係本創作之光纖通訊的光發射次模組封 裝結構改良的第三實施例，其中雷射二極體組件111採用面射型 雷射二極體晶片32，面射型雷射二極體晶片32的封裝膠322的週 M342609 邊省略了金屬套殼5〇，光纖聚光組接頭6〇與侧射型雷射二極體晶 片32之接縫處改以封裝膠33黏著；其他結構與第一實施例相同， 容不贅述。 請參閱第六圖所示，係本創作之光纖通訊的光發射次模組封 裝結構改良的第四實施例，其中，光源組件採用與圖一或圖五的 光源組件類似的封裝結構，包括基座9、安裝在基座9上的侧射型 雷射二極體91、套設在侧射型雷射二極體91或面射型雷射二極體 91週邊的固定蓋92、以及在基座9週邊設置的金屬套殼5〇。固定 蓋92的邊緣焊接在基座9挖設的凹槽上，並且位於侧射型雷射二 極體91的位置處開設有孔洞，在孔洞上可嵌入一平面或曲面玻 璃，或是該孔洞不嵌入玻璃。省略了圖一中的聚焦球，而通過光 纖聚光組接頭6〇上的聚光球體311進行聚光。該光纖聚光組接頭 60與金屬套殼50之接縫處改以封裝膠33黏著；其他結構與第一實 施例基本相同，容不贅述。 請參閱第七圖所示，係本創作之光纖通訊的光射次模組封 裝結構改良的第五實補，其結構與第四實酬基本相同，區別 在於·光纖聚光組接頭60與金屬構件70間以埋入射出或膠固連 結再與金屬套殼5〇之接縫處以雷射焊接連接。 為使本創作更加顯現出進步性與實用性，玆與習用產品作一 比較分析如下： 習用缺失： L習用光發射次模組的雷射二極體封裝結構複雜，且有良率 問題。 2·習用光發射次模組的雷射二極體封裝結構，製作過程 中’需在固定蓋中嵌入一聚焦球，製作過程繁複。 3·成本較高。 M342609 4·生產速度緩慢。 本創作之優點·· 1.組裝於光發射次模組的雷射二極體封裝結構簡易， 較高。 、千 2·本創作不論單模或多模的光纖傳輸模組之雷射二極體封裝 結構改良，均能容易將發光源由光纖聚光組接頭聚集至 纖光芯中。 一 3·封裝材料價格低廉。 4.人工成本低。 5·可快速大量生產。 本創作設計將聚光球體設置在光線聚光組接頭軸心處，並將 側射及面射型雷射二極體組件與光纖聚光組接頭結合，並隨著改 變封裝方式，不但達到同樣之高速傳輸，所耗費的成本大幅下降， 生產速度亦提升許乡；綜上所述，本案不但在技術思想與產業界 中是一大創新，並能較習用之方法增進上述多項功效，應已充分 符合新穎性及進步性之法定創新專利要件，爰依法提出^請，$ 請責局核准本件創作專利申請案，以勵創作，至感德便。. 【圖式簡單說明】 第一圖係習用之單模光纖的光發射次模組的封裝結構剖面圖。 第一圖係習用之多模光纖的光發射次模組的封裝結構剖面圖。 第三圖係本創作之光纖通訊的光發射次模組封裝绪構改良之第一 實施例的剖面圖。 第四圖係本創作之光纖通訊的光發射次模組封裝結構改良之第二 實施例的剖面圖。 M342609 第五圖係本創作之光纖通訊的光發射次模組封裝結構改良之第三 實施例的剖面圖。 第六圖係本創作之光纖通訊的光發射次模組封裝結構改良之第四 實施例的剖面圖。 第七圖 係本創作之光纖通訊的光發射次模組封裝結構改之 實施例的剖面圖。 义 【主要組件符號說明】 2金屬基座 3固定膠 4套筒 5中空陶瓷套管 8光纖陶瓷插芯 9基座 10雷射二極體組件 27光線聚光組接頭（金屬) 32雷射二極體晶片 33封裝膠 35溝槽 40打線 50金屬套殼 60光纖聚光組接頭 70金屬構件 80光源組件 91雷射二極體 M342609 92固定蓋 93空間 95聚焦球 110支架 ill雷射二極體組件 311聚光球體 315容置空間 322環氧樹脂封裝Assembly) package structure. '[Prior Art] 'In the current fiber optic secrets - the laser diode has been fabricated as a light source component, as shown in the Thai diagram, for the conventional light emission submode for single-mode fibers. A sectional view of the package structure, the laser diode 91 is fixed to the surface of the base 9, and then the edge of the fixing cover 92 is correspondingly welded to the groove of the base 9 to be dug, thereby fixing the cover 92 with A space 93 is formed between the pedestals 9, and the laser diodes are recorded in the space 93, and the air is filled in the space 93 to prevent oxidation of the laser body 91 and interference with light. Wherein, the fixing cover is broken through a hole, and the hole is embedded in a focusing ball 95, so that the light emitted by the laser diode 91 can be collected into the optical core of the fiber core 8 Become a _metal• packaged laser diode assembly 10. The laser diode assembly 10 is disposed inside the metal; f seat Y, and is fixed by metal mixing or fixing glue 3, and a fixing sleeve 4) is fixed and fixed with the metal base 2, The sleeve 5 is coaxially disposed inside the sleeve 4 for accessing the transmission fiber. 1) Another conventional K-turned view of a light-emitting submodule for multimode (mul ti — m〇de) fiber. As shown in the second figure, the laser diode assembly iq is assembled and glazed. The line concentrating group connector (metal) 27 is adhered between the laser diode assembly 1 and the light concentrating group connector (metal) 27 by a sealing adhesive 33, and combined into a light emitting sub-module. The above-mentioned package structure of the conventional light-emitting sub-module, because the laser diode 91 M342609 • (4) recording surface 'the material is easy to generate high heat, must strengthen its anti-oxidation ability', so the outer layer must be fixed with metal material The cover 92 is sealed, and the fixed cover is required to dig a hole and is embedded in the focusing ball 95. The manufacturing process is complicated, and the metal bonding room must be manually welded, and then the space of the fixing cover 92 is filled with nitrogen to prevent the laser. The oxidation of the diode 91 is complicated, and the production process is complicated. In addition, the materials for manufacturing the package need to use high-cost raw materials such as precious metals or metals, so the cost is high, and the production cannot be quickly increased. Enhance the competitiveness of the product. _ There are 4 supervisors, the creator of this case is based on the experience of designing and researching related products for many years. I feel that the production cost of the above-mentioned products is too high. After painstaking research and trial improvement, the creation is finally born. The purpose is to provide an improved optical fiber sub-module package structure for optical fiber communication, which can provide a low-cost production and high-speed transmission of fine material. [New content] The main purpose of this creation is to create a light-emitting module for fiber-optic transmission modules that can provide low-cost production and production processes for the cost of the above-mentioned (four) light-emitting sub-modules and the cumbersome production process. Simple fiber optic communication light source. In order to achieve the above purposes, the present invention comprises: a fiber concentrating assembly and a laser diode assembly bonded to the optical fiber, the optical concentrating assembly is a light-transmissive joint, and the shaft is provided with a concentrating light. The utility model relates to a laser diode (four) class, a laser diode assembly and a light-light group connection, wherein the laser diode assembly and the fiber concentrating assembly are respectively glued or embedded with metal members. Injection, the package between the two components is connected by a laser soldering package, and the light emitted by the laser diode assembly passes through the M342609 light _ optical core +, the financial component, the diode component can be the side of the laser diode assembly or surface Laser-type diode assembly. The laser correction diode assembly includes a light source assembly, and the light source assembly includes a laser-polar or surface-emitting laser diode chip, which is determined by a laser diode in the The surface-emitting laser diode chip is connected to the other wires by wire bonding, and the epoxy resin package is used to cover the _ end of the carrier-side type--polar body or simple laser diode wafer. The other end of the bracket. Or 'the laser diode assembly includes a light source assembly, and the light source assembly includes a side-emitting ray=polar body or a surface-emitting laser diode chip, mounted on a metal base, and a port cover, a sleeve* In the periphery of the side-emitting type laser diode or the surface-emitting laser diode chip, the edge of the fixing cover is soldered to the groove of the pedestal, and is located in the side-emitting type laser = polar body or surface type A through hole is formed at the position of the laser diode wafer, and the hole can be broken into a flat or curved glass or omitted glass. By this creation, the concentrating sphere is placed at the axis of the light concentrating assembly joint, which is formed into a fiber concentrating group connector, and the laser diode assembly is combined with the fiber concentrating group connector to achieve a cost-saving effect. In addition to high-speed transmission, it can achieve fast and mass-produced performance, reduce the cost of fiber-optic transmission modules, and increase the competitiveness of products. Other features and specific embodiments of the present invention can be further understood in the following detailed description with reference to the accompanying drawings. [Embodiment] Please refer to the third figure, which is an improved optical package sub-module package structure of the present optical fiber communication. The first embodiment mainly includes: a fiber concentrating assembly connector 6 〇, an M342609 light source assembly 80, a metal member 70, and a gold violent casing 50; the light source assembly 8 〇 includes a side-emitting type or a surface-emitting type laser The polar body chip 32, the wire bonding 40 and the two or more metal brackets 110, in this embodiment, the side-emitting type laser diode 32 is used; wherein the top end of one metal bracket 110 and the side-emitting laser type II The polar body wafer 32 is bonded, and the side-emitting type laser diode chip 32 is connected to the other holders 11〇 by a wire 4〇, and then the branch 110 carries one end of the side-emitting laser diode chip 32 in a ring. The oxy-resin package 322 is integrally covered, and only the other end of the bracket ho is exposed to connect the current and the signal source, and the metal casing 50 is wrapped around the epoxy resin 322 to become the thunder of the epoxy resin package 322. The diode assembly 111 is mounted. The side-emitting type laser diode assembly 111 is mounted on the side of the side-emitting type laser diode chip 32 with a fiber concentrating group connector 6 〇, and the fiber concentrating group connector 60 is integrally formed of a transparent plastic material, and the front end is formed. It is an accommodation space 315 connected to the side-emitting type laser diode assembly in. There is no concentrating sphere 311 in the accommodating space 315, and there is a gap between the concentrating sphere 3 Π and the side-emitting type laser diode assembly 111, so that the side-emitting type laser diode assembly 1 emits a light source Then, through the concentrating sphere 311 of the fiber concentrating assembly connector 60, the light can be collectively coupled into the optical core of the fiber ceramic ferrule 8. The outer wall of the fiber concentrating assembly 6 is provided with one or several shackable grooves 35 for external fixation, and the optical concentrating assembly 6 〇 and the metal member 70 are buried or glued to the metal sleeve. The seam of the shell 5〇 is welded and connected to form a complete light-emitting sub-module for optical fiber communication transmission. Referring to FIG. 4, a second embodiment of the optical transceiver sub-module package structure of the present invention is different from the first embodiment in that the fiber concentrating assembly connector 60 and the metal casing 50 are different. The connection between the two is the same as that of the first embodiment, and the other structures are not described herein. Referring to FIG. 5, a third embodiment of the optical transmission sub-module package structure of the present optical fiber communication is improved, wherein the laser diode assembly 111 is a surface-emitting laser diode chip 32. The circumference M342609 of the encapsulant 322 of the laser diode package 32 omits the metal casing 5〇, and the joint of the fiber concentrating group connector 6〇 and the side-emitting laser diode chip 32 is packaged. The glue 33 is adhered; the other structure is the same as that of the first embodiment, and will not be described again. Referring to FIG. 6 , a fourth embodiment of the improved light-emitting sub-module package structure of the optical fiber communication of the present invention, wherein the light source component adopts a package structure similar to the light source component of FIG. 1 or FIG. 5 , including a base. a seat 9, a side-emitting type laser diode 91 mounted on the base 9, a fixed cover 92 sleeved around the side-emitting type laser diode 91 or the surface-emitting type laser diode 91, and A metal casing 5 is provided around the base 9. The edge of the fixing cover 92 is welded to the groove dug by the base 9, and a hole is formed at the position of the side-emitting type laser diode 91, and a plane or curved glass can be embedded in the hole, or the hole can be embedded in the hole Do not embed glass. The focusing sphere in Fig. 1 is omitted, and the collecting sphere 311 on the optical concentrating group connector 6 is condensed. The seam of the fiber concentrating assembly joint 60 and the metal sleeve 50 is modified by the sealing adhesive 33; the other structures are basically the same as those of the first embodiment, and are not described herein. Please refer to the seventh figure, which is the fifth actual complement of the optical fiber sub-module package structure of the present invention. The structure is basically the same as the fourth actual payment. The difference lies in that the fiber concentrating assembly connector 60 and the metal The members 70 are immersed or glued and joined to the joint of the metal casing 5 by laser welding. In order to make this creation more progressive and practical, a comparative analysis with the conventional products is as follows: Lack of use: L The laser diode package has a complex laser diode package structure with good yield problems. 2. The laser diode package structure of the conventional light-emitting sub-module, during the production process, a focusing ball needs to be embedded in the fixed cover, and the manufacturing process is complicated. 3. The cost is higher. M342609 4·The production speed is slow. Advantages of this creation·· 1. The laser diode package structure assembled in the light emission sub-module is simple and high.千千··························································································· A 3. The packaging material is inexpensive. 4. Labor costs are low. 5· Can be mass produced quickly. The creation design combines the concentrating sphere at the axis of the light concentrating assembly joint, and combines the side-emitting and surface-emitting laser diode assembly with the fiber concentrating assembly connector, and not only achieves the same as the packaging method is changed. The high-speed transmission, the cost incurred has dropped drastically, and the production speed has also been upgraded. In summary, the case is not only a major innovation in the technical thinking and industry, but also can improve the above-mentioned functions more than the conventional methods. Fully conform to the novelty and progressive statutory innovation patent requirements, 提出Proposed in accordance with the law ^Please, please ask the Bureau to approve the creation of this patent application, to encourage creation, to the sense of virtue. [Simple description of the diagram] The first figure is a sectional view of the package structure of the light-emitting sub-module of the conventional single-mode optical fiber. The first figure is a sectional view of a package structure of a light-emitting submodule of a conventional multimode fiber. The third figure is a cross-sectional view of the first embodiment of the light-emitting sub-module package of the optical communication of the present invention. The fourth figure is a cross-sectional view of a second embodiment of the improved light-emitting sub-module package structure of the optical fiber communication of the present invention. M342609 The fifth figure is a cross-sectional view of a third embodiment of the improved light-emitting sub-module package structure of the optical fiber communication of the present invention. Figure 6 is a cross-sectional view showing a fourth embodiment of the improved light-emitting sub-module package structure of the optical fiber communication of the present invention. Figure 7 is a cross-sectional view showing an embodiment of a light-emitting sub-module package structure of the optical communication of the present invention.义 [Main component symbol description] 2 metal base 3 fixed glue 4 sleeve 5 hollow ceramic sleeve 8 fiber ceramic ferrule 9 pedestal 10 laser diode assembly 27 light concentrating group joint (metal) 32 laser two Pole body wafer 33 encapsulant 35 trench 40 wire 50 metal casing 60 fiber concentrating group connector 70 metal member 80 light source component 91 laser diode M342609 92 fixed cover 93 space 95 focusing ball 110 bracket ill laser diode Component 311 concentrating sphere 315 housing space 322 epoxy package