WO2009008238A1 - 電子機器および冷却用ファンの固定方法 - Google Patents

電子機器および冷却用ファンの固定方法 Download PDF

Info

Publication number
WO2009008238A1
WO2009008238A1 PCT/JP2008/060678 JP2008060678W WO2009008238A1 WO 2009008238 A1 WO2009008238 A1 WO 2009008238A1 JP 2008060678 W JP2008060678 W JP 2008060678W WO 2009008238 A1 WO2009008238 A1 WO 2009008238A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling fan
electronic apparatus
depression
flange
projection
Prior art date
Application number
PCT/JP2008/060678
Other languages
English (en)
French (fr)
Inventor
Takashi Maeda
Original Assignee
Kabushiki Kaisha Yaskawa Denki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Yaskawa Denki filed Critical Kabushiki Kaisha Yaskawa Denki
Priority to JP2009522561A priority Critical patent/JP4947392B2/ja
Priority to CN2008800199338A priority patent/CN101683018B/zh
Publication of WO2009008238A1 publication Critical patent/WO2009008238A1/ja
Priority to US12/648,282 priority patent/US8434547B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

　冷却用ファンを取付けるための部材の材質を選ばず、冷却用ファンの取付け構造が簡単で組立て易く、冷却用ファンを取付けるための部材が少なく、コストの低い、電子機器および冷却用ファンの固定方法を提供することを目的とする。 　ハウジング（３）に冷却用ファン（１）のフランジ部の穴または凹部に契合する突起部（５）を形成し、ヒートシンク（２）に冷却用ファン（１）のフランジ部の穴または凹部に契合する突起部（６）を形成し、ハウジングの突起部（５）を冷却用ファンのフランジ部の穴または凹部に契合し、ヒートシンクの突起部（６）を冷却用ファンのフランジ部の穴または凹部に契合することにより、冷却用ファンを挟持する。
PCT/JP2008/060678 2007-07-10 2008-06-11 電子機器および冷却用ファンの固定方法 WO2009008238A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009522561A JP4947392B2 (ja) 2007-07-10 2008-06-11 電子機器および冷却用ファンの固定方法
CN2008800199338A CN101683018B (zh) 2007-07-10 2008-06-11 电子设备
US12/648,282 US8434547B2 (en) 2007-07-10 2009-12-28 Electronic apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-180996 2007-07-10
JP2007180996 2007-07-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/648,282 Continuation US8434547B2 (en) 2007-07-10 2009-12-28 Electronic apparatus

Publications (1)

Publication Number Publication Date
WO2009008238A1 true WO2009008238A1 (ja) 2009-01-15

Family

ID=40228417

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060678 WO2009008238A1 (ja) 2007-07-10 2008-06-11 電子機器および冷却用ファンの固定方法

Country Status (5)

Country Link
US (1) US8434547B2 (ja)
JP (1) JP4947392B2 (ja)
CN (1) CN101683018B (ja)
TW (1) TW200917944A (ja)
WO (1) WO2009008238A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5236771B2 (ja) * 2011-04-18 2013-07-17 株式会社ソニー・コンピュータエンタテインメント 電子機器
CN103365365A (zh) * 2012-03-28 2013-10-23 鸿富锦精密工业（深圳）有限公司 风扇固定装置
JP2014170459A (ja) * 2013-03-05 2014-09-18 Toshiba Corp 電子機器および放熱装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476096U (ja) * 1990-11-14 1992-07-02
JPH11340665A (ja) * 1998-05-26 1999-12-10 Yaskawa Electric Corp 電気機器の冷却装置
JP2000056861A (ja) * 1998-08-06 2000-02-25 Sony Corp 熱排出機構

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102785B2 (ja) * 1990-07-17 1994-12-14 工業技術院長 石炭液化法
JPH056892A (ja) 1991-06-27 1993-01-14 Mitsubishi Electric Corp 半導体装置
US5484013A (en) * 1993-05-27 1996-01-16 Nippon Densan Corporation Heat sink fan
US5341871A (en) * 1993-06-21 1994-08-30 General Motors Corporation Engine cooling fan assembly with snap-on retainers
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US5699854A (en) * 1996-11-08 1997-12-23 Hong; Chen Fu-In Miniature fan assembly for outputting air in a certain direction
US5927386A (en) * 1998-08-24 1999-07-27 Macase Industrial Group Ga., Inc. Computer hard drive heat sink assembly
CN2365857Y (zh) * 1999-03-30 2000-02-23 林浩正 散热器
US6302189B1 (en) * 2000-06-16 2001-10-16 Delta Electronics, Inc. Engagement structure of a fan
JP3996338B2 (ja) 2000-10-19 2007-10-24 日本電産株式会社 ファン冷却装置
US6690576B2 (en) * 2001-07-31 2004-02-10 Hewlett Packard Development Company, L.P. Externally mounted on-line replaceable fan module
US6587342B1 (en) * 2002-07-23 2003-07-01 Inventec Corporation Snap coupling cooling fan module
JP2005093662A (ja) * 2003-09-17 2005-04-07 Pioneer Electronic Corp 冷却装置及び冷却装置を備えた電子機器
CN100342530C (zh) * 2004-07-30 2007-10-10 奇鋐科技股份有限公司 具有导引风管及风罩的散热模组
TWI314033B (en) * 2007-01-23 2009-08-21 Sunonwealth Electr Mach Ind Co Mini heat dissipating module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476096U (ja) * 1990-11-14 1992-07-02
JPH11340665A (ja) * 1998-05-26 1999-12-10 Yaskawa Electric Corp 電気機器の冷却装置
JP2000056861A (ja) * 1998-08-06 2000-02-25 Sony Corp 熱排出機構

Also Published As

Publication number Publication date
US8434547B2 (en) 2013-05-07
CN101683018A (zh) 2010-03-24
CN101683018B (zh) 2011-09-21
US20100101766A1 (en) 2010-04-29
JP4947392B2 (ja) 2012-06-06
JPWO2009008238A1 (ja) 2010-09-02
TW200917944A (en) 2009-04-16

Similar Documents

Publication Publication Date Title
US8443987B2 (en) Mounting apparatus for electronic device
US7352574B2 (en) Assembly and heat-dissipating device having the same assembly
WO2008123909A3 (en) Fan with strut-mounted electronic components
US9468125B2 (en) Electronic device
US20110249404A1 (en) Mounting apparatus and mounting assembly for heat dissipating component
US8517678B2 (en) Heat dissipating assembly
US20110317342A1 (en) Mounting apparatus for expansion card
US9110638B2 (en) Pointing device
WO2009008238A1 (ja) 電子機器および冷却用ファンの固定方法
US20110241506A1 (en) Mounting apparatus for fan
US8625271B2 (en) Mounting apparatus for PCI card
US9060425B2 (en) Electronic device enclosure
US8737069B2 (en) Electronic device with fan
US20120168120A1 (en) Heat dissipating device
US20130075567A1 (en) Heat dissipating device supporting apparatus
US20130170898A1 (en) Mounting apparatus for computer keyboard
US20120145723A1 (en) Enclosure with mounting member
US20110155345A1 (en) Mounting apparatus for heat dissipating member
US20130068922A1 (en) Mounting device for fan
US8822819B2 (en) Server enclosure
US20140116671A1 (en) Heat sink assembly
FR2877537B1 (fr) Boitier microelectronique multiplans
EP1648066A8 (de) Aufputzmontagevorrichtung
TW200740349A (en) Mounting apparatus for fan
US20120014781A1 (en) Mounting apparatus and fan assembly using the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880019933.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08765457

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009522561

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08765457

Country of ref document: EP

Kind code of ref document: A1