WO2009001264A1 - Dispositif d'émission de lumière - Google Patents

Dispositif d'émission de lumière Download PDF

Info

Publication number
WO2009001264A1
WO2009001264A1 PCT/IB2008/052446 IB2008052446W WO2009001264A1 WO 2009001264 A1 WO2009001264 A1 WO 2009001264A1 IB 2008052446 W IB2008052446 W IB 2008052446W WO 2009001264 A1 WO2009001264 A1 WO 2009001264A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive structure
output device
substrates
hole
light output
Prior art date
Application number
PCT/IB2008/052446
Other languages
English (en)
Inventor
Johannes W. Weekamp
Cornelis Slob
Marc A. De Samber
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Publication of WO2009001264A1 publication Critical patent/WO2009001264A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10376—Laminated safety glass or glazing containing metal wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B32B17/1099—After-treatment of the layered product, e.g. cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light output device comprising at least one light source and a conductive structure electrically connected to said light source , said light source and conductive structure being sandwiched between substrates.
  • the present invention also relates to a method for manufacturing a light output device.
  • LEDs Light emitting diodes
  • FTO structured conductive layer
  • Such a laminated glass structure is typically manufactured by permanently bonding two or more glass plates with an interlayer, for instance polyvinylbutyral (PVB), under heat and pressure, to create a single structure.
  • the conductive layer can be connected to an external power supply using copper foils, which are also embedded in the glass structure. In an existing method the glass plates are broken in order to connect an external power supply to the copper foils.
  • this method has the drawback that a strip of glass over the full length of the breaking zone is generated, i.e. an inaccurate amount of glass material is removed from the glass structure.
  • a further drawback with this method is that optical properties may be affected in an uncontrollable manner.
  • a light output device comprising at least one light source and a conductive structure electrically connected to said light source, said light source and conductive structure being sandwiched between substrates. At least one of said substrates is provided with a through hole exposing at least part of said conductive structure, thereby enabling electrical interconnection between said conductive structure and an external power supply.
  • the conductive structure can be exposed at certain selected positions.
  • the size of the exposure can be adapted to the size of a power supply connection in order to minimize the loss of substrate material.
  • a through hole may be realized by using a prefabricated substrate having a through hole. Alternatively, a through hole may be provided after laminating the substrates.
  • the light sources may be any kind of light sources suitable for use in an illumination panel, such as, for example, semiconductor-based light sources, including light- emitting diodes (LEDs) and semiconductor lasers, organic light emitting diodes (OLEDs), or fluorescent light sources.
  • semiconductor-based light sources including light- emitting diodes (LEDs) and semiconductor lasers, organic light emitting diodes (OLEDs), or fluorescent light sources.
  • the conductive structure comprises at least two conductive wires, to which the light sources are arranged. Each light source is electrically coupled to at least two adjacent wires. Since one of the substrates is provided with one or several through holes the wires are exposed to the outside world enabling easy connection with a power supply in order to power the light sources. For instance, light emitting diodes (LEDs) are suitable to be arranged on such conductive wires.
  • LEDs light emitting diodes
  • an inner surface of said through hole is coated with a conductive layer, such as a metal layer, which can be electrically connected to the conductive structure.
  • the conductive layer is connectable to an external power supply.
  • the conductive layer provides for a robust connection between the conductive structure and an external power supply.
  • each individual wire will stick out and establish contact with the coated surface of the hole.
  • the wire may be permanently connected to the metallization by a soldering process, in which a solder wets both the through hole metal and the wire.
  • a solder wets both the through hole metal and the wire.
  • the conductive structure may comprise a structured thin film layer, such as a transparent FTO or ITO layer, in order to enable power supply of the light sources.
  • the light output device e.g. comprises an enforcement element electrically connected to the thin film layer.
  • an enforcement element provides for a robust connection between an external power supply and the thin film layer.
  • the enforcement element forms a resistance protecting the thin film layer from being damaged by the action of the through hole generation.
  • the enforcement element may be formed by a metal strip. Alternatively, the enforcement element may be formed by a sheet of conductive eleastomer.
  • the light source device may comprise a plurality of light sources, wherein the conductive structure is arranged to electrically connect said light sources with each other.
  • the light source(s) is light emitting diode(s) (LED).
  • LEDs are durable structures with a long lifetime, which reduces the maintenance needed. Furthermore, they have low power consumption. By using LEDs, a cost-effective solution is thus achieved.
  • Fig. 1 shows a perspective view of a part of a light output device according to a first embodiment of the present invention.
  • Fig. 2 shows a perspective view of a part of a second embodiment according to the present invention.
  • Fig. 3 shows a sectional view of a part of the embodiment shown in Fig. 2.
  • Fig. 4 shows steps of a method for the manufacturing of a light source device according to an embodiment of the present invention.
  • Fig. 5 shows steps of an alternative method for the manufacturing of a light source device according to an embodiment of the present invention.
  • Fig. 1 is a schematic, perspective view of a part of a light output device 1 according to a first embodiment of the present invention.
  • the light output device 1 comprises a plurality of light sources, in this case light emitting diodes 2 (LEDs) arranged in a LED array grid 3.
  • the LED array grid 3 further comprises a conductive structure 4, which in this embodiment is formed by a number of electrically conducting wires 5.
  • Each LED 2 is electrically coupled to at least two adjacent wires 5.
  • the LED array grid 3 is sandwiched between two substrates, in this case glass plates 6 and 7.
  • the space between the glass plates 6 and 7 is filled with polyvinylbutyral (PVB) 10.
  • the PVB provides a strong sandwich structure by bonding the glass plates and also reduces reflections due to the optical properties ofPVB.
  • At least one through hole 8 is provided in one of the substrates in order to expose the conductive structure 4 and thereby enable interconnection between the conductive structure 4 and an external power supply (not shown).
  • a number of through holes 8 are provided in the upper glass plate 7 exposing wires 5 of the conductive structure 4, see enlarged part of Fig. 1.
  • an inner surface of each through hole 8 is coated with a conductive layer, such as metal 9.
  • the wires 5 of the LED array grid 3 are aligned with through holes 8 in such a way that individual wires 5 will stick out and establish contact with the metal 9 of a through hole 8.
  • wires 5 may be permanently connected to the metal 9 by means of a soldering process, in which a solder wets both the metal 9 and the wire 5.
  • soldering it is however also possible to directly connect a power source to the exposed wires, for instance using soldering.
  • the through holes are not coated with a conductive layer as in the embodiment shown in Fig. 1.
  • an external power supply may be connected to the wires by means of soldering.
  • Fig. 2 shows a perspective view of a part of a light source device 1 according to a second embodiment.
  • the LEDs are in the second embodiment electrically connected by means of a conductive structured thin film layer 15, such as ITO or FTO layer.
  • Conductive enforcement elements 16, in this case formed by metal strips, that are electrically connected to the conductive structured thin film layer 15, are provided between the laminated glass plates 6, 7. The enforcement elements 16 are electrically connected to different layers of the thin film layer 15 to enable a power supply to the LEDs (not shown).
  • Through holes 8 are provided in the upper substrate 7 to expose the enforcement element 16 for enabling interconnection of the conductive structure 4 with an external power supply (not shown).
  • an external power supply may be connected to the enforcement element(s) by means of soldering.
  • the space between the glass plates 6 and 7 is filled with glue, such as PVB 10, see Fig. 3, which shows a sectional view of a through hole area of the embodiment disclosed in Fig. 2.
  • Fig. 4 shows selected steps of a method for the manufacturing of a light source device according to an embodiment of the present invention.
  • a glass plate is provided with through holes.
  • the through holes may be provided using powder blasting.
  • a blasting mask exposing the glass plate where it is desired to remove material, is then provided on the glass plate to be processed.
  • Through holes are then generated by directing a jet of abrasive powder onto the surface of the mask, which is present on the glass plate to be processed. It is also possible to carry out the powder blasting without using a mask. In this case, small nozzles may be used in order to direct the jet of abrasive powder to selected areas for providing through holes.
  • the through holes are currently preferably generated at the periphery of the glass plate. The number and location of through holes are adapted to the present need of connections for the actual LED array grid.
  • the through holes are holes through at least one of the two glass plates. After the blasting process, the blast-resistant material is removed in case of using a mask.
  • each trough hole is then optionally coated with a conductive layer, such as a metal layer, in step S2.
  • a conductive layer such as a metal layer
  • step S3 there is provided a LED array grid, in this case a LEDs-on-wire grid, on top of the glass plate with through holes.
  • a method for manufacturing such a LED array grid per se is disclosed in non-prepublished European patent application No. 06125674.9, herein incorporated by reference.
  • step S4 the wires of the LED array grid are aligned with the holes, so as to enable access of the wires through the holes.
  • step S3 a structured thin film conducting layer, such as an ITO or FTO layer, is first applied on the glass plate, for instance using laser. Then, a LED array grid comprising a number of LEDs is provided on the assembly and connected to the conducting layer.
  • step S4 includes providing enforcement elements in alignment with the holes, and are electrically connected to the structured thin film layer.
  • a bonding layer such as polyvinylbutyral (PVB) is applied on top of the LEDs and/or wires, in step S5.
  • PVB polyvinylbutyral
  • a second substrate is then provided on top of the LED array grid 3 and the PVB in order to sandwich the LED array grid between the first and the second glass plates, in step S6.
  • step S7 the glass plates are then laminated by permanently bonding the glass plates with the bonding interlayer, under heat and pressure, to create a single structure.
  • the polyvinylbutyral (PVB) provides for a strong sandwich structure bonding the glass plates.
  • each individual wire will stick out and establish contact with the conductive layer provided on an inner surface of a through hole.
  • the wire may be permanently connected to the conductive layer by a soldering process, in which a solder wets both the conductive layer provided on an inner surface of a through hole and the wire.
  • Fig 5 shows selected steps of an alternative method for the manufacturing of a light source device according to an embodiment of the present invention.
  • a LED array grid such as a LEDs-on- wire or a grid comprising a number of LEDs, as described above, on top of the glass plate.
  • a structured thin film layer such as an ITO or FTO layer
  • a LED array grid comprising a number of LEDs and enforcement elements are provided on the assembly.
  • a bonding layer such as polyvinylbutyral (PVB) is applied on top of the LEDs and/or wires and/or enforcement elements.
  • PVB polyvinylbutyral
  • step S 13 the glass plates are laminated, as described above, in step S 13.
  • the laminated sandwich structure is provided with through holes, for instance using powder blasting in the same manner as described above.
  • the trough holes are provided at selected areas in order to expose wires of the LEDs on wire grid.
  • the holes are provided to expose the enforcement elements, which are electrically connected to the conductive layer. Providing through holes after laminating, as described here, is possible since the wires respective the enforcement elements will resist the action of the abrasive powder.
  • the substrates embedding the LED array grid are formed by transparent glass plates.
  • transparent organic films like PET may be used.
  • through holes are e.g. generated using punching.
  • the coated through holes are easy-to-contact more macroscopic parts for further connections to the outside world. Direct soldering of external wires, flexible substrates and even attachment of active circuitry (e.g. packaged ICs) onto the coated through hole or its footprint around is becomes possible. Furthermore, a LED connection method based on FTO conductive patterns may be combined with electrically conductive wires. This might require the use of a conductive adhesive process to electrically bond the wire to the metal layer on the through hole.
  • the LED array grid is bonded to the glass plates by means of lamination using glue between the plates.
  • the LED array grid can also be bonded to the glass plate by means of self-bonding wires.
  • Such wires are coated with a first strong isolating layer - this layer has a high melting point (>300°C) - and a second isolation layer with a lower melting point ( ⁇ 200°C).
  • This second layer is in case of making coils used for bonding the wires within a coil to make it rigid.
  • the heat can be applied by a current through the wires or by placing the coil in an oven, it is also possible to use a solvent to obtain adhesion.
  • the same bonding principle can be used by applying temperature and pressure on the glass-LED sandwich structure.
  • An alternative option of laminating the sandwich structure is filling the space between the glass plates with a liquid material that solidifies by curing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un dispositif d'émission de lumière (1) comprenant au moins une source lumineuse (2) et une structure conductrice (4) reliée électriquement à ladite source lumineuse (2), ladite source lumineuse (2) et ladite structure conductrice (4) étant prises en sandwich entre des substrats (6, 7). Le dispositif d'émission de lumière (1) est caractérisé en ce qu'au moins un desdits substrats (6, 7) présente un trou traversant (8) exposant au moins une partie de ladite structure conductrice (4), permettant ainsi une interconnexion électrique entre ladite structure conductrice (4) et un bloc d'alimentation externe. La présente invention concerne également un procédé de fabrication d'un dispositif d'émission de lumière.
PCT/IB2008/052446 2007-06-27 2008-06-20 Dispositif d'émission de lumière WO2009001264A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07111117.3 2007-06-27
EP07111117 2007-06-27

Publications (1)

Publication Number Publication Date
WO2009001264A1 true WO2009001264A1 (fr) 2008-12-31

Family

ID=39930663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/052446 WO2009001264A1 (fr) 2007-06-27 2008-06-20 Dispositif d'émission de lumière

Country Status (2)

Country Link
TW (1) TW200916685A (fr)
WO (1) WO2009001264A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124244A (ja) * 2010-12-07 2012-06-28 Sony Chemical & Information Device Corp 半導体素子の実装方法、及び実装体
WO2013041266A1 (fr) * 2011-09-20 2013-03-28 Agc Glass Europe Panneau de vitrage comprenant une première feuille de verre revêtue au moins partiellement d'un revêtement conducteur de l'électricité
CN103968287A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 大芯片垂直布置的led光机模组
WO2018142078A1 (fr) * 2017-02-03 2018-08-09 Saint-Gobain Glass France Vitrage feuillete dont une seule feuille de verre presente un trou traversant
JP2019050379A (ja) * 2012-08-31 2019-03-28 日亜化学工業株式会社 発光装置及びその製造方法
EP2401639B1 (fr) * 2009-02-24 2019-09-18 AGC Glass Europe Panneau d'éclairage diffus en verre stratifié et son procédé de fabrication

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0835743A2 (fr) * 1996-09-13 1998-04-15 Ppg Industries, Inc. Dispositif et procédé pour fixer une connexion électrique à un article transparent stratifié
EP1346822A1 (fr) * 2002-03-17 2003-09-24 Döppner Bauelemente GmbH & Co. KG Elément de toit pour bâtiments
US20060292380A1 (en) * 2003-05-28 2006-12-28 Saint-Govain Glass France Laminated element provided with a heated layer
WO2007057461A1 (fr) * 2005-11-21 2007-05-24 Agc Flat Glass Europe Sa Vitrage feuillete et procede de fabrication d'un vitrage feuillete

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0835743A2 (fr) * 1996-09-13 1998-04-15 Ppg Industries, Inc. Dispositif et procédé pour fixer une connexion électrique à un article transparent stratifié
EP1346822A1 (fr) * 2002-03-17 2003-09-24 Döppner Bauelemente GmbH & Co. KG Elément de toit pour bâtiments
US20060292380A1 (en) * 2003-05-28 2006-12-28 Saint-Govain Glass France Laminated element provided with a heated layer
WO2007057461A1 (fr) * 2005-11-21 2007-05-24 Agc Flat Glass Europe Sa Vitrage feuillete et procede de fabrication d'un vitrage feuillete

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2401639B1 (fr) * 2009-02-24 2019-09-18 AGC Glass Europe Panneau d'éclairage diffus en verre stratifié et son procédé de fabrication
JP2012124244A (ja) * 2010-12-07 2012-06-28 Sony Chemical & Information Device Corp 半導体素子の実装方法、及び実装体
WO2013041266A1 (fr) * 2011-09-20 2013-03-28 Agc Glass Europe Panneau de vitrage comprenant une première feuille de verre revêtue au moins partiellement d'un revêtement conducteur de l'électricité
BE1020255A3 (fr) * 2011-09-20 2013-07-02 Agc Glass Europe Panneau de vitrage comprenant une permiere feuille de verre revetue au moins partiellement d'un revetement conducteur de l'electricite.
EA026828B1 (ru) * 2011-09-20 2017-05-31 Агк Гласс Юроп Панель остекления и способ ее изготовления
US10036193B2 (en) 2011-09-20 2018-07-31 Agc Glass Europe Glass panel including a first glass sheet at least partially coated with an electrically conductive coating
JP2019050379A (ja) * 2012-08-31 2019-03-28 日亜化学工業株式会社 発光装置及びその製造方法
CN103968287A (zh) * 2014-05-20 2014-08-06 贵州光浦森光电有限公司 大芯片垂直布置的led光机模组
FR3062594A1 (fr) * 2017-02-03 2018-08-10 Saint-Gobain Glass France Vitrage feuillete dont une seule feuille de verre presente un trou traversant
WO2018142078A1 (fr) * 2017-02-03 2018-08-09 Saint-Gobain Glass France Vitrage feuillete dont une seule feuille de verre presente un trou traversant
CN110225822A (zh) * 2017-02-03 2019-09-10 法国圣戈班玻璃厂 在层压玻璃中的单个玻璃板具有通孔的层压玻璃
JP2020507543A (ja) * 2017-02-03 2020-03-12 サン−ゴバン グラス フランス １つのガラス板が貫通孔を有する積層ガラス
RU2752347C2 (ru) * 2017-02-03 2021-07-26 Сэн-Гобэн Гласс Франс Многослойное остекление, в котором только один стеклянный лист имеет сквозное отверстие
US11148399B2 (en) 2017-02-03 2021-10-19 Saint-Gobain Glass France Laminated glass in which a single glass sheet has a through-hole
JP7137572B2 (ja) 2017-02-03 2022-09-14 サン－ゴバン グラス フランス １つのガラス板が貫通孔を有する積層ガラス
CN110225822B (zh) * 2017-02-03 2023-02-07 法国圣戈班玻璃厂 在层压玻璃中的单个玻璃板具有通孔的层压玻璃

Also Published As

Publication number Publication date
TW200916685A (en) 2009-04-16

Similar Documents

Publication Publication Date Title
US8558255B2 (en) LED chip-based lighting products and methods of building
US7777238B2 (en) Chip-type light emitting device and wiring substrate for the same
US7947516B2 (en) LED packaging methods and LED-based lighting products
CN103210490A (zh) 用于通用照明的固态光片或条
US20080284330A1 (en) Light Emitting Module, and Method for Producing the Same
WO2009001264A1 (fr) Dispositif d'émission de lumière
TWI809246B (zh) 固晶結構及其製造方法
US20130062633A1 (en) LED Array Having Embedded LED and Method Therefor
JP2009535799A (ja) Ｌｅｄアレイグリッド、前記ｌｅｄグリッド、及び前記において使用するｌｅｄコンポーネントを作製する方法並びに装置
JP6856627B2 (ja) 接続支持体を製造するための方法、接続支持体、ならびに接続支持体を備えているオプトエレクトロニクス半導体モジュール
JP2012174808A (ja) 発光素子搭載用基板および発光装置
US20090015168A1 (en) Flat Lighting Device
KR101495409B1 (ko) 표면 탑재 파워 ｌｅｄ 지지부를 위한 제조 방법 및 그 제품
WO2021110332A1 (fr) Fenêtre ou surface d'un véhicule comprenant au moins un composant optoélectronique
JP2015192095A (ja) Ｌｅｄ発光装置及びｌｅｄ発光装置の製造方法
US8030753B2 (en) Semiconductor device and method for making the same
JP2004193357A (ja) Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
US20080018556A1 (en) Method for Micropackaging of Leds and Micropackage
JP3858879B2 (ja) ライトユニット
US20140335635A1 (en) Electronic assemblies including a subassembly film and methods of producing the same
JP2019523560A (ja) 発光デバイス及びその製造方法
JP2007329370A (ja) 発光装置および発光装置の製造方法
JP2008159671A (ja) プリント配線基板および電子装置
JP6327865B2 (ja) 回路基板、オプトエレクトロニクスモジュールならびにオプトエレクトロニクスモジュールを有する装置
JP4453004B2 (ja) 発光素子搭載用の配線基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08763403

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08763403

Country of ref document: EP

Kind code of ref document: A1