WO2008149922A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- WO2008149922A1 WO2008149922A1 PCT/JP2008/060348 JP2008060348W WO2008149922A1 WO 2008149922 A1 WO2008149922 A1 WO 2008149922A1 JP 2008060348 W JP2008060348 W JP 2008060348W WO 2008149922 A1 WO2008149922 A1 WO 2008149922A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- trench
- channel
- region
- semiconductor device
- peripheral portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
- H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/025—Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Abstract
オン抵抗を大幅に低減することが可能な新しい動作原理に基づく半導体装置を提供する。この半導体装置(50)は、n型エピタキシャル層(2)と、このn型エピタキシャル層(2)に形成され、内部に埋め込み電極5が設けられたトレンチ(3)と、n型エピタキシャル層(2)の上面側の所定領域に、平面的に見て、トレンチ(3)と所定の間隔を隔てて形成されたp+型不純物領域(2a)とを備えている。そして、トレンチ(3)とp+型不純物領域(2a)との間の領域がチャネル(9)となり、トレンチ(3)の周辺に形成される空乏層(10b)とp+型不純物領域(2a)の周辺に形成される空乏層(10a)とで、チャネル(9)を塞ぐことにより、チャネル(9)を流れる電流が遮断される一方、トレンチ(3)の周辺の空乏層(10b)を消滅させることにより、チャネル(9)を介して電流が流れるように構成されている。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-150437 | 2007-06-06 | ||
| JP2007150437A JP5389339B2 (ja) | 2007-06-06 | 2007-06-06 | 半導体装置 |
| JP2007-153761 | 2007-06-11 | ||
| JP2007153761A JP5207666B2 (ja) | 2007-06-11 | 2007-06-11 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008149922A1 true WO2008149922A1 (ja) | 2008-12-11 |
Family
ID=40093733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/060348 Ceased WO2008149922A1 (ja) | 2007-06-06 | 2008-06-05 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008149922A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2975531A1 (fr) * | 2011-05-16 | 2012-11-23 | St Microelectronics Tours Sas | Diode schottky verticale controlee |
| EP2482315A4 (en) * | 2010-10-29 | 2013-08-28 | Panasonic Corp | SEMICONDUCTOR COMPONENT |
| JP2015225976A (ja) * | 2014-05-28 | 2015-12-14 | 株式会社東芝 | 半導体装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04261065A (ja) * | 1991-01-29 | 1992-09-17 | Mitsubishi Electric Corp | 半導体装置 |
| JP2000332239A (ja) * | 1999-05-17 | 2000-11-30 | Nissan Motor Co Ltd | 電界効果トランジスタ |
| JP2006190807A (ja) * | 2005-01-06 | 2006-07-20 | Hitachi Ltd | シリコンカーバイド静電誘導トランジスタ |
-
2008
- 2008-06-05 WO PCT/JP2008/060348 patent/WO2008149922A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04261065A (ja) * | 1991-01-29 | 1992-09-17 | Mitsubishi Electric Corp | 半導体装置 |
| JP2000332239A (ja) * | 1999-05-17 | 2000-11-30 | Nissan Motor Co Ltd | 電界効果トランジスタ |
| JP2006190807A (ja) * | 2005-01-06 | 2006-07-20 | Hitachi Ltd | シリコンカーバイド静電誘導トランジスタ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2482315A4 (en) * | 2010-10-29 | 2013-08-28 | Panasonic Corp | SEMICONDUCTOR COMPONENT |
| US8742427B2 (en) | 2010-10-29 | 2014-06-03 | Panasonic Corporation | Semiconductor element |
| FR2975531A1 (fr) * | 2011-05-16 | 2012-11-23 | St Microelectronics Tours Sas | Diode schottky verticale controlee |
| JP2015225976A (ja) * | 2014-05-28 | 2015-12-14 | 株式会社東芝 | 半導体装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008156071A1 (ja) | 半導体装置 | |
| WO2008057438A3 (en) | Power switching semiconductor devices including rectifying junction-shunts | |
| WO2008153142A1 (ja) | 半導体装置 | |
| TW200620679A (en) | Semiconductor device and methods for the production thereof | |
| TW200616217A (en) | Image sensor and pixel having a non-conzex photodiode | |
| TW200605231A (en) | Silicon carbide devices with hybrid well regions and methods of fabricating silicon carbide devices with hybrid well regions | |
| WO2009050871A1 (ja) | 半導体装置およびその製造方法 | |
| WO2006041823A3 (en) | Mos-gated transistor with reduced miller capacitance | |
| WO2009102651A3 (en) | Edge termination with improved breakdown voltage | |
| WO2005070009A3 (en) | Enhancement mode iii-nitride fet | |
| TW200501420A (en) | Double-gate transistor with enhanced carrier mobility | |
| WO2004042851A3 (en) | Structured silicon anode | |
| TW200705641A (en) | Initial-on SCR device for on-chip ESD protection | |
| TW200612556A (en) | LDMOS transistor | |
| TW200707728A (en) | Semiconductor device and method of fabricating the same | |
| WO2007036456A3 (de) | Sic-pn-leistungsdiode | |
| WO2008099597A1 (ja) | 半導体装置及びその製造方法 | |
| TW200625645A (en) | Trench MOSFET and method of manufacturing same | |
| WO2005119778A3 (en) | Field effect transistor | |
| TW200703647A (en) | Ultrathin-body schottky contact MOSFET | |
| WO2008156070A1 (ja) | 半導体装置 | |
| EP1755168A3 (en) | Deep N diffusion for trench IGBT | |
| WO2008149922A1 (ja) | 半導体装置 | |
| TW200608572A (en) | Semiconductor device | |
| TW200709333A (en) | Method for fabricating semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08765161 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 08765161 Country of ref document: EP Kind code of ref document: A1 |