WO2008149772A1 - 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置 - Google Patents

電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置 Download PDF

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Publication number
WO2008149772A1
WO2008149772A1 PCT/JP2008/059908 JP2008059908W WO2008149772A1 WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1 JP 2008059908 W JP2008059908 W JP 2008059908W WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component mounting
film
conductor layer
insulating film
Prior art date
Application number
PCT/JP2008/059908
Other languages
English (en)
French (fr)
Inventor
Makoto Yamagata
Noriaki Iwata
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2008532529A priority Critical patent/JPWO2008149772A1/ja
Publication of WO2008149772A1 publication Critical patent/WO2008149772A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Abstract

導体層と絶縁フィルムとの密着性に優れ、導体層をパターニングした後の絶縁フィルムの光線透過率が非常に高く且つ無色であり、ファインピッチの配線パターニングも可能で、且つ引張強度および耐折性などの特性に優れた電子部品実装用積層フィルム及び電子部品実装用フィルムキャリアテープを提供する。導体層１１上に絶縁フィルム１２が設けられた電子部品実装用積層フィルム２０であって、前記導体層１１が、３μｍ以上の長径長さを有する柱状の銅結晶粒子を含み、厚さ１５μｍ以下、２５°Cにおける伸び率５％以上の電解銅箔からなり、前記絶縁フィルム１２が、６７％を超え９５％以下の光線透過率を有すると共に実質的に無色であるポリイミド層からなる。
PCT/JP2008/059908 2007-06-08 2008-05-29 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置 WO2008149772A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008532529A JPWO2008149772A1 (ja) 2007-06-08 2008-05-29 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007153294 2007-06-08
JP2007-153294 2007-06-08

Publications (1)

Publication Number Publication Date
WO2008149772A1 true WO2008149772A1 (ja) 2008-12-11

Family

ID=40093588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059908 WO2008149772A1 (ja) 2007-06-08 2008-05-29 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置

Country Status (4)

Country Link
JP (1) JPWO2008149772A1 (ja)
KR (1) KR20100006575A (ja)
TW (1) TW200908272A (ja)
WO (1) WO2008149772A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015108191A1 (ja) * 2014-01-17 2015-07-23 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、銅張積層板、積層体及びプリント配線板の製造方法
JP2015172250A (ja) * 2015-05-11 2015-10-01 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JP2016157752A (ja) * 2015-02-23 2016-09-01 住友金属鉱山株式会社 フレキシブル配線用基板およびフレキシブル配線板
WO2016208609A1 (ja) * 2015-06-26 2016-12-29 住友金属鉱山株式会社 導電性基板
WO2018012553A1 (ja) * 2016-07-12 2018-01-18 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
CN108728874A (zh) * 2017-04-18 2018-11-02 长春石油化学股份有限公司 具有低反弹力的电解铜箔、其制造方法及其应用

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755773B (zh) * 2014-06-30 2022-02-21 日商半導體能源研究所股份有限公司 發光裝置，模組，及電子裝置
KR101866901B1 (ko) * 2016-10-12 2018-06-14 한국기계연구원 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법
GB2595291A (en) * 2020-05-21 2021-11-24 Mcmahon Raymond A putter head and a putter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05301958A (ja) * 1992-04-28 1993-11-16 Japan Synthetic Rubber Co Ltd ポリイミドおよびその製造法
JPH09328545A (ja) * 1996-06-10 1997-12-22 Toyobo Co Ltd 共重合ポリイミド樹脂
JP2006066814A (ja) * 2004-08-30 2006-03-09 Kyocera Chemical Corp 電子部品
JP2006199945A (ja) * 2004-12-24 2006-08-03 Mitsubishi Gas Chem Co Inc 低吸水性ポリイミド樹脂およびその製造方法
JP2007059892A (ja) * 2005-07-27 2007-03-08 Nippon Steel Chem Co Ltd 高屈曲性フレキシブル銅張積層板の製造方法
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05301958A (ja) * 1992-04-28 1993-11-16 Japan Synthetic Rubber Co Ltd ポリイミドおよびその製造法
JPH09328545A (ja) * 1996-06-10 1997-12-22 Toyobo Co Ltd 共重合ポリイミド樹脂
JP2006066814A (ja) * 2004-08-30 2006-03-09 Kyocera Chemical Corp 電子部品
JP2006199945A (ja) * 2004-12-24 2006-08-03 Mitsubishi Gas Chem Co Inc 低吸水性ポリイミド樹脂およびその製造方法
JP2007059892A (ja) * 2005-07-27 2007-03-08 Nippon Steel Chem Co Ltd 高屈曲性フレキシブル銅張積層板の製造方法
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015108191A1 (ja) * 2014-01-17 2015-07-23 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、銅張積層板、積層体及びプリント配線板の製造方法
JP2016157752A (ja) * 2015-02-23 2016-09-01 住友金属鉱山株式会社 フレキシブル配線用基板およびフレキシブル配線板
JP2015172250A (ja) * 2015-05-11 2015-10-01 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JPWO2016208609A1 (ja) * 2015-06-26 2018-04-26 住友金属鉱山株式会社 導電性基板
WO2016208609A1 (ja) * 2015-06-26 2016-12-29 住友金属鉱山株式会社 導電性基板
JP6341456B1 (ja) * 2016-07-12 2018-06-13 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
WO2018012553A1 (ja) * 2016-07-12 2018-01-18 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
JP2018156947A (ja) * 2016-07-12 2018-10-04 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
CN109478445A (zh) * 2016-07-12 2019-03-15 大日本印刷株式会社 图案化导电体、带导电体的片、发热板、交通工具和图案化导电体的制造方法
EP3486923A4 (en) * 2016-07-12 2020-03-11 Dai Nippon Printing Co., Ltd. PATTERNED CONDUCTOR, CONDUCTIVE SHEET, HEAT GENERATING PLATE, VEHICLE AND METHOD FOR PRODUCING PATTERNED CONDUCTOR
US11279323B2 (en) 2016-07-12 2022-03-22 Dai Nippon Printing Co., Ltd. Patterned conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of patterned conductor
JP7220994B2 (ja) 2016-07-12 2023-02-13 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
CN108728874A (zh) * 2017-04-18 2018-11-02 长春石油化学股份有限公司 具有低反弹力的电解铜箔、其制造方法及其应用

Also Published As

Publication number Publication date
KR20100006575A (ko) 2010-01-19
JPWO2008149772A1 (ja) 2010-08-26
TW200908272A (en) 2009-02-16

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