WO2008146448A1 - ピーラブル性を有する積層体およびその製造方法 - Google Patents

ピーラブル性を有する積層体およびその製造方法 Download PDF

Info

Publication number
WO2008146448A1
WO2008146448A1 PCT/JP2008/001164 JP2008001164W WO2008146448A1 WO 2008146448 A1 WO2008146448 A1 WO 2008146448A1 JP 2008001164 W JP2008001164 W JP 2008001164W WO 2008146448 A1 WO2008146448 A1 WO 2008146448A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
layer
conductive layer
heat
resistant base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001164
Other languages
English (en)
French (fr)
Inventor
Mikio Furukawa
Seiji Sejima
Yoshiaki Echigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to US12/310,219 priority Critical patent/US20090246554A1/en
Priority to JP2009516165A priority patent/JP5713560B2/ja
Publication of WO2008146448A1 publication Critical patent/WO2008146448A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

　耐熱性基材の少なくとも片面に金属導体層が形成されている。耐熱性基材は、金属導体層に対してピーラブルである。耐熱性基材は、金属箔または非熱可塑性ポリイミド樹脂製のフィルムであることが好適である。金属導体層は蒸着金属層および／またはめっき金属層であることが好適である。金属導体層が、耐熱性基材との界面に蒸着された金属層（Ｉ）と、蒸着または電気めっきにより金属層（Ｉ）上に形成された１層以上の金属層（ＩＩ）とを含むことが好適である。金属導体層上に、さらに、非熱可塑性ポリイミド系樹脂製の少なくとも１層の絶縁性フィルム層を積層することができる。
PCT/JP2008/001164 2007-05-23 2008-05-09 ピーラブル性を有する積層体およびその製造方法 Ceased WO2008146448A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/310,219 US20090246554A1 (en) 2007-05-23 2008-05-09 Laminate having peelability and production method therefor
JP2009516165A JP5713560B2 (ja) 2007-05-23 2008-05-09 ピーラブル性を有する積層体およびその製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007136969 2007-05-23
JP2007-136969 2007-05-23
JP2007160676 2007-06-18
JP2007-160676 2007-06-18
JP2007-188783 2007-07-19
JP2007188783 2007-07-19

Publications (1)

Publication Number Publication Date
WO2008146448A1 true WO2008146448A1 (ja) 2008-12-04

Family

ID=40074726

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001164 Ceased WO2008146448A1 (ja) 2007-05-23 2008-05-09 ピーラブル性を有する積層体およびその製造方法

Country Status (3)

Country Link
US (1) US20090246554A1 (ja)
JP (1) JP5713560B2 (ja)
WO (1) WO2008146448A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183604A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 多層プリント配線板の製造方法
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2013183605A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2013183607A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
JP2018056424A (ja) * 2016-09-30 2018-04-05 信越ポリマー株式会社 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法
JPWO2018139427A1 (ja) * 2017-01-25 2019-11-14 東洋紡株式会社 高分子フィルム積層基板およびフレキシブル電子デバイスの製造方法
WO2021199811A1 (ja) * 2020-04-03 2021-10-07 信越ポリマー株式会社 金属張積層板
WO2023074531A1 (ja) * 2021-10-26 2023-05-04 東洋鋼鈑株式会社 金属積層材及びその製造方法、並びにプリント配線板

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013181136A (ja) * 2012-03-02 2013-09-12 Fuji Xerox Co Ltd ポリイミド前駆体組成物、無端ベルトの製造方法、及び画像形成装置
JP6063183B2 (ja) * 2012-08-31 2017-01-18 パナソニックＩｐマネジメント株式会社 剥離可能銅箔付き基板及び回路基板の製造方法
WO2014080853A1 (ja) * 2012-11-22 2014-05-30 株式会社カネカ 双極型リチウムイオン二次電池用集電体および双極型リチウムイオン二次電池
CN103625029A (zh) * 2013-11-25 2014-03-12 许子寒 一种石墨烯导热器件
DE102014210483A1 (de) * 2014-06-03 2015-12-03 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung
US10348941B2 (en) * 2014-07-30 2019-07-09 Karl Storz Endovision, Inc. Durable flexible circuit assembly
US20160228678A1 (en) * 2015-01-02 2016-08-11 Pacific Diabetes Technologies Highly Durable Dual Use Catheter for Analyte Sensing and Drug Delivery
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112610A (ja) * 1992-09-25 1994-04-22 Mitsui Toatsu Chem Inc フレキシブル両面金属積層板の製造法
JPH088400B2 (ja) * 1991-05-01 1996-01-29 東洋メタライジング株式会社 キャリア
JP2001295079A (ja) * 2000-04-12 2001-10-26 Nikko Materials Co Ltd キャリヤ付き極薄銅箔及びその製造方法
JP2003033595A (ja) * 2001-05-30 2003-02-04 Sunstar Precision Co Ltd 多頭式刺繍機の駆動装置
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2007007937A (ja) * 2005-06-29 2007-01-18 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003145674A (ja) * 2001-11-08 2003-05-20 Learonal Japan Inc 樹脂複合材料の形成方法
JP2005285849A (ja) * 2004-03-26 2005-10-13 North:Kk 多層配線基板製造用層間部材とその製造方法
JP2006068920A (ja) * 2004-08-31 2006-03-16 Shin Etsu Chem Co Ltd フレキシブル銅箔ポリイミド積層板の製造方法
CN101232995B (zh) * 2005-08-04 2012-09-05 株式会社钟化 覆金属聚酰亚胺膜

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088400B2 (ja) * 1991-05-01 1996-01-29 東洋メタライジング株式会社 キャリア
JPH06112610A (ja) * 1992-09-25 1994-04-22 Mitsui Toatsu Chem Inc フレキシブル両面金属積層板の製造法
JP2001295079A (ja) * 2000-04-12 2001-10-26 Nikko Materials Co Ltd キャリヤ付き極薄銅箔及びその製造方法
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2003033595A (ja) * 2001-05-30 2003-02-04 Sunstar Precision Co Ltd 多頭式刺繍機の駆動装置
JP2007007937A (ja) * 2005-06-29 2007-01-18 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104334346B (zh) * 2012-06-04 2017-05-03 Jx日矿日石金属株式会社 附载体金属箔
WO2013183604A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 多層プリント配線板の製造方法
WO2013183605A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2013183607A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
CN104334346A (zh) * 2012-06-04 2015-02-04 Jx日矿日石金属株式会社 附载体金属箔
CN104619486A (zh) * 2012-06-04 2015-05-13 Jx日矿日石金属株式会社 附载体金属箔
JP2019084829A (ja) * 2012-06-04 2019-06-06 Ｊｘ金属株式会社 キャリア付金属箔
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
JP2018056424A (ja) * 2016-09-30 2018-04-05 信越ポリマー株式会社 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法
JPWO2018139427A1 (ja) * 2017-01-25 2019-11-14 東洋紡株式会社 高分子フィルム積層基板およびフレキシブル電子デバイスの製造方法
WO2021199811A1 (ja) * 2020-04-03 2021-10-07 信越ポリマー株式会社 金属張積層板
JPWO2021199811A1 (ja) * 2020-04-03 2021-10-07
JP7702935B2 (ja) 2020-04-03 2025-07-04 信越ポリマー株式会社 金属張積層板
WO2023074531A1 (ja) * 2021-10-26 2023-05-04 東洋鋼鈑株式会社 金属積層材及びその製造方法、並びにプリント配線板

Also Published As

Publication number Publication date
US20090246554A1 (en) 2009-10-01
JP5713560B2 (ja) 2015-05-07
JPWO2008146448A1 (ja) 2010-08-19

Similar Documents

Publication Publication Date Title
WO2008146448A1 (ja) ピーラブル性を有する積層体およびその製造方法
WO2008126426A1 (ja) 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法
MY163173A (en) Manufacturing method of multilayer printed wiring board
MY185462A (en) Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
MY151913A (en) Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layer
WO2008087972A1 (ja) 絶縁樹脂シート積層体、該絶縁樹脂シート積層体を積層してなる多層プリント配線板
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
WO2008146487A1 (ja) 回路基板およびその製造方法
PH12013501975A1 (en) Copper foil for printed circuit
WO2009050971A1 (ja) 金属被覆ポリイミド複合体及び同複合体の製造方法並びに電子回路基板の製造方法
JP2013008880A5 (ja)
WO2008084858A1 (ja) 電気接点材料、その製造方法、及び電気接点
MY171825A (en) Copper foil with carrier
WO2008055007A3 (en) Methods of fabricating a barrier layer with varying composition for copper metallization
MY167064A (en) Multilayer printed wiring board manufacturing method
WO2008153185A1 (ja) プリント配線板製造用の埋設銅めっき方法及びその埋設銅めっき方法を用いて得られるプリント配線板
WO2010014580A3 (en) Substrate with embedded patterned capacitance
JP2013065621A5 (ja)
TWI561373B (zh) 附載體銅箔、使用其之覆銅積層板、印刷配線板、印刷電路板及印刷配線板之製造方法
WO2008117711A1 (ja) 金属張り積層板と多層積層板並びにその製造方法
MY180430A (en) Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
WO2009145462A3 (ko) 금속 인쇄회로기판의 원판 및 그 원판의 제조 방법
MY154122A (en) Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
WO2006112474A3 (ja) 繊維－樹脂複合体、積層体、およびプリント配線板、並びにプリント配線板の製造方法
WO2008126642A1 (ja) 金属箔張積層板及びプリント配線板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08751688

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12310219

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2009516165

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08751688

Country of ref document: EP

Kind code of ref document: A1