WO2008143196A1 - ポリフェニレンエーテル系樹脂組成物 - Google Patents
ポリフェニレンエーテル系樹脂組成物 Download PDFInfo
- Publication number
- WO2008143196A1 WO2008143196A1 PCT/JP2008/059084 JP2008059084W WO2008143196A1 WO 2008143196 A1 WO2008143196 A1 WO 2008143196A1 JP 2008059084 W JP2008059084 W JP 2008059084W WO 2008143196 A1 WO2008143196 A1 WO 2008143196A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyphenylene ether
- resin composition
- ether resin
- mass
- contained
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/02—Polysilicates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
- Polyethers (AREA)
Abstract
(A)ポリフェニレンエーテルと、 (B)(B-1)籠型シルセスキオキサン及び/又は籠型シルセスキオキサンの部分開裂構造体、(B-2)ホスフィン酸塩類よりなる群から選ばれる1種以上と、 を含むポリフェニレンエーテル系樹脂組成物であって、 前記(A)成分が、(a-1)2,6-ジメチルフェノールと、(a-2)2,3,6-トリメチルフェノールと、を含むフェノール類を重合した共重合体を含み、 前記(A)成分中の(a-1)及び(a-2)からなる構造単位の合計100質量%に対し、(a-1)からなる構造単位が60~90質量%、(a-2)からなる構造単位が10~40質量%である、樹脂組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009515219A JPWO2008143196A1 (ja) | 2007-05-17 | 2008-05-16 | ポリフェニレンエーテル系樹脂組成物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007131167 | 2007-05-17 | ||
JP2007-131167 | 2007-05-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008143196A1 true WO2008143196A1 (ja) | 2008-11-27 |
Family
ID=40031895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059084 WO2008143196A1 (ja) | 2007-05-17 | 2008-05-16 | ポリフェニレンエーテル系樹脂組成物 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2008143196A1 (ja) |
WO (1) | WO2008143196A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009197196A (ja) * | 2008-02-25 | 2009-09-03 | Asahi Kasei Chemicals Corp | 樹脂組成物 |
JP2010241876A (ja) * | 2009-04-01 | 2010-10-28 | Asahi Kasei Chemicals Corp | ポリフェニレンエーテル |
JP2010265380A (ja) * | 2009-05-14 | 2010-11-25 | Asahi Kasei Chemicals Corp | 熱可塑性樹脂組成物及びその成形体 |
JP2012082348A (ja) * | 2010-10-13 | 2012-04-26 | Asahi Kasei Chemicals Corp | ポリフェニレンエーテル |
JP2014504673A (ja) * | 2011-02-01 | 2014-02-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 組み合わせた安定剤を含んでなる硬化性組成物 |
WO2015064469A1 (ja) * | 2013-10-28 | 2015-05-07 | 帝人デュポンフィルム株式会社 | 難燃性二軸配向ポリエステルフィルム、それからなる難燃性ポリエステルフィルム積層体およびフレキシブル回路基板 |
CN105801865A (zh) * | 2016-03-23 | 2016-07-27 | 合肥学院 | 一种含磷氮笼型聚倍半硅氧烷及其制备方法 |
JP2016165815A (ja) * | 2015-03-09 | 2016-09-15 | 帝人株式会社 | 成形加工に用いる金属積層体 |
JP2016181602A (ja) * | 2015-03-24 | 2016-10-13 | 帝人デュポンフィルム株式会社 | フレキシブル回路基板用難燃性二軸配向ポリエステルフィルム、およびそれからなるフレキシブル回路基板 |
US20180229398A1 (en) * | 2015-08-12 | 2018-08-16 | Ube Industries, Ltd. | Resin granule mass, resin film, separator, sorting device, and sorting method |
CN110492092A (zh) * | 2019-07-24 | 2019-11-22 | 宁波双鹿新能源科技有限公司 | 一种稀土合金掺杂的锌锰电池及其制备方法 |
JP2020143265A (ja) * | 2019-02-28 | 2020-09-10 | 太陽ホールディングス株式会社 | 硬化性組成物、ドライフィルム、硬化物および電子部品 |
CN115894932A (zh) * | 2022-11-11 | 2023-04-04 | 广东省科学院化工研究所 | 一种聚芳酯单体及其制备方法和应用 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5217880B2 (ja) * | 1974-05-25 | 1977-05-18 | ||
JP2001335699A (ja) * | 2000-05-30 | 2001-12-04 | Daicel Chem Ind Ltd | 難燃性樹脂組成物 |
WO2002059208A1 (fr) * | 2001-01-24 | 2002-08-01 | Asahi Kasei Kabushiki Kaisha | Compositions de résines à base d'éther de polyphénylène contenant des composés de silicium |
JP2004051889A (ja) * | 2002-07-23 | 2004-02-19 | Asahi Kasei Corp | ポリフェニレンエーテル樹脂組成物 |
JP2004107511A (ja) * | 2002-09-19 | 2004-04-08 | Asahi Kasei Chemicals Corp | 樹脂組成物およびその製造方法 |
WO2006070988A1 (en) * | 2004-12-30 | 2006-07-06 | Cheil Industries Inc. | Flameproof styrenic resin composition |
JP2006249134A (ja) * | 2005-03-08 | 2006-09-21 | Asahi Kasei Chemicals Corp | ポリフェニレンエーテルの製造方法 |
JP2006299183A (ja) * | 2005-04-25 | 2006-11-02 | Konica Minolta Opto Inc | 非水系微粒子分散液、熱可塑性複合材料及び光学素子 |
-
2008
- 2008-05-16 JP JP2009515219A patent/JPWO2008143196A1/ja active Pending
- 2008-05-16 WO PCT/JP2008/059084 patent/WO2008143196A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5217880B2 (ja) * | 1974-05-25 | 1977-05-18 | ||
JP2001335699A (ja) * | 2000-05-30 | 2001-12-04 | Daicel Chem Ind Ltd | 難燃性樹脂組成物 |
WO2002059208A1 (fr) * | 2001-01-24 | 2002-08-01 | Asahi Kasei Kabushiki Kaisha | Compositions de résines à base d'éther de polyphénylène contenant des composés de silicium |
JP2004051889A (ja) * | 2002-07-23 | 2004-02-19 | Asahi Kasei Corp | ポリフェニレンエーテル樹脂組成物 |
JP2004107511A (ja) * | 2002-09-19 | 2004-04-08 | Asahi Kasei Chemicals Corp | 樹脂組成物およびその製造方法 |
WO2006070988A1 (en) * | 2004-12-30 | 2006-07-06 | Cheil Industries Inc. | Flameproof styrenic resin composition |
JP2006249134A (ja) * | 2005-03-08 | 2006-09-21 | Asahi Kasei Chemicals Corp | ポリフェニレンエーテルの製造方法 |
JP2006299183A (ja) * | 2005-04-25 | 2006-11-02 | Konica Minolta Opto Inc | 非水系微粒子分散液、熱可塑性複合材料及び光学素子 |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009197196A (ja) * | 2008-02-25 | 2009-09-03 | Asahi Kasei Chemicals Corp | 樹脂組成物 |
JP2010241876A (ja) * | 2009-04-01 | 2010-10-28 | Asahi Kasei Chemicals Corp | ポリフェニレンエーテル |
JP2010265380A (ja) * | 2009-05-14 | 2010-11-25 | Asahi Kasei Chemicals Corp | 熱可塑性樹脂組成物及びその成形体 |
JP2012082348A (ja) * | 2010-10-13 | 2012-04-26 | Asahi Kasei Chemicals Corp | ポリフェニレンエーテル |
JP2014504673A (ja) * | 2011-02-01 | 2014-02-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 組み合わせた安定剤を含んでなる硬化性組成物 |
US9695297B2 (en) | 2011-02-01 | 2017-07-04 | Henkel Ag & Co. Kgaa | Curable composition having combined stabilizers |
JP6027260B2 (ja) * | 2013-10-28 | 2016-11-16 | 帝人フィルムソリューション株式会社 | 難燃性二軸配向ポリエステルフィルム、それからなる難燃性ポリエステルフィルム積層体およびフレキシブル回路基板 |
US10208175B2 (en) | 2013-10-28 | 2019-02-19 | Teijin Dupont Films Japan Limited | Flame-retardant biaxially oriented polyester film, and flame-retardant polyester film laminate comprising the same and flexible circuit board |
CN105683286A (zh) * | 2013-10-28 | 2016-06-15 | 帝人杜邦薄膜日本有限公司 | 阻燃性双轴取向聚酯膜、由其形成的阻燃性聚酯膜层合体和柔性电路基板 |
JPWO2015064469A1 (ja) * | 2013-10-28 | 2017-03-09 | 帝人フィルムソリューション株式会社 | 難燃性二軸配向ポリエステルフィルム、それからなる難燃性ポリエステルフィルム積層体およびフレキシブル回路基板 |
WO2015064469A1 (ja) * | 2013-10-28 | 2015-05-07 | 帝人デュポンフィルム株式会社 | 難燃性二軸配向ポリエステルフィルム、それからなる難燃性ポリエステルフィルム積層体およびフレキシブル回路基板 |
JP2016165815A (ja) * | 2015-03-09 | 2016-09-15 | 帝人株式会社 | 成形加工に用いる金属積層体 |
JP2016181602A (ja) * | 2015-03-24 | 2016-10-13 | 帝人デュポンフィルム株式会社 | フレキシブル回路基板用難燃性二軸配向ポリエステルフィルム、およびそれからなるフレキシブル回路基板 |
US20180229398A1 (en) * | 2015-08-12 | 2018-08-16 | Ube Industries, Ltd. | Resin granule mass, resin film, separator, sorting device, and sorting method |
CN105801865A (zh) * | 2016-03-23 | 2016-07-27 | 合肥学院 | 一种含磷氮笼型聚倍半硅氧烷及其制备方法 |
JP2020143265A (ja) * | 2019-02-28 | 2020-09-10 | 太陽ホールディングス株式会社 | 硬化性組成物、ドライフィルム、硬化物および電子部品 |
JP7339801B2 (ja) | 2019-02-28 | 2023-09-06 | 太陽ホールディングス株式会社 | 硬化性組成物、ドライフィルム、硬化物および電子部品 |
CN110492092A (zh) * | 2019-07-24 | 2019-11-22 | 宁波双鹿新能源科技有限公司 | 一种稀土合金掺杂的锌锰电池及其制备方法 |
CN110492092B (zh) * | 2019-07-24 | 2021-08-10 | 宁波双鹿新能源科技有限公司 | 一种锌锰电池及其制备方法 |
CN115894932A (zh) * | 2022-11-11 | 2023-04-04 | 广东省科学院化工研究所 | 一种聚芳酯单体及其制备方法和应用 |
CN115894932B (zh) * | 2022-11-11 | 2023-10-13 | 广东省科学院化工研究所 | 一种聚芳酯单体及其制备方法和应用 |
Also Published As
Publication number | Publication date |
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JPWO2008143196A1 (ja) | 2010-08-05 |
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