WO2008140087A1 - 導電性樹脂組成物および導電性樹脂膜並びに導電性樹脂膜の形成方法 - Google Patents

導電性樹脂組成物および導電性樹脂膜並びに導電性樹脂膜の形成方法 Download PDF

Info

Publication number
WO2008140087A1
WO2008140087A1 PCT/JP2008/058793 JP2008058793W WO2008140087A1 WO 2008140087 A1 WO2008140087 A1 WO 2008140087A1 JP 2008058793 W JP2008058793 W JP 2008058793W WO 2008140087 A1 WO2008140087 A1 WO 2008140087A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroconductive resin
resin film
electroconductive
composition
cm2v
Prior art date
Application number
PCT/JP2008/058793
Other languages
English (en)
French (fr)
Inventor
Fumiyuki Ozawa
Yasutaka Yamamoto
Masayuki Wakioka
Jun-Ichi Nakamura
Hayahide Yamasaki
Original Assignee
Nippon Shokubai Co., Ltd.
Kyoto University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Shokubai Co., Ltd., Kyoto University filed Critical Nippon Shokubai Co., Ltd.
Priority to JP2009514168A priority Critical patent/JPWO2008140087A1/ja
Publication of WO2008140087A1 publication Critical patent/WO2008140087A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers

Abstract

　高い電荷移動度を示す導電性樹脂膜およびその樹脂組成物ならびに導電性樹脂膜の形成方法を提供する。本発明は、導電性樹脂膜形成用の樹脂組成物であって、光照射により、導電性樹脂膜の電荷移動度が１．０×１０-6cm2V-1s-1未満から１．０×１０-5cm2V-1s-1以上に向上する樹脂組成物、並びに、当該樹脂組成物から得られる導電性樹脂膜であって、光照射射前の当該樹脂膜の電荷移動度が１．０×１０-6cm2V-1s-1未満であり、光照射後の電荷移動度が１．０×１０-5cm2V-1s-1以上である導電性樹脂膜を含む。当該導電性樹脂膜の形成方法は、上記導電性樹脂膜形成用樹脂組成物を含む導電性樹脂膜形成溶液により塗膜を形成する工程、および、上記塗膜に波長２００～６００ｎｍの光を光照射する工程、を含む。
PCT/JP2008/058793 2007-05-14 2008-05-13 導電性樹脂組成物および導電性樹脂膜並びに導電性樹脂膜の形成方法 WO2008140087A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009514168A JPWO2008140087A1 (ja) 2007-05-14 2008-05-13 導電性樹脂組成物および導電性樹脂膜並びに導電性樹脂膜の形成方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-128367 2007-05-14
JP2007128367 2007-05-14
JP2008-023197 2008-02-01
JP2008023197 2008-02-01

Publications (1)

Publication Number Publication Date
WO2008140087A1 true WO2008140087A1 (ja) 2008-11-20

Family

ID=40002276

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058793 WO2008140087A1 (ja) 2007-05-14 2008-05-13 導電性樹脂組成物および導電性樹脂膜並びに導電性樹脂膜の形成方法

Country Status (2)

Country Link
JP (1) JPWO2008140087A1 (ja)
WO (1) WO2008140087A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131245A (ja) * 1988-11-11 1990-05-21 Matsushita Electric Ind Co Ltd 電子写真用感光体
JPH0870138A (ja) * 1994-08-29 1996-03-12 Hoechst Japan Ltd 光照射によるポリアリレンビニレンポリマー薄膜のパターン化
JPH08334622A (ja) * 1995-04-07 1996-12-17 Sumitomo Chem Co Ltd 一軸配向共役系高分子薄膜とその製造方法および偏光素子と液晶表示装置
JPH0935870A (ja) * 1995-07-19 1997-02-07 Sumitomo Chem Co Ltd 高分子蛍光体薄膜とその製造方法および有機エレクトロルミネッセンス素子
WO2005049688A1 (ja) * 2003-11-21 2005-06-02 Kansai Technology Licensing Organization Co., Ltd. 光パターニングが可能な導電性樹脂

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207619A (en) * 1981-06-17 1982-12-20 Asahi Glass Co Ltd Preparation of polyarylenevinylene
JP2001196664A (ja) * 2000-01-12 2001-07-19 Japan Science & Technology Corp 立体規則性ポリチオフェン誘導体から成る光電変換素子用光キャリアー生成および輸送材料薄膜
JP2005314644A (ja) * 2004-03-31 2005-11-10 Dainippon Ink & Chem Inc 新規重合体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131245A (ja) * 1988-11-11 1990-05-21 Matsushita Electric Ind Co Ltd 電子写真用感光体
JPH0870138A (ja) * 1994-08-29 1996-03-12 Hoechst Japan Ltd 光照射によるポリアリレンビニレンポリマー薄膜のパターン化
JPH08334622A (ja) * 1995-04-07 1996-12-17 Sumitomo Chem Co Ltd 一軸配向共役系高分子薄膜とその製造方法および偏光素子と液晶表示装置
JPH0935870A (ja) * 1995-07-19 1997-02-07 Sumitomo Chem Co Ltd 高分子蛍光体薄膜とその製造方法および有機エレクトロルミネッセンス素子
WO2005049688A1 (ja) * 2003-11-21 2005-06-02 Kansai Technology Licensing Organization Co., Ltd. 光パターニングが可能な導電性樹脂

Also Published As

Publication number Publication date
JPWO2008140087A1 (ja) 2010-08-05

Similar Documents

Publication Publication Date Title
ATE407982T1 (de) Metalleffektpigmente mit anorganisch/organischer mischschicht, verfahren zur herstellung solcher metalleffektpigmente und deren verwendung
TW201129667A (en) Fabricating method of film adhesive, adhesive sheet, semiconductor device and fabricating method thereof
TW200641075A (en) Film, silica film and method of forming the same, composition for forming silica film, and electronic part
EP2345933A4 (en) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND PROCESS FOR PRODUCING THROUGH ELECTRODE USING THE SAME
EA200800283A1 (ru) Композиция порошковой краски
WO2012048041A3 (en) Amine curing silicon-nitride-hydride films
WO2009089001A3 (en) Direct-to-metal radiation curable compositions
TW200721524A (en) Method of releasing high temperature films and/or devices from metallic substrates
WO2008126375A1 (ja) 絶縁電線の製造方法及びその製造装置
ATE377055T1 (de) Strahlungshärtbares elektrisch leitfähiges beschichtungsgemisch
WO2013161996A3 (ja) 透明導電性インク及び透明導電パターン形成方法
MX2017012296A (es) Método para formar una película de revestimiento de capas múltiples.
EP2151718A3 (en) Developer bearing member and process for producing same, development apparatus and development method
DE60020859D1 (de) Uv härtbare zusammensetzungen zur herstellung von elektrolumineszenzbeschichtungen
MX2010003678A (es) Metodo para mantener un color de una pelicula curada formada a partir de una composicion de recubrimiento.
WO2010054077A3 (en) Partmarking of coated plastic substrates
MX355138B (es) Recubrimiento de capas multiples con una capa de llenador hecha de un material de recubrimiento no acuoso que contiene por lo menos dos poliesteres diferentes.
WO2008051078A3 (en) Organic light emitting diode device with multilayer seal
WO2011158119A3 (ja) シリコンオキシナイトライド膜の形成方法およびそれにより製造されたシリコンオキシナイトライド膜付き基板
WO2012042264A3 (en) Printable composition, method and uses thereof
WO2012081992A3 (en) Method for forming uv-curable conductive compositions and a composition thus formed
WO2009020430A3 (en) Method of forming a cadmium containing nanocrystal
WO2009152211A3 (en) Initiator system with biphenylene derivates, method of production and use thereof
TW200745746A (en) Black photosensitive composition, light shielding film produced from the same and EL device
WO2009020317A3 (en) Stabilized antioxidant particles, composition comprising the same and method for preparing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752665

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009514168

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08752665

Country of ref document: EP

Kind code of ref document: A1