WO2008139669A1 - 薄膜トランジスタの製造方法及び薄膜トランジスタ - Google Patents
薄膜トランジスタの製造方法及び薄膜トランジスタ Download PDFInfo
- Publication number
- WO2008139669A1 WO2008139669A1 PCT/JP2008/000489 JP2008000489W WO2008139669A1 WO 2008139669 A1 WO2008139669 A1 WO 2008139669A1 JP 2008000489 W JP2008000489 W JP 2008000489W WO 2008139669 A1 WO2008139669 A1 WO 2008139669A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- insulation film
- semiconductor layer
- thin film
- film transistor
- film
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000010408 film Substances 0.000 abstract 11
- 238000009413 insulation Methods 0.000 abstract 8
- 239000004065 semiconductor Substances 0.000 abstract 6
- 230000015572 biosynthetic process Effects 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
Abstract
基板(10)に半導体層(12)を形成する半導体層形成工程と、半導体層(12)を覆うように第1絶縁膜、第2絶縁膜及び導電膜を順に成膜する積層膜形成工程と、導電膜をパターニングして半導体層(12)を横切るようにゲート電極(21a)を形成するゲート電極形成工程と、第2絶縁膜を周端がゲート電極(21a)よりも外側になると共に半導体層(12)を横切るようにエッチングする第2絶縁膜除去工程と、第2絶縁膜除去工程でエッチングされた第2絶縁膜から露出する第1絶縁膜をエッチングして半導体層(12)の一部を露出させる第1絶縁膜除去工程とを備える。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-127734 | 2007-05-14 | ||
JP2007127734 | 2007-05-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008139669A1 true WO2008139669A1 (ja) | 2008-11-20 |
Family
ID=40001895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/000489 WO2008139669A1 (ja) | 2007-05-14 | 2008-03-07 | 薄膜トランジスタの製造方法及び薄膜トランジスタ |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008139669A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI836583B (zh) | 2012-05-10 | 2024-03-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07161994A (ja) * | 1993-12-07 | 1995-06-23 | Sony Corp | 薄膜トランジスタの製造方法 |
JPH10209461A (ja) * | 1997-01-27 | 1998-08-07 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ及びその製造方法 |
JP2000124461A (ja) * | 1998-10-20 | 2000-04-28 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタおよびその製造方法 |
-
2008
- 2008-03-07 WO PCT/JP2008/000489 patent/WO2008139669A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07161994A (ja) * | 1993-12-07 | 1995-06-23 | Sony Corp | 薄膜トランジスタの製造方法 |
JPH10209461A (ja) * | 1997-01-27 | 1998-08-07 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ及びその製造方法 |
JP2000124461A (ja) * | 1998-10-20 | 2000-04-28 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタおよびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI836583B (zh) | 2012-05-10 | 2024-03-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
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