WO2008139623A1 - 温度ロック機構を有するはんだ取扱用温度制御装置 - Google Patents

温度ロック機構を有するはんだ取扱用温度制御装置 Download PDF

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Publication number
WO2008139623A1
WO2008139623A1 PCT/JP2007/059952 JP2007059952W WO2008139623A1 WO 2008139623 A1 WO2008139623 A1 WO 2008139623A1 JP 2007059952 W JP2007059952 W JP 2007059952W WO 2008139623 A1 WO2008139623 A1 WO 2008139623A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
rotating shaft
control device
knob
temperature control
Prior art date
Application number
PCT/JP2007/059952
Other languages
English (en)
French (fr)
Inventor
Toshikazu Mochizuki
Original Assignee
Hakko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hakko Corporation filed Critical Hakko Corporation
Priority to JP2009513953A priority Critical patent/JP5066181B2/ja
Priority to CN2007800529634A priority patent/CN101678492B/zh
Priority to US12/600,255 priority patent/US7886954B2/en
Priority to PCT/JP2007/059952 priority patent/WO2008139623A1/ja
Priority to EP07743387.8A priority patent/EP2156915B1/en
Publication of WO2008139623A1 publication Critical patent/WO2008139623A1/ja

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • B23K3/047Heating appliances electric
    • B23K3/0478Heating appliances electric comprising means for controlling or selecting the temperature or power
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02Soldering irons; Bits
    • B23K3/03Soldering irons; Bits electrically heated
    • B23K3/033Soldering irons; Bits electrically heated comprising means for controlling or selecting the temperature or power
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mechanical Control Devices (AREA)
  • Control Of Resistance Heating (AREA)

Abstract

 はんだ取扱用温度制御装置1の本体10と、本体10に内蔵され、軸周りに回転可能な回転軸77と、回転軸77の回転角度に応じて設定温度を変化させる設定温度変化手段75と、回転軸77に対して回転自在に本体10に支持された回転式のつまみ20と、本体20に対し回転軸77及びつまみ20と同軸位置に挿脱可能であり、挿着時に回転軸77とつまみ20とを連動回転し得るように機械的に連結する温度ロックキー40とを備え、温度ロックキー40が本体10から離脱された状態では回転軸77とつまみ20との連結が解除され、つまみ20の回転による上記設定温度の変更が禁止されるように構成する。
PCT/JP2007/059952 2007-05-15 2007-05-15 温度ロック機構を有するはんだ取扱用温度制御装置 WO2008139623A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009513953A JP5066181B2 (ja) 2007-05-15 2007-05-15 温度ロック機構を有するはんだ取扱用温度制御装置
CN2007800529634A CN101678492B (zh) 2007-05-15 2007-05-15 具有温度锁定机构的钎焊处理用温度控制装置
US12/600,255 US7886954B2 (en) 2007-05-15 2007-05-15 Solder handling temperature controller with temperature lock mechanism
PCT/JP2007/059952 WO2008139623A1 (ja) 2007-05-15 2007-05-15 温度ロック機構を有するはんだ取扱用温度制御装置
EP07743387.8A EP2156915B1 (en) 2007-05-15 2007-05-15 Solder handling temperature controller with temperature lock mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/059952 WO2008139623A1 (ja) 2007-05-15 2007-05-15 温度ロック機構を有するはんだ取扱用温度制御装置

Publications (1)

Publication Number Publication Date
WO2008139623A1 true WO2008139623A1 (ja) 2008-11-20

Family

ID=40001852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/059952 WO2008139623A1 (ja) 2007-05-15 2007-05-15 温度ロック機構を有するはんだ取扱用温度制御装置

Country Status (5)

Country Link
US (1) US7886954B2 (ja)
EP (1) EP2156915B1 (ja)
JP (1) JP5066181B2 (ja)
CN (1) CN101678492B (ja)
WO (1) WO2008139623A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094833A (ja) * 2011-11-02 2013-05-20 Hakko Kk はんだ取扱装置
JP2015160245A (ja) * 2014-02-28 2015-09-07 白光株式会社 給電ユニット、制御ユニット、管理装置、および給電制御装置
KR101850059B1 (ko) 2017-04-03 2018-04-18 김송희 우드 버닝기 및 그의 우드 버닝 제어 장치
JP2020037137A (ja) * 2017-08-10 2020-03-12 白光株式会社 はんだこて制御装置、カートリッジ、はんだこて管理システム

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7886954B2 (en) 2007-05-15 2011-02-15 Hakko Corporation Solder handling temperature controller with temperature lock mechanism
CN101658969A (zh) * 2009-09-25 2010-03-03 深圳市欣力通科技有限公司 一种焊锡机
CN102837098A (zh) * 2011-06-23 2012-12-26 神讯电脑(昆山)有限公司 烙铁结构
US20160351522A1 (en) * 2015-05-27 2016-12-01 Freescale Semiconductor, Inc. Package-on-package device and cavity formation by solder removal for package interconnection
WO2018081331A1 (en) 2016-10-26 2018-05-03 Milwaukee Electric Tool Corporation Soldering tool
CN107713816A (zh) * 2017-10-21 2018-02-23 中国地质大学(武汉) 一种可调温智能充电水杯
USD852596S1 (en) 2017-10-26 2019-07-02 Milwaukee Electric Tool Corporation Soldering tool
JP1616228S (ja) * 2018-05-23 2018-10-22
JP1625334S (ja) * 2018-08-31 2019-02-25
USD944475S1 (en) * 2018-11-08 2022-02-22 Sharkninja Operating Llc Hand vacuum cleaner

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JPS645772U (ja) * 1987-06-27 1989-01-13
JPH0222144Y2 (ja) * 1987-11-18 1990-06-14

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JPS6186069A (ja) * 1984-10-02 1986-05-01 Tamura Seisakusho Co Ltd 自動はんだ付けシステムの制御装置
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US5014210A (en) * 1989-03-06 1991-05-07 Postlewait Lester B Microprocessor controlled soldering station
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JP3558149B2 (ja) * 1996-06-28 2004-08-25 藤倉ゴム工業株式会社 調圧装置
US5928536A (en) * 1998-09-21 1999-07-27 Lee; Cheng-Liang Electric soldering iron with heating energy regulating control means
US6093915A (en) * 1999-02-19 2000-07-25 Cooper Industries, Inc. Magnet and reed switch/lock
JP4156756B2 (ja) * 1999-08-25 2008-09-24 白光株式会社 半田ごての温度制御装置
US6580050B1 (en) * 2002-01-16 2003-06-17 Pace, Incorporated Soldering station with built-in self-calibration function
CN100544875C (zh) * 2003-07-28 2009-09-30 白光株式会社 烙铁的温度调节装置
US6833531B1 (en) * 2003-08-05 2004-12-21 Hakko Corporation Temperature adjusting device for a soldering iron
JP4398710B2 (ja) * 2003-12-09 2010-01-13 白光株式会社 はんだ取扱い器具の温度制御装置
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Publication number Priority date Publication date Assignee Title
JPS645772U (ja) * 1987-06-27 1989-01-13
JPH0222144Y2 (ja) * 1987-11-18 1990-06-14

Non-Patent Citations (1)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094833A (ja) * 2011-11-02 2013-05-20 Hakko Kk はんだ取扱装置
JP2015160245A (ja) * 2014-02-28 2015-09-07 白光株式会社 給電ユニット、制御ユニット、管理装置、および給電制御装置
KR101850059B1 (ko) 2017-04-03 2018-04-18 김송희 우드 버닝기 및 그의 우드 버닝 제어 장치
JP2020037137A (ja) * 2017-08-10 2020-03-12 白光株式会社 はんだこて制御装置、カートリッジ、はんだこて管理システム
US11179791B2 (en) 2017-08-10 2021-11-23 Hakko Corporation Composite soldering, de-soldering station and system

Also Published As

Publication number Publication date
CN101678492B (zh) 2011-12-14
US7886954B2 (en) 2011-02-15
JPWO2008139623A1 (ja) 2010-07-29
EP2156915A4 (en) 2011-05-11
CN101678492A (zh) 2010-03-24
JP5066181B2 (ja) 2012-11-07
EP2156915A1 (en) 2010-02-24
EP2156915B1 (en) 2013-10-23
US20100308102A1 (en) 2010-12-09

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