WO2008138898A1 - Plaquette comportant une broche à ajustement pressé - Google Patents

Plaquette comportant une broche à ajustement pressé Download PDF

Info

Publication number
WO2008138898A1
WO2008138898A1 PCT/EP2008/055766 EP2008055766W WO2008138898A1 WO 2008138898 A1 WO2008138898 A1 WO 2008138898A1 EP 2008055766 W EP2008055766 W EP 2008055766W WO 2008138898 A1 WO2008138898 A1 WO 2008138898A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
pressfit
layer
inner layer
Prior art date
Application number
PCT/EP2008/055766
Other languages
German (de)
English (en)
Inventor
Thomas Preuschl
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2008138898A1 publication Critical patent/WO2008138898A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the invention relates to a printed circuit board with integrated
  • controllers In automotive engineering, components such as transmission, engine or brake systems are increasingly being primarily electronically controlled. There is a trend towards integrated mechatronic controls, ie the integration of control electronics and the associated electronic components such as sensors or valves in the transmission, the engine or the brake system.
  • the controllers generally include a plurality of electronic components that are in communication with other components external to the controller. In such "on-the-spot" electronics, these controls are no longer housed in a separate protected electronics room and therefore must withstand environmental and mechanical, thermal and chemical stresses.
  • housings are usually used for this purpose in special housings.
  • the housings fulfill an important shielding function. In order to allow a reliable connection to outside of the housing components, an electrical connection from the inside of the housing to the outside of the housing is necessary.
  • the usual structure for such integrated mechatronic applications consists of a ceramic substrate which covers the various electronic components of the central control unit. includes unit. This ceramic substrate is bonded by means of rigid or flexible printed circuit boards in order to allow the connection of the peripheral components to the central unit.
  • the electronic connection of the components lying outside the housing can be carried out by means of press-fit technology and / or laser welding. It is known to produce a variable, simple and secure electronic connection to the peripheral components via so-called pressfit pins in the press-fit technique. Likewise, depending on the requirement of the peripheral component, this connection can also be produced by means of laser welding.
  • the object of the invention is therefore to provide a printed circuit board concept, which enables a secure, simple and flexible connection to other circuit boards and / or electronic components, wherein the mechanical attachment and the electrical connection of the components can be simplified and therefore produced more cheaply.
  • This is inventively achieved with a circuit board according to claim 1 and with a method for producing such a circuit board according to claim 10.
  • a printed circuit board is provided with at least one pressfit pin as electronic connection, wherein the at least one pressfit pin is inserted horizontally into the printed circuit board and electronically contacted with a conductive part of an inner layer of the printed circuit board and projects laterally beyond an edge of the printed circuit board.
  • the pressfit pin can thus be available for the electronic and mechanical connection with at least one second printed circuit board and / or at least one further electronic component.
  • a variable, simple and secure electronic connection to at least one second printed circuit board or at least one further electronic component can thus be made available without having to design and manufacture an additional plug.
  • the number of interfaces can be significantly reduced in this way and at the same time the length of the signal and current paths can be shortened significantly.
  • the circuit boards according to the invention have a sandwich structure.
  • the printed circuit board with the integrated pressfit pin can be, for example, a PCB with a conductive inner layer, for example a metal layer, which is arranged between two electrically insulating base layers.
  • the metal layer may preferably be a copper layer. In this copper layer can, for example, by known etching, conductor tracks are introduced.
  • the base layers may again have a copper layer on the outwardly facing surfaces.
  • the inner layer or the sequence of inner layers and intermediate layers conditions between the base layers of the circuit board are also called core.
  • Pressfit pins can be connected according to the invention in one or more inner layers, each with conductive parts and electronically contacted.
  • the base layers and / or the intermediate layers may preferably be so-called prepregs (preimpregnated fibers).
  • Prepreg refers to a semi-finished product consisting of continuous fibers and an uncured thermosetting plastic matrix.
  • the inner layer can alternatively or cumulatively itself consist of electrically insulating base material and have as conductive part one or more conductor tracks and / or one or more pads.
  • the base material may be, for example, an acrylate adhesive layer.
  • the printed conductors or pads may preferably consist of copper.
  • the electronic connection of the pressfit pin to the conductive part of the inner layer of the printed circuit board can be produced, for example, by laser welding, soldering or conductive bonding.
  • the conductive part of the inner layer, which is contacted with the pressfit pin have a copper thickness of at least 70 ⁇ m.
  • the circuit board may have two or more inner layers wherein the inner layers are electrically isolated from each other by intermediate layers.
  • a base layer or an intermediate layer can be arranged on the inner layer connected to the pressfit pin.
  • the base layer or intermediate layer applied to the inner layer with the pressfit pin can be a prepreg.
  • the prepreg (s) can be stacked and pressed on the inner layer of the printed circuit board with the Pressfit pin.
  • the at least one prepreg can be a so-called highflow prepreg, which has particularly good flowability.
  • the pin can be enclosed particularly well with resin and securely fastened. Due to the good flow behavior, gaps can be filled free of air and excellent bond and adhesion and a smooth surface can be created. In this way, an increased long-term stability and an excellent connection to another circuit board or other electronic components are guaranteed.
  • the pressfit pin can be made straight or angled. In this way, it can be adapted to the various contact requirements and geometries.
  • the invention also relates to a method for producing a printed circuit board with the features described above.
  • at least one pressfit pin is electronically contacted with a conductive part of an inner layer of the printed circuit board by means of laser welding, soldering or conductive bonding, wherein the pressfit pin protrudes laterally beyond an edge of the printed circuit board.
  • at least one base layer or intermediate layer is applied and fastened on the inner layer with the attached pressfit pin.
  • the connection to a second printed circuit board and / or a further electronic component can be produced detachably, for example, as a pure plug connection or non-detachably, for example by soldering or welding.
  • no additional plug component is needed for this purpose.
  • the signal and current paths can be significantly shortened by the direct connection of the second printed circuit board or electronic component.
  • the number of interfaces required and thus also the error susceptibility of the electronic module are reduced.
  • Fig. 1 is a sectional view of a printed circuit board according to the invention with integrated pressfit pin and
  • Fig. 2 is a plan view of an inner layer of a printed circuit board with a plurality of interconnects and a plurality of Pressfit pins applied thereto.
  • Fig. 1 shows a sectional view of a printed circuit board 1 with a sandwich structure with two inner layers 2, which are separated by an intermediate layer 3.
  • a pressfit pin 4 is applied and electronically contacted with a spot weld 5.
  • the contacting can be made in addition to laser welding by soldering or conductive bonding.
  • the pressfit pin 4 projects beyond the edge 6 of the printed circuit board 1 and can thus be available for connection to a second printed circuit board or electronic component.
  • no additional plug component is required for this purpose.
  • the number of interfaces can be reduced and the reliability of the resulting electronic assembly can thus be significantly improved.
  • a base layer 7a is applied, which may preferably be a prepreg.
  • the base layer 7a protects the electronic contact and the conductive parts of the inner layer 2a against conductive contamination (chip protection) and also serves the additional mechanical attachment of the press fit pin.
  • a further base layer 7b is arranged below the second inner layer 2b.
  • a metal foil 8 preferably a copper foil, can be arranged on both base layers 7, on which in turn strip conductors, for example by an etching process, can be produced.
  • the inner layer 2 shows a plan view of an inner layer 2 of a printed circuit board 1 with a plurality of interconnects 9 and a plurality of pressfit pins 4 applied thereto.
  • the inner layer 2 may be a copper layer on which the interconnects 9 were produced by an etching process.
  • the pressfit pins 4 can be electrically contacted with the conductor tracks 9 by means of laser welding and be fastened with corresponding spot welds. At least one base layer 7 or an intermediate layer 3 can subsequently be applied to the inner layer 2 with the attached pressfit pins 4.
  • the pressfit pins 4 project beyond the edge of the circuit board and are available for the direct connection of electronic components or one or more printed circuit boards, without the need for an additional connector component to be designed, provided and installed.
  • a circuit board concept with at least one integrated pressfit pin which allows a direct connection to one or more printed circuit boards or electronic components.
  • an otherwise required plug component can be completely replaced.
  • This allows a greatly reduced arrangement of the resulting electronic assemblies in comparison to previous connection variants of printed circuit boards with separate plug components.
  • the saving material costs and the connection steps in the assembly process can be saved.
  • the assembly of the circuit board according to the invention can be easily and inexpensively integrated into the overall assembly process of an electronic device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne une plaquette (1) comportant au moins deux couches de base (7) et au moins une couche intérieure (2) disposée entre les couches de base, au moins une broche à ajustement pressé (4) étant insérée horizontalement dans la plaquette (1) en tant que connexion électronique, et mise en contact électronique avec une partie conductrice de la couche intérieure (2) de la plaquette (1), la broche à ajustement pressé faisant par ailleurs saillie latéralement par rapport à une arête de la plaquette (1). L'invention concerne également un procédé de fabrication d'une telle plaquette (1) et son utilisation, notamment pour la commande de boîte intégrée d'un véhicule.
PCT/EP2008/055766 2007-05-09 2008-05-09 Plaquette comportant une broche à ajustement pressé WO2008138898A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710021740 DE102007021740A1 (de) 2007-05-09 2007-05-09 Leiterplatte mit integriertem Pressfit-Pin
DE102007021740.6 2007-05-09

Publications (1)

Publication Number Publication Date
WO2008138898A1 true WO2008138898A1 (fr) 2008-11-20

Family

ID=39772972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/055766 WO2008138898A1 (fr) 2007-05-09 2008-05-09 Plaquette comportant une broche à ajustement pressé

Country Status (2)

Country Link
DE (1) DE102007021740A1 (fr)
WO (1) WO2008138898A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014202910A1 (de) * 2014-02-18 2015-08-20 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung eines Kraftfahrzeugs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010003371A1 (en) * 1996-07-31 2001-06-14 Akira Sakamoto Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals
US20050018410A1 (en) * 2003-07-21 2005-01-27 Brandenburg Scott D. Printed circuit board assembly with integrated connector
US20050236178A1 (en) * 2004-04-27 2005-10-27 Lauriello Philip J Fusion bonded assembly with attached leads
US20060203455A1 (en) * 2005-03-11 2006-09-14 Yazaki Corporation Metal-core substrate and apparatus utilizing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120781A (ja) * 1987-10-31 1989-05-12 Taiyo Yuden Co Ltd 多層配線基板モジュール
US5249355A (en) * 1991-10-31 1993-10-05 Hughes Aircraft Company Method of fabricating a multilayer electrical circuit structure
EP0752739B1 (fr) * 1995-07-03 2000-10-25 Berg Electronics Manufacturing B.V. Connecteur avec assemblage intégré de circuit imprimé
DE29700703U1 (de) * 1997-01-16 1998-05-14 Bosch Gmbh Robert Einrichtung zur Kontaktierung elektrischer Bauelemente
US6554654B1 (en) * 2001-12-31 2003-04-29 Hewlett-Packard Development Company, L.P. Multi-pin edge connector for circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010003371A1 (en) * 1996-07-31 2001-06-14 Akira Sakamoto Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals
US20050018410A1 (en) * 2003-07-21 2005-01-27 Brandenburg Scott D. Printed circuit board assembly with integrated connector
US20050236178A1 (en) * 2004-04-27 2005-10-27 Lauriello Philip J Fusion bonded assembly with attached leads
US20060203455A1 (en) * 2005-03-11 2006-09-14 Yazaki Corporation Metal-core substrate and apparatus utilizing the same

Also Published As

Publication number Publication date
DE102007021740A1 (de) 2008-11-13

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