WO2008125372A1 - Procédé de production d'un système de distribution de signaux et de potentiel pour modules mécatroniques - Google Patents

Procédé de production d'un système de distribution de signaux et de potentiel pour modules mécatroniques Download PDF

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Publication number
WO2008125372A1
WO2008125372A1 PCT/EP2008/051917 EP2008051917W WO2008125372A1 WO 2008125372 A1 WO2008125372 A1 WO 2008125372A1 EP 2008051917 W EP2008051917 W EP 2008051917W WO 2008125372 A1 WO2008125372 A1 WO 2008125372A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor track
base plate
track structure
distribution system
signal
Prior art date
Application number
PCT/EP2008/051917
Other languages
German (de)
English (en)
Inventor
Josef Loibl
Karl Smirra
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2008125372A1 publication Critical patent/WO2008125372A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the invention relates to a method for producing a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate according to the preamble of patent claim 1, in particular for the production of transmission or engine controls in the automotive industry.
  • control electronics In automotive engineering, components such as transmission, engine or brake systems are increasingly being primarily electronically controlled. There is a trend towards mechatronic controls, ie the integration of control electronics and the associated electronic components, such as sensors or valves in the transmission, the engine or the brake system. Control devices thus generally have a plurality of electronic components, which are in connection with other components outside of the control unit. With such "on-the-spot" electronics, these controllers are no longer housed in a separate protected electronics room and must therefore withstand environmental, mechanical, thermal and chemical stresses, typically housed in special enclosures and providing an important shielding function ,
  • the core unit for example an electronic transmission control, is therefore designed from a base plate, an electronic substrate, the conductor track structures and a hermetically sealed cover.
  • Such electronic modules are needed in large quantities and must therefore be very inexpensive to produce.
  • a short-circuit-proof electrical connection from the hermetically sealed housing interior side of the electronics compartment to the housing exterior to peripheral components is necessary. So far, signal and potential distributions from a hermetically sealed electronics space are usually realized by stamped grid, rigid printed circuit boards or flexible printed circuit boards. Flexible printed circuit boards have proven to be particularly variable because they also fulfill the desired functionality with a relatively simple sealing configuration.
  • the usual structure with flexible printed circuit boards for such mechatronic applications consists of a base layer as
  • the object of the invention is to provide an alternative method with which a short circuit-proof printed conductor structure of a signal and potential distribution system can be produced simply and inexpensively and applied to a metallic base plate.
  • a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate by the following method steps: a) producing a conductor track structure from a metal foil, the metal foil being applied to an adhesive carrier foil before or after structuring; b) applying the composite of conductor track structure and carrier foil to a base plate and producing an electrically insulated adhesive bond between the conductor track structure and base plate; c) removing the carrier foil from the conductor track structure.
  • the method according to the invention can be used to generate complex interconnect structures and, by a simple transfer process in steps b) and c), to generate a trace be transferred to a metallic base plate safely.
  • the conductor track structure applied to the base plate can assume the complete function of the electrical connection as well as the signal and potential distribution in mechatronic modules.
  • Printed circuit boards in particular flexible printed circuit boards with their multilayer structure, for this purpose is therefore no longer necessary.
  • a metal foil according to the invention for example, a silver foil, a gold foil, a nickel foil or an aluminum foil can be used.
  • a copper foil is used as the metal foil.
  • the metallic bottom plate is preferably an aluminum plate.
  • the bottom plate may have a thickness of 2 mm to 5 mm, preferably 3 mm to 4 mm.
  • Other materials and strong plates are conceivable as long as they ensure a suitable heat dissipation for mechatronic modules for the respective application.
  • Structuring in the sense of the invention means that individual strip conductors are formed from the metal foil, which are spaced apart from one another and thus electrically insulated from one another.
  • structuring is preferably effected by a stamping process, laser cutting, water jet cutting or other known mechanical, chemical and / or thermal separation processes.
  • a composite of conductor track structure and carrier film is produced in step a).
  • This composite is inventively referred to as Tragerverbund.
  • the carrier composite can be produced by a simple roll-to-roll process and used for further processing as a roll or stack of individual trays. be provided gerverbunden.
  • the structuring of the metal foil to produce the conductor track structure can take place before or after the production of the carrier composite.
  • the industrialized production of such a composite product can advantageously be undertaken, for example, from the label manufacturing industry.
  • the metal foil can be plated or coated before or after step a).
  • the cladding or coating may be provided in whole or in part.
  • the coatings can, for example, be protective coatings or serve for better connection to other components of a mechatronic module.
  • Ni / Au pads can be provided on the track surface to prepare for bonding processes.
  • the metal foil can carry a passively adhering layer on the side facing away from the carrier foil.
  • Passive adhesion means that this layer can develop adhesion properties only under the influence of pressure or temperature and can thus be attached to further layers and / or surfaces.
  • the further layer may be the bottom plate or a layer arranged on the bottom plate.
  • the bottom plate can be provided with an adhesive medium before step b).
  • the adhesive medium may be a passively or actively adhering adhesive film, in particular an acrylic adhesive film.
  • the inventive method thus opens up variable possibilities for the industrialized production of a composite of conductor track structure and base plate.
  • This composite is inventively referred to as an adhesive bond.
  • the base plate can be provided with an electrically insulating coating before step b).
  • This can be, for example, an anodized layer, an enamel layer or a lacquer layer. Due to the electrically insulating layer on the bottom plate, a greater choice of adhesion layer to the conductor track structure and their properties can be created. It is possible in this way, even without the risk of short circuits, to apply the conductor track structures directly on the metallic coated bottom plate.
  • two or more, equally or differently configured conductor track part structures can be applied to a base plate.
  • coated and uncoated trace substructures can be applied to the metallic bottom plate.
  • conductor track substructures of different sizes and shapes can be applied to the bottom plate by the method according to the invention. This can be done simultaneously in one or in successive processes according to the invention. This can be used particularly advantageously if the contact regions to the substrate are provided with Ni-Au pads on the conductor track surface. Thus, these can be prepared for bonding processes, while the other conductor track substructures need no coating.
  • two or more of the conductor track substructures applied to the bottom plate may be electrically connected to each other.
  • two or more of the conductor track substructures Form overlapping areas.
  • the conductor track substructures can form intersection areas, for example. These can be advantageously used for unbundling the signal and current paths.
  • the invention further relates to a signal and potential distribution system for mechatronic modules having a base plate and a printed conductor structure applied thereon, the printed conductor structure being formed by a structured metal foil laminated directly onto the base plate.
  • complex printed conductor structures can be produced by a transfer process, wherein the printed conductor structure previously forms a carrier composite with a carrier foil.
  • the printed conductor structures applied to the base plate can assume the complete function of the electrical connection as well as the signal and potential distribution to all peripheral components, for example in mechatronic modules.
  • a use of costly printed circuit boards, in particular the flexible printed circuit boards described above, for this purpose is no longer necessary.
  • the conductor track structure is laminated to a bottom plate made of aluminum.
  • the conductor track structure is fixed by means of acrylic adhesive film on the bottom plate.
  • the conductor track structure can be adapted to the size of the base plate, or it can project beyond the base plate at one or more edges.
  • the printed conductor structure according to the invention permits contact on both sides and is therefore open to all known electrical contacting processes, such as soldering, welding, bonding or conductive bonding.
  • the interconnect structure and the individual interconnects formed therewith can flush flush with the bottom plate or protrude beyond the edges of the bottom plate.
  • the ladder- Railway structures can also run over openings in the floor slab.
  • the acrylic adhesive film at least partially project beyond the edges of the bottom plate.
  • the acrylic adhesive film it is also possible, for example, for the conductor tracks projecting beyond the base plate to be protected against contamination and, if appropriate, to be stiffened or supported.
  • the invention also relates to the use of an inventive signal and potential distribution system for a mechatronic module, preferably for a transmission control, of a motor vehicle.
  • the individual process steps a) to c) can be automated and are therefore advantageously suitable for mass production.
  • the application of the conductor track structure to a carrier foil ensures compliance with the correct relative positioning of the individual conductor carrier tracks which are separated from one another by the cutting process in step a).
  • Figure 1 is a plan view of a composite of printed circuit board structure and carrier sheet.
  • FIG. 2 shows a perspective top view of a printed conductor structure applied to a base plate;
  • FIG. 3 is a partially exploded sectional view of the core unit of a mechatronic module with a signal and potential distribution system according to the invention; 4 is an enlarged sectional view of a detail in Maisier Scheme in a mechatronic module of FIG .. 3
  • FIG. 1 shows a composite 1 of a conductor track structure 2 made of a metal foil with a carrier foil 3.
  • This carrier composite 1 is obtained in the process according to the invention as an intermediate product in step a).
  • the printed conductor structure 2 can be produced, for example, by stamping processes, laser cutting, water jet cutting or by an etching process.
  • the adhesion of the conductor track structure 2 on the carrier foil 3 ensures compliance with the correct relative positioning of the individual line carrier webs 4 to each other and their precise transfer to the bottom plate 5. However, it should not be too large to later remove the carrier foil 3 without damaging the To allow conductor track structure 2.
  • the structuring of the metal foil to the conductor track structure 2 can also before or after application to the
  • Carrier film 3 done.
  • the carrier film 3 projects beyond the conductor track structure 2 at the edges. This facilitates, after the transfer of the conductor track structure 2 to the base plate 5 in step b), the removal of the carrier foil 3 from the conductor track structure 2 in step c) of the method according to the invention.
  • the production of a carrier composite 1 according to the invention in step a) can be automated.
  • the intermediate product 1 can be produced by a simple and cost-effective roll-to-roll process and provided for further processing as a roll or stack of individual carrier composites 1.
  • the industrialized production and transfer of a composite product can be adopted, for example, from the label manufacturing industry.
  • FIG. 2 shows a perspective top view of a signal and potential distribution system with one on a floorplate.
  • the printed conductor structure 2 can be laminated to the bottom plate 5, for example, by means of an acrylic adhesive film 12.
  • the bottom plate 5 is preferably an aluminum plate.
  • the conductor track structure 2 projects beyond an edge of the base plate 5 and thus allows the contact on both sides.
  • the conductor track structure 2 may be fully flattened on the bottom plate 5. If the printed conductor structure 2 is not connected in parts to the base plate 5, a double-sided contact can also be produced here.
  • the conductor track structure 2 is suitable for all contacting processes, such as soldering, welding, bonding or conductive bonding.
  • an electronic substrate 7 is arranged in a cutout 6 in the printed conductor structure 2, which is contacted via thick wire bonds 8 with printed conductors 4 of the printed conductor structure 2.
  • the substrate 7 is hermetically sealed in mechatronic modules by a housing cover 9 (not shown) in order to protect the electronics compartment from chemical or mechanical influences, for example from transmission oil.
  • the edge regions of the conductor track structure 2 can each be used for contacting peripheral components.
  • FIG. 3 shows a partially exploded sectional view of the core unit of a mechatronic module with a signal and potential distribution system according to the invention.
  • This core unit includes a housing cover 9, an adhesive sealing ring 10, an electronic substrate 7 and a bottom plate 5.
  • the substrate 7 is contacted with conductor track substructures IIa by means of thick-wire bonds 8.
  • These conductor track substructures can be precisely positioned on the bottom plate 5 with the method according to the invention.
  • further conductor track substructures IIb can be applied to the bottom plate 5 in a precisely predetermined position.
  • the conductor track structures IIa and IIb can be contacted with each other.
  • the hermetic sealing of the electronics compartment with the substrate 7 can be known Types, for example, by inserting seals between the cover 9 and bottom plate 5 and / or conductor track structure 2, sealing adhesive and / or lamination of the housing cover 9 on the bottom plate 5 and / or the track structure 2 can be realized. If the cover 9 is laminated on, the lamination can advantageously protrude beyond the housing cover 9 and thus completely or partially protect open conductor track areas from conductive contamination and at the same time support or stiffen them.
  • FIG. 4 shows an enlarged sectional view of a detail in the contacting region of a mechatronic module from FIG. 3.
  • the substrate 7 is contacted with conductor track substructures IIa by means of thick-wire bonds 8 and simultaneously with the conductor track substructure IIb, which in turn arranges the electronic connection to peripheral ones arranged outside the electronics compartment Can form components.
  • the contacting of the conductor track part structure IIa to the track part structure IIb can be realized for example by a soldering process.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé de production d'un système de distribution de signaux et de potentiel pour des modules mécatroniques, ce système comprenant une structure de pistes conductrices (2) sur une plaque de base (5). Le procédé selon l'invention comprend les étapes suivantes : a) production d'une structure de pistes conductrices (2) à partie d'une feuille métallique, cette feuille métallique étant appliquée sur une feuille support (3) adhésive avant ou après texturation; b) application du composite (1) composé de la structure de pistes conductrices (2) et de la feuille support (3) sur une plaque de base (5) et établissement d'une liaison d'adhérence électriquement isolée entre la structure de pistes conductrices (2) et la plaque de base (5); c) retrait de la feuille support (3) de la structure de pistes conductrices (2). L'invention concerne également un système de distribution de signaux et de potentiel pour des modules mécatroniques comprenant une plaque de base (5) et une structure de pistes conductrices (2) appliquée sur celle-ci, la structure de pistes conductrices (2) étant constituée d'une feuille métallique texturée contrecollée directement sur la plaque de base (5).
PCT/EP2008/051917 2007-04-13 2008-02-18 Procédé de production d'un système de distribution de signaux et de potentiel pour modules mécatroniques WO2008125372A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007017531A DE102007017531A1 (de) 2007-04-13 2007-04-13 Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatronische Module
DE102007017531.2 2007-04-13

Publications (1)

Publication Number Publication Date
WO2008125372A1 true WO2008125372A1 (fr) 2008-10-23

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PCT/EP2008/051917 WO2008125372A1 (fr) 2007-04-13 2008-02-18 Procédé de production d'un système de distribution de signaux et de potentiel pour modules mécatroniques

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WO (1) WO2008125372A1 (fr)

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DE102011108198A1 (de) * 2011-07-22 2012-03-29 Fela Holding Gmbh Metallkernleiterplatte mit Eloxalschicht
DE102015208529B3 (de) * 2015-02-10 2016-08-04 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zu deren Herstellung

Citations (4)

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WO2006010652A1 (fr) * 2004-07-28 2006-02-02 Siemens Aktiengesellschaft Dispositif de commande, notamment appareil de commande mecatronique de transmission ou de moteur
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