WO2008125372A1 - Method for the production of a signal and potential distribution system for mechatronic modules - Google Patents

Method for the production of a signal and potential distribution system for mechatronic modules Download PDF

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Publication number
WO2008125372A1
WO2008125372A1 PCT/EP2008/051917 EP2008051917W WO2008125372A1 WO 2008125372 A1 WO2008125372 A1 WO 2008125372A1 EP 2008051917 W EP2008051917 W EP 2008051917W WO 2008125372 A1 WO2008125372 A1 WO 2008125372A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor track
base plate
track structure
distribution system
signal
Prior art date
Application number
PCT/EP2008/051917
Other languages
German (de)
French (fr)
Inventor
Josef Loibl
Karl Smirra
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2008125372A1 publication Critical patent/WO2008125372A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the invention relates to a method for producing a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate according to the preamble of patent claim 1, in particular for the production of transmission or engine controls in the automotive industry.
  • control electronics In automotive engineering, components such as transmission, engine or brake systems are increasingly being primarily electronically controlled. There is a trend towards mechatronic controls, ie the integration of control electronics and the associated electronic components, such as sensors or valves in the transmission, the engine or the brake system. Control devices thus generally have a plurality of electronic components, which are in connection with other components outside of the control unit. With such "on-the-spot" electronics, these controllers are no longer housed in a separate protected electronics room and must therefore withstand environmental, mechanical, thermal and chemical stresses, typically housed in special enclosures and providing an important shielding function ,
  • the core unit for example an electronic transmission control, is therefore designed from a base plate, an electronic substrate, the conductor track structures and a hermetically sealed cover.
  • Such electronic modules are needed in large quantities and must therefore be very inexpensive to produce.
  • a short-circuit-proof electrical connection from the hermetically sealed housing interior side of the electronics compartment to the housing exterior to peripheral components is necessary. So far, signal and potential distributions from a hermetically sealed electronics space are usually realized by stamped grid, rigid printed circuit boards or flexible printed circuit boards. Flexible printed circuit boards have proven to be particularly variable because they also fulfill the desired functionality with a relatively simple sealing configuration.
  • the usual structure with flexible printed circuit boards for such mechatronic applications consists of a base layer as
  • the object of the invention is to provide an alternative method with which a short circuit-proof printed conductor structure of a signal and potential distribution system can be produced simply and inexpensively and applied to a metallic base plate.
  • a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate by the following method steps: a) producing a conductor track structure from a metal foil, the metal foil being applied to an adhesive carrier foil before or after structuring; b) applying the composite of conductor track structure and carrier foil to a base plate and producing an electrically insulated adhesive bond between the conductor track structure and base plate; c) removing the carrier foil from the conductor track structure.
  • the method according to the invention can be used to generate complex interconnect structures and, by a simple transfer process in steps b) and c), to generate a trace be transferred to a metallic base plate safely.
  • the conductor track structure applied to the base plate can assume the complete function of the electrical connection as well as the signal and potential distribution in mechatronic modules.
  • Printed circuit boards in particular flexible printed circuit boards with their multilayer structure, for this purpose is therefore no longer necessary.
  • a metal foil according to the invention for example, a silver foil, a gold foil, a nickel foil or an aluminum foil can be used.
  • a copper foil is used as the metal foil.
  • the metallic bottom plate is preferably an aluminum plate.
  • the bottom plate may have a thickness of 2 mm to 5 mm, preferably 3 mm to 4 mm.
  • Other materials and strong plates are conceivable as long as they ensure a suitable heat dissipation for mechatronic modules for the respective application.
  • Structuring in the sense of the invention means that individual strip conductors are formed from the metal foil, which are spaced apart from one another and thus electrically insulated from one another.
  • structuring is preferably effected by a stamping process, laser cutting, water jet cutting or other known mechanical, chemical and / or thermal separation processes.
  • a composite of conductor track structure and carrier film is produced in step a).
  • This composite is inventively referred to as Tragerverbund.
  • the carrier composite can be produced by a simple roll-to-roll process and used for further processing as a roll or stack of individual trays. be provided gerverbunden.
  • the structuring of the metal foil to produce the conductor track structure can take place before or after the production of the carrier composite.
  • the industrialized production of such a composite product can advantageously be undertaken, for example, from the label manufacturing industry.
  • the metal foil can be plated or coated before or after step a).
  • the cladding or coating may be provided in whole or in part.
  • the coatings can, for example, be protective coatings or serve for better connection to other components of a mechatronic module.
  • Ni / Au pads can be provided on the track surface to prepare for bonding processes.
  • the metal foil can carry a passively adhering layer on the side facing away from the carrier foil.
  • Passive adhesion means that this layer can develop adhesion properties only under the influence of pressure or temperature and can thus be attached to further layers and / or surfaces.
  • the further layer may be the bottom plate or a layer arranged on the bottom plate.
  • the bottom plate can be provided with an adhesive medium before step b).
  • the adhesive medium may be a passively or actively adhering adhesive film, in particular an acrylic adhesive film.
  • the inventive method thus opens up variable possibilities for the industrialized production of a composite of conductor track structure and base plate.
  • This composite is inventively referred to as an adhesive bond.
  • the base plate can be provided with an electrically insulating coating before step b).
  • This can be, for example, an anodized layer, an enamel layer or a lacquer layer. Due to the electrically insulating layer on the bottom plate, a greater choice of adhesion layer to the conductor track structure and their properties can be created. It is possible in this way, even without the risk of short circuits, to apply the conductor track structures directly on the metallic coated bottom plate.
  • two or more, equally or differently configured conductor track part structures can be applied to a base plate.
  • coated and uncoated trace substructures can be applied to the metallic bottom plate.
  • conductor track substructures of different sizes and shapes can be applied to the bottom plate by the method according to the invention. This can be done simultaneously in one or in successive processes according to the invention. This can be used particularly advantageously if the contact regions to the substrate are provided with Ni-Au pads on the conductor track surface. Thus, these can be prepared for bonding processes, while the other conductor track substructures need no coating.
  • two or more of the conductor track substructures applied to the bottom plate may be electrically connected to each other.
  • two or more of the conductor track substructures Form overlapping areas.
  • the conductor track substructures can form intersection areas, for example. These can be advantageously used for unbundling the signal and current paths.
  • the invention further relates to a signal and potential distribution system for mechatronic modules having a base plate and a printed conductor structure applied thereon, the printed conductor structure being formed by a structured metal foil laminated directly onto the base plate.
  • complex printed conductor structures can be produced by a transfer process, wherein the printed conductor structure previously forms a carrier composite with a carrier foil.
  • the printed conductor structures applied to the base plate can assume the complete function of the electrical connection as well as the signal and potential distribution to all peripheral components, for example in mechatronic modules.
  • a use of costly printed circuit boards, in particular the flexible printed circuit boards described above, for this purpose is no longer necessary.
  • the conductor track structure is laminated to a bottom plate made of aluminum.
  • the conductor track structure is fixed by means of acrylic adhesive film on the bottom plate.
  • the conductor track structure can be adapted to the size of the base plate, or it can project beyond the base plate at one or more edges.
  • the printed conductor structure according to the invention permits contact on both sides and is therefore open to all known electrical contacting processes, such as soldering, welding, bonding or conductive bonding.
  • the interconnect structure and the individual interconnects formed therewith can flush flush with the bottom plate or protrude beyond the edges of the bottom plate.
  • the ladder- Railway structures can also run over openings in the floor slab.
  • the acrylic adhesive film at least partially project beyond the edges of the bottom plate.
  • the acrylic adhesive film it is also possible, for example, for the conductor tracks projecting beyond the base plate to be protected against contamination and, if appropriate, to be stiffened or supported.
  • the invention also relates to the use of an inventive signal and potential distribution system for a mechatronic module, preferably for a transmission control, of a motor vehicle.
  • the individual process steps a) to c) can be automated and are therefore advantageously suitable for mass production.
  • the application of the conductor track structure to a carrier foil ensures compliance with the correct relative positioning of the individual conductor carrier tracks which are separated from one another by the cutting process in step a).
  • Figure 1 is a plan view of a composite of printed circuit board structure and carrier sheet.
  • FIG. 2 shows a perspective top view of a printed conductor structure applied to a base plate;
  • FIG. 3 is a partially exploded sectional view of the core unit of a mechatronic module with a signal and potential distribution system according to the invention; 4 is an enlarged sectional view of a detail in Maisier Scheme in a mechatronic module of FIG .. 3
  • FIG. 1 shows a composite 1 of a conductor track structure 2 made of a metal foil with a carrier foil 3.
  • This carrier composite 1 is obtained in the process according to the invention as an intermediate product in step a).
  • the printed conductor structure 2 can be produced, for example, by stamping processes, laser cutting, water jet cutting or by an etching process.
  • the adhesion of the conductor track structure 2 on the carrier foil 3 ensures compliance with the correct relative positioning of the individual line carrier webs 4 to each other and their precise transfer to the bottom plate 5. However, it should not be too large to later remove the carrier foil 3 without damaging the To allow conductor track structure 2.
  • the structuring of the metal foil to the conductor track structure 2 can also before or after application to the
  • Carrier film 3 done.
  • the carrier film 3 projects beyond the conductor track structure 2 at the edges. This facilitates, after the transfer of the conductor track structure 2 to the base plate 5 in step b), the removal of the carrier foil 3 from the conductor track structure 2 in step c) of the method according to the invention.
  • the production of a carrier composite 1 according to the invention in step a) can be automated.
  • the intermediate product 1 can be produced by a simple and cost-effective roll-to-roll process and provided for further processing as a roll or stack of individual carrier composites 1.
  • the industrialized production and transfer of a composite product can be adopted, for example, from the label manufacturing industry.
  • FIG. 2 shows a perspective top view of a signal and potential distribution system with one on a floorplate.
  • the printed conductor structure 2 can be laminated to the bottom plate 5, for example, by means of an acrylic adhesive film 12.
  • the bottom plate 5 is preferably an aluminum plate.
  • the conductor track structure 2 projects beyond an edge of the base plate 5 and thus allows the contact on both sides.
  • the conductor track structure 2 may be fully flattened on the bottom plate 5. If the printed conductor structure 2 is not connected in parts to the base plate 5, a double-sided contact can also be produced here.
  • the conductor track structure 2 is suitable for all contacting processes, such as soldering, welding, bonding or conductive bonding.
  • an electronic substrate 7 is arranged in a cutout 6 in the printed conductor structure 2, which is contacted via thick wire bonds 8 with printed conductors 4 of the printed conductor structure 2.
  • the substrate 7 is hermetically sealed in mechatronic modules by a housing cover 9 (not shown) in order to protect the electronics compartment from chemical or mechanical influences, for example from transmission oil.
  • the edge regions of the conductor track structure 2 can each be used for contacting peripheral components.
  • FIG. 3 shows a partially exploded sectional view of the core unit of a mechatronic module with a signal and potential distribution system according to the invention.
  • This core unit includes a housing cover 9, an adhesive sealing ring 10, an electronic substrate 7 and a bottom plate 5.
  • the substrate 7 is contacted with conductor track substructures IIa by means of thick-wire bonds 8.
  • These conductor track substructures can be precisely positioned on the bottom plate 5 with the method according to the invention.
  • further conductor track substructures IIb can be applied to the bottom plate 5 in a precisely predetermined position.
  • the conductor track structures IIa and IIb can be contacted with each other.
  • the hermetic sealing of the electronics compartment with the substrate 7 can be known Types, for example, by inserting seals between the cover 9 and bottom plate 5 and / or conductor track structure 2, sealing adhesive and / or lamination of the housing cover 9 on the bottom plate 5 and / or the track structure 2 can be realized. If the cover 9 is laminated on, the lamination can advantageously protrude beyond the housing cover 9 and thus completely or partially protect open conductor track areas from conductive contamination and at the same time support or stiffen them.
  • FIG. 4 shows an enlarged sectional view of a detail in the contacting region of a mechatronic module from FIG. 3.
  • the substrate 7 is contacted with conductor track substructures IIa by means of thick-wire bonds 8 and simultaneously with the conductor track substructure IIb, which in turn arranges the electronic connection to peripheral ones arranged outside the electronics compartment Can form components.
  • the contacting of the conductor track part structure IIa to the track part structure IIb can be realized for example by a soldering process.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a method for the production of a signal and potential distribution system for mechatronic modules, having a circuit path structure (2) on a base plate (5), comprising the following steps: a) production of a circuit path structure (2) made of a metal foil, wherein the metal foil is attached either before or after the structuring to an adhesive support foil (3); b) attachment of the composite (1) of the circuit path structure (2) and support foil (3) to a base plate (5) and production of an electrically insulated adhesive composite between the circuit path structure (2) and the base plate (5); c) removal of the support foil (3) from the circuit path structure (2). The invention also relates to a signal and potential distribution system for mechatronic modules, having a base plate (5) and a circuit path structure (2) attached thereon, wherein the circuit path structure (2) is formed from a structured metal foil laminated directly onto the base plate (5).

Description

Beschreibungdescription
Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatronische ModuleMethod for producing a signal and potential distribution system for mechatronic modules
Die Erfindung betrifft ein Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatronische Module mit einer Leiterbahnstruktur auf einer metallischen Bodenplatte gemäß dem Oberbegriff des Patentanspruchs 1, ins- besondere für die Herstellung von Getriebe- oder Motorsteuerungen in der Automobilindustrie.The invention relates to a method for producing a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate according to the preamble of patent claim 1, in particular for the production of transmission or engine controls in the automotive industry.
Stand der TechnikState of the art
In der Kraftfahrzeugtechnik werden Komponenten wie Getriebe-, Motoren- oder Bremssysteme zunehmend vornehmlich elektronisch gesteuert. Hierbei gibt es eine Entwicklung hin zu mechatro- nischen Steuerungen, also zur Integration von Steuerelektronik und den zugehörigen elektronischen Komponenten, wie Sen- soren oder Ventile in das Getriebe, den Motor oder das Bremssystem. Steuergerate weisen also im Allgemeinen eine Vielzahl an elektronischen Komponenten auf, welche in Verbindung mit anderen Komponenten außerhalb des Steuergerätes stehen. Bei solchen „Vorort-Elektroniken" sind diese Steuerungen nicht mehr in einem separaten geschützten Elektronikraum untergebracht und müssen daher entsprechenden Umwelteinflüssen und mechanischen, thermischen sowie chemischen Beanspruchungen standhalten. Sie werden zu diesem Zweck normalerweise in spezielle Gehäuse eingesetzt. Zudem erfüllen die Gehäuse eine wichtige Abschirmfunktion.In automotive engineering, components such as transmission, engine or brake systems are increasingly being primarily electronically controlled. There is a trend towards mechatronic controls, ie the integration of control electronics and the associated electronic components, such as sensors or valves in the transmission, the engine or the brake system. Control devices thus generally have a plurality of electronic components, which are in connection with other components outside of the control unit. With such "on-the-spot" electronics, these controllers are no longer housed in a separate protected electronics room and must therefore withstand environmental, mechanical, thermal and chemical stresses, typically housed in special enclosures and providing an important shielding function ,
Die Kerneinheit, beispielsweise einer elektronischen Getriebesteuerung, wird daher aus einer Bodenplatte, einem elektronischen Substrat, den Leiterbahnstrukturen und einer herme- tisch dichten Verdeckelung konzipiert. Solche elektronischen Module werden in großer Stuckzahl benotigt und müssen daher sehr kostengünstig herstellbar sein. Um eine verlassliche kurzschlusssichere Verbindung zu außerhalb des Gehäuses liegenden Komponenten zu ermöglichen, ist eine kurzschlusssichere elektrische Verbindung von der herme- tisch dichten Gehauseinnenseite des Elektronikraums zur Gehauseaußenseite zu peripheren Komponenten notwendig. Bisher werden Signal- und Potentialverteilungen aus einem hermetisch dichten Elektronikraum üblicherweise durch Stanzgitter, starre Leiterplatten oder flexible Leiterplatten verwirklicht. Als besonders variabel haben sich flexible Leiterplatten erwiesen, da sie auch mit einer relativ einfachen Abdichtungskonfiguration die gewünschten Funktionalitaten erfüllen.The core unit, for example an electronic transmission control, is therefore designed from a base plate, an electronic substrate, the conductor track structures and a hermetically sealed cover. Such electronic modules are needed in large quantities and must therefore be very inexpensive to produce. In order to allow a reliable short-circuit-proof connection to components located outside the housing, a short-circuit-proof electrical connection from the hermetically sealed housing interior side of the electronics compartment to the housing exterior to peripheral components is necessary. So far, signal and potential distributions from a hermetically sealed electronics space are usually realized by stamped grid, rigid printed circuit boards or flexible printed circuit boards. Flexible printed circuit boards have proven to be particularly variable because they also fulfill the desired functionality with a relatively simple sealing configuration.
Der übliche Aufbau mit flexiblen Leiterplatten für solche me- chatronischen Anwendungen besteht aus einer Basislage alsThe usual structure with flexible printed circuit boards for such mechatronic applications consists of a base layer as
Verbund aus Polyimidfolie, Acrylkleberfolie und Kupfer-Folie. Die Kupferlage erhalt üblicherweise durch einen Atzprozess eine leitende Bahnstruktur. Diese Leiterbahnstrukturen müssen bondbare, schweissbare und/oder lotbare Oberflachen im Kon- taktierbereich aufweisen. Zum notwendigen Schutz vor Kontamination, Beschädigungen und Leiterbahnkurzschlussen wird eine Decklage aus Polyimidfolie auf die strukturierte Kupferlage mit Acrylkleberfolie auflaminiert . Dieser gesamte Verbund aus Basislage, Kupferlage und Decklage wird dann auf eine Boden- platte auflaminiert . Der zwischenzeitlich verstärkte Einsatz von flexiblen Leiterplatten dieses Aufbaus in integrierten Mechatroniken ist jedoch ein signifikanter Kostentreiber.Composite of polyimide film, acrylic adhesive film and copper foil. The copper layer usually receives a conductive web structure through an etching process. These interconnect structures must have bondable, weldable and / or solderable surfaces in the contact area. For the necessary protection against contamination, damage and short circuiting a cover layer of polyimide film is laminated onto the structured copper layer with acrylic adhesive film. This entire composite of base layer, copper layer and cover layer is then laminated to a base plate. However, the increased use of flexible printed circuit boards of this design in integrated mechatronics is a significant cost driver.
Bisher wurden verschiedene Konzepte entwickelt den Einsatz der elektronischen Verbindungen, insbesondere die flexiblen Leiterplatten selbst, kostengünstiger bereitzustellen. Eines dieser Konzepte sieht den Einsatz von Teil-Leiterplatten als Teilflexbereiche vor, die unter anderem eine verbesserte Flachenausnutzung der Leiterplattenbereiche ermöglichen. Ein al- ternativer Ansatz ist der Verzicht auf Deckfolienbereiche der flexiblen Leiterplatten, wobei der notwendige Spanschutz der Leiterbahnen durch ohnehin vorhandene oder im Herstellungs- prozess deutlich kostengünstigere Bauteile übernommen und gewahrleistet wird. Es wird jedoch aufgrund des steigenden Bedarfs verstärkt nach weiteren Alternativen gesucht, die Kosten der Herstellung von elektrischen Verbindungen, insbeson- dere der Konzepte mit starren und/oder flexiblen Leiterplatten zu reduzieren.So far, various concepts have been developed to provide the use of electronic connections, in particular the flexible circuit boards themselves, more cost effective. One of these concepts envisages the use of partial printed circuit boards as partial flex areas, which among other things enable an improved area utilization of the printed circuit board areas. An alternative approach is the elimination of cover foil areas of the flexible printed circuit boards, whereby the necessary chip protection of the printed circuit traces can be achieved by existing or in the manufacturing process. significantly more cost-effective components are taken over and ensured. However, due to the increasing demand, more and more alternatives are being sought to reduce the costs of producing electrical connections, in particular the concepts with rigid and / or flexible printed circuit boards.
Aufgabenstellungtask
Aufgabe der Erfindung ist es, ein alternatives Verfahren bereitzustellen, mit dem eine kurzschlusssichere Leiterbahnstruktur eines Signal- und Potentialverteilungssystems einfach und kostengünstig hergestellt und auf eine metallische Bodenplatte appliziert werden kann.The object of the invention is to provide an alternative method with which a short circuit-proof printed conductor structure of a signal and potential distribution system can be produced simply and inexpensively and applied to a metallic base plate.
Dies wird erfindungsgemaß mit einem Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatroni- sche Module mit einer Leiterbahnstruktur auf einer metallischen Bodenplatte gemäß dem Oberbegriff des Patentanspruchs 1 erreicht.This is inventively achieved with a method for producing a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate according to the preamble of patent claim 1.
Erfindungsgemaß wird vorgeschlagen, ein Signal- und Potentialverteilungssystem für mechatronische Module mit einer Leiterbahnstruktur auf einer metallischen Bodenplatte durch fol- gende Verfahrensschritte herzustellen: a) Erzeugen einer Leiterbahnstruktur aus einer Metallfolie, wobei die Metallfolie vor oder nach dem Strukturieren auf eine haftende Tragerfolie aufgebracht wird; b) Aufbringen des Verbunds aus Leiterbahnstruktur und Tra- gerfolie auf eine Bodenplatte und Erzeugen eines elektrisch isolierten Haftverbunds zwischen Leiterbahnstruktur und Bodenplatte; c) Entfernen der Tragerfolie von der Leiterbahnstruktur.According to the invention, it is proposed to produce a signal and potential distribution system for mechatronic modules with a conductor track structure on a metallic base plate by the following method steps: a) producing a conductor track structure from a metal foil, the metal foil being applied to an adhesive carrier foil before or after structuring; b) applying the composite of conductor track structure and carrier foil to a base plate and producing an electrically insulated adhesive bond between the conductor track structure and base plate; c) removing the carrier foil from the conductor track structure.
Mit anderen Worten können durch das erfindungsgemaße Verfahren komplexe Leiterbahnstrukturen erzeugt und durch einen einfachen Transferprozess in Schritt b) und c) von einer Tra- gerfolie auf eine metallische Bodenplatte sicher übertragen werden. Die auf der Bodenplatte aufgebrachte Leiterbahnstruktur kann die vollständige Funktion der elektrischen Verbindung sowie der Signal- und Potentialverteilung in mechatroni- sehen Modulen übernehmen. Ein Einsatz von kostenintensivenIn other words, the method according to the invention can be used to generate complex interconnect structures and, by a simple transfer process in steps b) and c), to generate a trace be transferred to a metallic base plate safely. The conductor track structure applied to the base plate can assume the complete function of the electrical connection as well as the signal and potential distribution in mechatronic modules. A use of costly
Leiterplatten, insbesondere flexiblen Leiterplatten mit ihrem mehrschichtigen Aufbau, zu diesem Zweck ist daher nicht mehr notwendig .Printed circuit boards, in particular flexible printed circuit boards with their multilayer structure, for this purpose is therefore no longer necessary.
Als Metallfolie kann erfindungsgemaß beispielsweise eine Silberfolie, eine Goldfolie, eine Nickelfolie oder eine Aluminiumfolie eingesetzt werden. Bevorzugt wird jedoch eine Kupferfolie als Metallfolie verwendet.As a metal foil according to the invention, for example, a silver foil, a gold foil, a nickel foil or an aluminum foil can be used. Preferably, however, a copper foil is used as the metal foil.
Die metallische Bodenplatte ist bevorzugt eine Aluminiumplatte. Die Bodenplatte kann eine Dicke von 2 mm bis 5 mm, bevorzugt von 3 mm bis 4 mm aufweisen. Auch andere Materialien und Plattenstarken sind denkbar, sofern sie eine für die jeweilige Anwendung geeignete Wärmeableitung für mechatronische Module gewahrleisten.The metallic bottom plate is preferably an aluminum plate. The bottom plate may have a thickness of 2 mm to 5 mm, preferably 3 mm to 4 mm. Other materials and strong plates are conceivable as long as they ensure a suitable heat dissipation for mechatronic modules for the respective application.
Strukturieren im Sinne der Erfindung bedeutet, dass aus der Metallfolie einzelne Leiterbahnen ausgebildet werden, die voneinander beabstandet und somit voneinander elektrisch iso- liert sind. Bevorzugt wird das Strukturieren erfindungsgemaß durch einen Stanzprozess , ein Laserschneiden, ein Wasserstrahlschneiden, oder andere bekannte mechanische, chemische und/oder thermische Trennprozesse bewirkt. Ein Vorteil ist, dass diese Prozesse ohne Probleme automatisierbar und daher für die Massenproduktion verwendbar sind.Structuring in the sense of the invention means that individual strip conductors are formed from the metal foil, which are spaced apart from one another and thus electrically insulated from one another. According to the invention, structuring is preferably effected by a stamping process, laser cutting, water jet cutting or other known mechanical, chemical and / or thermal separation processes. One advantage is that these processes can be automated without any problems and can therefore be used for mass production.
Als Zwischenprodukt im erfindungsgemaßen Verfahren wird ein Verbund aus Leiterbahnstruktur und Tragerfolie in Schritt a) hergestellt. Dieser Verbund wird erfindungsgemaß auch als Tragerverbund bezeichnet. Der Tragerverbund kann durch einen einfachen Rolle-zu-Rolle Prozess erzeugt werden und zur Weiterverarbeitung als Rolle oder Stapel von vereinzelten Tra- gerverbunden bereitgestellt werden. Die Strukturierung der Metallfolie zur Erzeugung der Leiterbahnstruktur kann vor o- der nach der Herstellung des Tragerverbunds erfolgen. Die industrialisierte Herstellung eines solchen Verbundprodukts kann vorteilhafterweise zum Beispiel aus der Etikett- Herstellungsindustrie übernommen werden.As an intermediate in the process according to the invention, a composite of conductor track structure and carrier film is produced in step a). This composite is inventively referred to as Tragerverbund. The carrier composite can be produced by a simple roll-to-roll process and used for further processing as a roll or stack of individual trays. be provided gerverbunden. The structuring of the metal foil to produce the conductor track structure can take place before or after the production of the carrier composite. The industrialized production of such a composite product can advantageously be undertaken, for example, from the label manufacturing industry.
In einer weiteren Ausgestaltung des erfindungsgemaßen Verfahrens kann die Metallfolie vor oder nach dem Schritt a) plat- tiert oder beschichtet werden. Die Plattierung oder Beschich- tung kann ganz oder nur teilweise vorgesehen werden. Die Be- schichtungen können beispielsweise Schutzbeschichtungen sein oder zur besseren Anbindung an weitere Komponenten eines me- chatronischen Moduls dienen. Es können zum Beispiel Ni/Au- Auflagen auf der Leiterbahnoberflache vorgesehen werden, um diese für Bondprozesse vorzubereiten.In a further embodiment of the method according to the invention, the metal foil can be plated or coated before or after step a). The cladding or coating may be provided in whole or in part. The coatings can, for example, be protective coatings or serve for better connection to other components of a mechatronic module. For example, Ni / Au pads can be provided on the track surface to prepare for bonding processes.
In einer anderen bevorzugten Ausfuhrungsform kann die Metallfolie auf der der Tragerfolie abgewandten Seite eine passiv haftende Schicht tragen. Passiv haftend bedeutet, dass diese Schicht erst unter Druck- oder Temperatureinwirkung Haftungseigenschaften entwickelt und so an weiteren Schichten und/oder Oberflachen befestigt werden kann. Die weitere Schicht kann die Bodenplatte oder eine auf der Bodenplatte angeordnete Schicht sein.In another preferred embodiment, the metal foil can carry a passively adhering layer on the side facing away from the carrier foil. Passive adhesion means that this layer can develop adhesion properties only under the influence of pressure or temperature and can thus be attached to further layers and / or surfaces. The further layer may be the bottom plate or a layer arranged on the bottom plate.
Zusatzlich oder alternativ zu dieser Ausfuhrungsform kann die Bodenplatte vor Schritt b) mit einem Haftmedium versehen werden. Das Haftmedium kann eine passiv oder aktiv haftende Klebefolie, insbesondere eine Acrylkleberfolie sein.Additionally or alternatively to this embodiment, the bottom plate can be provided with an adhesive medium before step b). The adhesive medium may be a passively or actively adhering adhesive film, in particular an acrylic adhesive film.
Das erfindungsgemaße Verfahren eröffnet damit variable Möglichkeiten zur industrialisierten Herstellung eines Verbunds aus Leiterbahnstruktur und Bodenplatte. Dieser Verbund wird erfindungsgemaß auch als Haftverbund bezeichnet. In einem erfindungsgemäß bevorzugten Verfahren kann die Bodenplatte vor Schritt b) mit einer elektrisch isolierenden Beschichtung versehen sein. Dies kann zum Beispiel eine Eloxalschicht, eine Emailleschicht oder eine Lackschicht sein. Durch die elektrisch isolierende Schicht auf der Bodenplatte kann eine größere Auswahlmoglichkeit der Haftschicht zur Leiterbahnstruktur und ihrer Eigenschaften geschaffen werden. Es ist auf diese Weise sogar ohne die Gefahr von Kurzschlüssen möglich, die Leiterbahnstrukturen direkt auf die metallische beschichtete Bodenplatte aufzubringen.The inventive method thus opens up variable possibilities for the industrialized production of a composite of conductor track structure and base plate. This composite is inventively referred to as an adhesive bond. In a method which is preferred according to the invention, the base plate can be provided with an electrically insulating coating before step b). This can be, for example, an anodized layer, an enamel layer or a lacquer layer. Due to the electrically insulating layer on the bottom plate, a greater choice of adhesion layer to the conductor track structure and their properties can be created. It is possible in this way, even without the risk of short circuits, to apply the conductor track structures directly on the metallic coated bottom plate.
In einer weiteren Ausgestaltung der Erfindung ist vorgesehen, dass zwei oder mehr, gleich oder unterschiedlich ausgestaltete Leiterbahnteilstrukturen auf eine Bodenplatte aufgebracht werden können. Es können zum Beispiel beschichtete und unbeschichtete Leiterbahnteilstrukturen auf die metallische Bodenplatte aufgebracht werden. Es können auch Leiterbahnteilstrukturen unterschiedlicher Große und Form durch das erfin- dungsgemaße Verfahren auf die Bodenplatte appliziert werden. Dies kann gleichzeitig in einem oder in aufeinander folgenden erfindungsgemaßen Prozessen erfolgen. Besonders vorteilhaft kann dies eingesetzt werden, wenn die Kontaktierbereiche zum Substrat hin mit Ni-Au-Auflagen auf der Leiterbahnoberflache versehen werden. Damit können diese für Bondprozesse vorbe- reitet werden, wahrend die weiteren Leiterbahnteilstrukturen keine Beschichtung benotigen. Bevorzugt können zwei oder mehr der auf die Bodenplatte aufgebrachten Leiterbahnteilstrukturen elektrisch miteinander verbunden werden.In a further embodiment of the invention, it is provided that two or more, equally or differently configured conductor track part structures can be applied to a base plate. For example, coated and uncoated trace substructures can be applied to the metallic bottom plate. It is also possible to apply conductor track substructures of different sizes and shapes to the bottom plate by the method according to the invention. This can be done simultaneously in one or in successive processes according to the invention. This can be used particularly advantageously if the contact regions to the substrate are provided with Ni-Au pads on the conductor track surface. Thus, these can be prepared for bonding processes, while the other conductor track substructures need no coating. Preferably, two or more of the conductor track substructures applied to the bottom plate may be electrically connected to each other.
In einer alternativen Ausfuhrungsform des Verfahrens können des Weiteren selektive Beschichtungen auf einer einzigen Leiterbahnstruktur vorgesehen werden. Hierdurch kann auf eine Zwischenkontaktierung zwischen Leiterbahnteilstrukturen verzichtet und somit ein Herstellungsschritt eingespart werden.In an alternative embodiment of the method, furthermore, selective coatings can be provided on a single conductor track structure. As a result, it is possible to dispense with an intermediate contact between conductor track substructures and thus to save a production step.
In einer anderen bevorzugten Ausgestaltung des Verfahrens ist vorgesehen, dass zwei oder mehr der Leiterbahnteilstrukturen Uberlappungsbereiche bilden. Die Leiterbahnteilstrukturen können beispielsweise Kreuzungsbereiche bilden. Diese können vorteilhaft zur Entflechtung der Signal- und Strompfade genutzt werden.In another preferred embodiment of the method, it is provided that two or more of the conductor track substructures Form overlapping areas. The conductor track substructures can form intersection areas, for example. These can be advantageously used for unbundling the signal and current paths.
Die Erfindung betrifft weiterhin ein Signal- und Potentialverteilungssystem für mechatronische Module mit einer Bodenplatte und einer darauf aufgebrachten Leiterbahnstruktur, wobei die Leiterbahnstruktur von einer direkt auf die Boden- platte auflaminierten strukturierten Metallfolie gebildet wird .The invention further relates to a signal and potential distribution system for mechatronic modules having a base plate and a printed conductor structure applied thereon, the printed conductor structure being formed by a structured metal foil laminated directly onto the base plate.
Mit anderen Worten können durch das erfindungsgemaße Verfahren komplexe Leiterbahnstrukturen durch einen Transferprozess erzeugt werden, wobei die Leiterbahnstruktur vorher einen Tragerverbund mit einer Tragerfolie bildet. Die auf der Bodenplatte aufgebrachten Leiterbahnstrukturen können auf diese Weise die vollständige Funktion der elektrischen Verbindung sowie der Signal- und Potentialverteilung zu allen peripheren Komponenten, beispielsweise in mechatronischen Modulen, uber- nehmen. Ein Einsatz von kostenintensiven Leiterplatten, insbesondere den vorstehend beschriebenen flexiblen Leiterplatten, zu diesem Zweck ist nicht mehr notwendig.In other words, by means of the method according to the invention, complex printed conductor structures can be produced by a transfer process, wherein the printed conductor structure previously forms a carrier composite with a carrier foil. In this way, the printed conductor structures applied to the base plate can assume the complete function of the electrical connection as well as the signal and potential distribution to all peripheral components, for example in mechatronic modules. A use of costly printed circuit boards, in particular the flexible printed circuit boards described above, for this purpose is no longer necessary.
In einer bevorzugten Ausgestaltung der Erfindung wird die Leiterbahnstruktur auf eine Bodenplatte aus Aluminium auflaminiert. Besonders bevorzugt wird die Leiterbahnstruktur mittels Acrylkleberfolie auf der Bodenplatte fixiert. Die Leiterbahnstruktur kann auf die Große der Bodenplatte an- gepasst sein, oder sie kann die Bodenplatte an einer oder mehreren Kanten überragen. Die Leiterbahnstruktur erlaubt er- findungsgemaß einen beidseitigen Kontaktzugriff und ist daher offen für alle bekannten elektrischen Kontaktierprozesse, wie Loten, Schweißen, Bonden oder Leitkleben.In a preferred embodiment of the invention, the conductor track structure is laminated to a bottom plate made of aluminum. Particularly preferably, the conductor track structure is fixed by means of acrylic adhesive film on the bottom plate. The conductor track structure can be adapted to the size of the base plate, or it can project beyond the base plate at one or more edges. The printed conductor structure according to the invention permits contact on both sides and is therefore open to all known electrical contacting processes, such as soldering, welding, bonding or conductive bonding.
Die Leiterbahnstruktur und die damit ausgebildeten einzelnen Leiterbahnen können bundig mit der Bodenplatte abschließen oder über die Kanten der Bodenplatte herausragen. Die Leiter- bahnstrukturen können auch über Offnungen in der Bodenplatte verlaufen. Somit kann das erfindungsgemaße Signal- und Poten- tialverteilunssystem vorteilhaft auf spezifische Anwendungen und/oder besondere Kontaktiererfordernisse auf einfache Weise angepasst werden.The interconnect structure and the individual interconnects formed therewith can flush flush with the bottom plate or protrude beyond the edges of the bottom plate. The ladder- Railway structures can also run over openings in the floor slab. Thus, the inventive signal and potential distribution system can advantageously be adapted to specific applications and / or special contacting requirements in a simple manner.
In einer weiteren Ausgestaltung kann die Acrylkleberfolie mindestens teilweise die Kanten der Bodenplatte überragen. Durch die Acrylkleberfolie können beispielsweise auch die die Bodenplatte überragenden Leiterbahnen vor Kontamination geschützt und gegebenenfalls versteift beziehungsweise unterstutzt werden.In a further embodiment, the acrylic adhesive film at least partially project beyond the edges of the bottom plate. By virtue of the acrylic adhesive film, it is also possible, for example, for the conductor tracks projecting beyond the base plate to be protected against contamination and, if appropriate, to be stiffened or supported.
Die Erfindung betrifft außerdem die Verwendung eines erfin- dungsgemaßen Signal- und Potentialverteilungssystems für ein mechatronisches Modul, bevorzugt für eine Getriebesteuerung, eines Kraftfahrzeugs .The invention also relates to the use of an inventive signal and potential distribution system for a mechatronic module, preferably for a transmission control, of a motor vehicle.
Die einzelnen Verfahrensschritte a) bis c) sind automatisier- bar und daher vorteilhafterweise für die Massenproduktion geeignet. Die Aufbringung der Leiterbahnstruktur auf eine Tragerfolie gewahrleistet die Einhaltung der korrekten relativen Positionierung der einzelnen, durch den Schneidprozess in Schritt a) voneinander getrennten, Leitungstragerbahnen zu- einander.The individual process steps a) to c) can be automated and are therefore advantageously suitable for mass production. The application of the conductor track structure to a carrier foil ensures compliance with the correct relative positioning of the individual conductor carrier tracks which are separated from one another by the cutting process in step a).
Die Erfindung wird nachfolgend in beispielhafter Weise anhand von verschiedenen Ausfuhrungsvarianten in Verbindung mit den Zeichnungen erläutert. Sie ist jedoch nicht hierauf be- schrankt.The invention will be explained below by way of example with reference to various embodiments in conjunction with the drawings. However, it is not limited to this.
In dieser zeigt:In this shows:
Fig. 1 eine Draufsicht auf einen Verbund aus Leiterplattenstruktur und Tragerfolie; Fig. 2 eine perspektivische Draufsicht einer auf eine Bodenplatte aufgebrachte Leiterbahnstruktur; Fig. 3 eine teilexplodierte Schnittdarstellung auf die Kerneinheit eines mechatronischen Moduls mit einem erfindungsge- maßen Signal- und Potentialverteilungssystem; Fig. 4 eine vergrößerte Schnittdarstellung eines Details im Kontaktierbereich in einem mechatronischen Modul aus Fig. 3.Figure 1 is a plan view of a composite of printed circuit board structure and carrier sheet. FIG. 2 shows a perspective top view of a printed conductor structure applied to a base plate; FIG. 3 is a partially exploded sectional view of the core unit of a mechatronic module with a signal and potential distribution system according to the invention; 4 is an enlarged sectional view of a detail in Kontaktierbereich in a mechatronic module of FIG .. 3
Fig. 1 zeigt einen Verbund 1 einer Leiterbahnstruktur 2 aus einer Metallfolie mit einer Tragerfolie 3. Dieser Tragerverbund 1 wird im erfindungsgemaßen Verfahren als Zwischenpro- dukt im Schritt a) erhalten. Die Leiterbahnstruktur 2 kann beispielsweise durch Stanzprozesse, Laserschneiden, Wasserstrahlschneiden oder durch einen Atzprozess erzeugt werden. Die Haftung der Leiterbahnstruktur 2 auf der Tragerfolie 3 gewahrleistet die Einhaltung der korrekten relativen Positio- nierung der einzelnen Leitungstragerbahnen 4 zueinander und deren präzise Übertragung auf die Bodenplatte 5. Sie sollte jedoch nicht zu groß sein, um ein spateres Entfernen der Tragerfolie 3 ohne Beschädigung der Leiterbahnstruktur 2 zu ermöglichen. Die Strukturierung der Metallfolie zur Leiterbahn- struktur 2 kann vor aber auch nach dem Aufbringen auf die1 shows a composite 1 of a conductor track structure 2 made of a metal foil with a carrier foil 3. This carrier composite 1 is obtained in the process according to the invention as an intermediate product in step a). The printed conductor structure 2 can be produced, for example, by stamping processes, laser cutting, water jet cutting or by an etching process. The adhesion of the conductor track structure 2 on the carrier foil 3 ensures compliance with the correct relative positioning of the individual line carrier webs 4 to each other and their precise transfer to the bottom plate 5. However, it should not be too large to later remove the carrier foil 3 without damaging the To allow conductor track structure 2. The structuring of the metal foil to the conductor track structure 2 can also before or after application to the
Tragerfolie 3 erfolgen. Die Tragerfolie 3 überragt die Leiterbahnstruktur 2 an den Randern. Dies erleichtert nach dem Transfer der Leiterbahnstruktur 2 auf die Bodenplatte 5 in Schritt b) das Entfernen der Tragerfolie 3 von der Leiter- bahnstruktur 2 in Schritt c) des erfindungsgemaßen Verfahrens . Vorteilhafterweise kann die Herstellung eines erfindungsgemaßen Tragerverbunds 1 in Schritt a) automatisiert werden. Beispielsweise kann das Zwischenprodukt 1 durch einen einfachen und kostengünstigen Rolle-zu-Rolle-Prozess herge- stellt und zur Weiterverarbeitung als Rolle oder Stapel von vereinzelten Tragerverbunden 1 bereitgestellt werden. Die industrialisierte Herstellung und Transfer eines Verbundprodukts kann zum Beispiel aus der Etikett-Herstellungsindustrie übernommen werden.Carrier film 3 done. The carrier film 3 projects beyond the conductor track structure 2 at the edges. This facilitates, after the transfer of the conductor track structure 2 to the base plate 5 in step b), the removal of the carrier foil 3 from the conductor track structure 2 in step c) of the method according to the invention. Advantageously, the production of a carrier composite 1 according to the invention in step a) can be automated. For example, the intermediate product 1 can be produced by a simple and cost-effective roll-to-roll process and provided for further processing as a roll or stack of individual carrier composites 1. The industrialized production and transfer of a composite product can be adopted, for example, from the label manufacturing industry.
Fig. 2 zeigt eine perspektivische Draufsicht auf ein Signal- und Potentialverteilungssystem mit einer auf einer Bodenplat- te 5 aufgebrachten Leiterbahnstruktur 2. Die Leiterbahnstruktur 2 kann beispielsweise mittels einer Acrylkleberfolie 12 auf die Bodenplatte 5 auflaminiert sein. Die Bodenplatte 5 ist bevorzugt eine Aluminiumplatte. Die Leiterbahnstruktur 2 überragt in dieser Ausfuhrungsform eine Kante der Bodenplatte 5 und erlaubt damit den beidseitigen Kontaktzugriff. Die Leiterbahnstruktur 2 kann vollflachig auf der Bodenplatte 5 auflaminiert sein. Ist die Leiterbahnstruktur 2 in Teilen nicht mit der Bodenplatte 5 verbunden, kann auch hier ein beidsei- tiger Kontakt hergestellt werden. Die Leiterbahnstruktur 2 ist geeignet für alle Kontaktierprozesse, wie Loten, Schweißen, Bonden oder Leitkleben. Auf der Bodenplatte 5 ist in einem Ausschnitt 6 in der Leiterbahnstruktur 2 ein elektronisches Substrat 7 angeordnet, das über Dickdrahtbondungen 8 mit Leiterbahnen 4 der Leiterbahnstruktur 2 kontaktiert ist. Üblicherweise wird das Substrat 7 in mechatronischen Modulen hermetisch dicht durch einen Gehausedeckel 9 (nicht gezeigt) verschlossen, um den Elektronikraum vor chemischen oder mechanischen Einflüssen, beispielsweise vor Getriebeöl zu schützen. Die Randbereiche der Leiterbahnstruktur 2 können jeweils zur Kontaktierung an periphere Komponenten genutzt werden .FIG. 2 shows a perspective top view of a signal and potential distribution system with one on a floorplate. FIG. The printed conductor structure 2 can be laminated to the bottom plate 5, for example, by means of an acrylic adhesive film 12. The bottom plate 5 is preferably an aluminum plate. In this embodiment, the conductor track structure 2 projects beyond an edge of the base plate 5 and thus allows the contact on both sides. The conductor track structure 2 may be fully flattened on the bottom plate 5. If the printed conductor structure 2 is not connected in parts to the base plate 5, a double-sided contact can also be produced here. The conductor track structure 2 is suitable for all contacting processes, such as soldering, welding, bonding or conductive bonding. On the bottom plate 5, an electronic substrate 7 is arranged in a cutout 6 in the printed conductor structure 2, which is contacted via thick wire bonds 8 with printed conductors 4 of the printed conductor structure 2. Usually, the substrate 7 is hermetically sealed in mechatronic modules by a housing cover 9 (not shown) in order to protect the electronics compartment from chemical or mechanical influences, for example from transmission oil. The edge regions of the conductor track structure 2 can each be used for contacting peripheral components.
Fig. 3 zeigt eine teilexplodierte Schnittdarstellung auf die Kerneinheit eines mechatronischen Moduls mit einem erfin- dungsgemaßen Signal- und Potentialverteilungssystem. Diese Kerneinheit beinhaltet einen Gehausedeckel 9, einen Klebe- dichtring 10, ein elektronisches Substrat 7 und eine Bodenplatte 5. Das Substrat 7 ist mit Leiterbahnteilstrukturen IIa mittels Dickdrahtbondungen 8 kontaktiert. Diese Leiterbahnteilstrukturen können mit dem erfindungsgemaßen Verfahren präzise auf der Bodenplatte 5 positioniert werden. Weiterhin können erfindungsgemaß weitere Leiterbahnteilstrukturen IIb in genau vorgegebener Position auf die Bodenplatte 5 aufge- bracht werden. Die Leiterbahnteilstrukturen IIa und IIb können miteinander kontaktiert werden. Die hermetische Abdichtung des Elektronikraums mit dem Substrat 7 kann auf bekannte Arten, beispielsweise durch Einlegedichtungen zwischen Deckel 9 und Bodenplatte 5 und/oder Leiterbahnstruktur 2, Vergusskleber und/oder Auflaminieren des Gehausedeckels 9 auf der Bodenplatte 5 und/oder der Leiterbahnstruktur 2 realisiert werden. Wird der Deckel 9 auflaminiert , kann die Laminierung vorteilhafterweise auch über den Gehausedeckel 9 hinausragen und damit ganz oder teilweise offene Leiterbahnbereiche vor leitender Kontamination schützen und diese gleichzeitig unterstutzen oder versteifen.3 shows a partially exploded sectional view of the core unit of a mechatronic module with a signal and potential distribution system according to the invention. This core unit includes a housing cover 9, an adhesive sealing ring 10, an electronic substrate 7 and a bottom plate 5. The substrate 7 is contacted with conductor track substructures IIa by means of thick-wire bonds 8. These conductor track substructures can be precisely positioned on the bottom plate 5 with the method according to the invention. Furthermore, according to the invention further conductor track substructures IIb can be applied to the bottom plate 5 in a precisely predetermined position. The conductor track structures IIa and IIb can be contacted with each other. The hermetic sealing of the electronics compartment with the substrate 7 can be known Types, for example, by inserting seals between the cover 9 and bottom plate 5 and / or conductor track structure 2, sealing adhesive and / or lamination of the housing cover 9 on the bottom plate 5 and / or the track structure 2 can be realized. If the cover 9 is laminated on, the lamination can advantageously protrude beyond the housing cover 9 and thus completely or partially protect open conductor track areas from conductive contamination and at the same time support or stiffen them.
Fig. 4 zeigt eine vergrößerte Schnittdarstellung eines Details im Kontaktierbereich eines mechatronischen Moduls aus Fig. 3. Das Substrat 7 ist mit Leiterbahnteilstrukturen IIa mittels Dickdrahtbondungen 8 und gleichzeitig mit der Leiter- bahnteilstruktur IIb kontaktiert, die wiederum die elektronische Verbindung zu außerhalb des Elektronikraums angeordneten peripheren Komponenten bilden kann. Die Kontaktierung der Leiterbahnteilstruktur IIa zur Leiterbahnteilstruktur IIb kann beispielsweise durch einen Lotprozess realisiert werden. FIG. 4 shows an enlarged sectional view of a detail in the contacting region of a mechatronic module from FIG. 3. The substrate 7 is contacted with conductor track substructures IIa by means of thick-wire bonds 8 and simultaneously with the conductor track substructure IIb, which in turn arranges the electronic connection to peripheral ones arranged outside the electronics compartment Can form components. The contacting of the conductor track part structure IIa to the track part structure IIb can be realized for example by a soldering process.

Claims

Patentansprüche claims
1. Verfahren zur Herstellung eines Signal- und Potentialver- teilungssystems für mechatronische Module mit einer Leiterbahnstruktur auf einer metallischen Bodenplatte (5) umfassend die folgenden Schritte a) Erzeugen einer Leiterbahnstruktur (2) aus einer Metallfolie, wobei die Metallfolie vor oder nach dem Struktu- rieren auf eine haftende Tragerfolie (3) aufgebracht wird; b) Aufbringen des Verbunds (1) aus Leiterbahnstruktur (2) und Tragerfolie (3) auf eine Bodenplatte (5) und Erzeugen eines elektrisch isolierten Haftverbunds zwischen Leiterbahnstruktur (2) und Bodenplatte (5) ; c) Entfernen der Tragerfolie (3) von der Leiterbahnstruktur (2) .1. A method for producing a signal and potential distribution system for mechatronic modules having a conductor track structure on a metallic base plate (5) comprising the following steps a) producing a conductor track structure (2) from a metal foil, wherein the metal foil before or after the structure on an adhesive carrier sheet (3) is applied; b) applying the composite (1) of conductor track structure (2) and carrier foil (3) to a base plate (5) and producing an electrically insulated adhesive bond between the conductor track structure (2) and base plate (5); c) removing the carrier foil (3) from the conductor track structure (2).
2. Verfahren nach Ansprüche 1, dadurch gekennzeichnet, dass das Strukturieren ein Stanzprozess , ein Laserschneiden oder Wasserstrahlschneiden oder ein Atzprozess ist.2. The method according to claims 1, characterized in that the structuring is a punching process, a laser cutting or water jet cutting or an etching process.
3. Verfahren nach Ansprüche 1 oder 2, dadurch gekennzeich- net, dass der Verbund (1) aus Leiterbahnstruktur (2) und Tragerfolie (3) in Schritt a) durch einen Rolle-zu-Rolle Prozess erzeugt wird.3. The method according to claims 1 or 2, characterized marked, that the composite (1) of conductor track structure (2) and carrier foil (3) in step a) by a roll-to-roll process is generated.
4. Verfahren nach einem der vorhergehenden Ansprüche, da- durch gekennzeichnet, dass die Metallfolie vor oder nach4. The method according to any one of the preceding claims, character- ized in that the metal foil before or after
Schritt a) plattiert oder beschichtet wird.Step a) is plated or coated.
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass die Metallfolie auf der der Tragerfolie (3) abgewandten Seite eine passiv haftende Schicht tragt. 5. The method according to claim 4, characterized in that the metal foil carries on the side facing away from the carrier foil (3) a passively adhering layer.
6. Verfahren nach einem der vorhergehenden Ansprüche dadurch gekennzeichnet, dass die Bodenplatte (5) vor Schritt b) mit einem Haftmedium versehen wird.6. The method according to any one of the preceding claims, characterized in that the bottom plate (5) is provided before step b) with an adhesive medium.
7. Verfahren nach Anspruch 6 dadurch gekennzeichnet, dass das Haftmedium eine Klebefolie, insbesondere eine Acrylkle- berfolie (12) ist.7. The method according to claim 6, characterized in that the adhesive medium is an adhesive film, in particular an acrylic adhesive film (12).
8. Verfahren nach einem der vorhergehenden Ansprüche, da- durch gekennzeichnet, dass die Bodenplatte (5) aus Schritt b) mit einer elektrisch isolierenden Beschichtung versehen wird.8. The method according to any one of the preceding claims, character- ized in that the bottom plate (5) from step b) is provided with an electrically insulating coating.
9. Verfahren nach Anspruch 8 dadurch gekennzeichnet, dass die elektrisch isolierende Beschichtung eine Eloxalschicht, eine Emailleschicht oder eine Lackschicht ist.9. The method according to claim 8, characterized in that the electrically insulating coating is an anodized layer, an enamel layer or a lacquer layer.
10. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zwei oder mehr, gleich oder unterschiedlich ausgestaltete Leiterbahnteilstrukturen (11) auf eine Bodenplatte (5) aufgebracht werden.10. The method according to any one of the preceding claims, characterized in that two or more, the same or differently configured conductor track part structures (11) are applied to a bottom plate (5).
11. Verfahren nach Anspruch 10, dadurch gekennzeichnet, dass zwei oder mehr der Leiterbahnteilstrukturen (11) Uberlap- pungsbereiche bilden.11. The method according to claim 10, characterized in that two or more of the conductor track part structures (11) form overlap areas.
12. Verfahren nach Anspruch 10 oder 11, dadurch gekennzeichnet, dass zwei oder mehr der Leiterbahnteilstrukturen (2) e- lektrisch miteinander verbunden oder voneinander elektrisch isoliert werden.12. The method according to claim 10 or 11, characterized in that two or more of the conductor track part structures (2) are electrically connected to each other or electrically isolated from each other.
13. Signal- und Potentialverteilungssystem für mechatroni- sche Module mit einer Bodenplatte (5) und einer darauf aufgebrachten Leiterbahnstruktur (2) dadurch gekennzeichnet, dass die Leiterbahnstruktur (2) von einer direkt auf die Bodenplatte (5) auflaminierten strukturierten Metallfolie gebildet wird. 13. Signal and potential distribution system for mechatronic modules with a base plate (5) and a printed conductor structure (2) applied thereto, characterized in that the conductor track structure (2) is formed by a structured metal foil laminated directly onto the base plate (5).
14. Signal- und Potentialverteilungssystem nach Anspruch 13 dadurch gekennzeichnet, dass die Leiterbahnstruktur (2) mit einer Acrylkleberfolie (12) auf die Bodenplatte (5) auflaminiert wird.14. signal and potential distribution system according to claim 13, characterized in that the conductor track structure (2) with an acrylic adhesive film (12) on the bottom plate (5) is laminated.
15. Signal- und Potentialverteilungssystem nach Anspruch 14 dadurch gekennzeichnet, dass die Acrylkleberfolie (12) mindestens teilweise die Kanten der Bodenplatte (5) überragt.15. signal and potential distribution system according to claim 14, characterized in that the acrylic adhesive film (12) at least partially surmounted by the edges of the bottom plate (5).
16. Verwendung eines Signal- und Potentialverteilungssystems nach einem der vorhergehenden Ansprüche 13 bis 15 für ein me- chatronisches Modul, bevorzugt für eine Getriebesteuerung eines Kraftfahrzeugs . 16. Use of a signal and potential distribution system according to one of the preceding claims 13 to 15 for a mechatronic module, preferably for a transmission control of a motor vehicle.
PCT/EP2008/051917 2007-04-13 2008-02-18 Method for the production of a signal and potential distribution system for mechatronic modules WO2008125372A1 (en)

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DE102011108198A1 (en) * 2011-07-22 2012-03-29 Fela Holding Gmbh Circuit board used for mounting electrical component e.g. LUXEON Rebel LED, has strip guard that is located on anodized coat that is arranged on top face of metal core
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