WO2018210671A1 - Method for producing an electronic component, and electronic component - Google Patents

Method for producing an electronic component, and electronic component Download PDF

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Publication number
WO2018210671A1
WO2018210671A1 PCT/EP2018/062089 EP2018062089W WO2018210671A1 WO 2018210671 A1 WO2018210671 A1 WO 2018210671A1 EP 2018062089 W EP2018062089 W EP 2018062089W WO 2018210671 A1 WO2018210671 A1 WO 2018210671A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
electronic component
circuit boards
insulating material
Prior art date
Application number
PCT/EP2018/062089
Other languages
German (de)
French (fr)
Inventor
Wolfgang GRÜBL
Stephanie Gross
Bernhard Schuch
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Publication of WO2018210671A1 publication Critical patent/WO2018210671A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Definitions

  • the invention relates to a method for producing an electronic component. Furthermore, the invention relates to an electronic component.
  • Electronic components which are used for example as a transmission ⁇ control devices in vehicle drives, are well known.
  • the electronic component usually comprises electronic components which are arranged on a printed circuit board and form a circuit arrangement.
  • the electronic components are electrically connected, for example via stamped grid with sensors and / or actuators and / or with connectors.
  • one or both outer layers of the printed circuit board is or will be equipped with electronic components. This is done for example by means of soldering. Furthermore, it is known to embed electronic components in the circuit board. To protect against external influences and aging processes, the electronic components and / or the connection points, for. B. the Lotstellen be protected by means of certain painting and / or Verguss processes.
  • the invention has for its object to provide a comparison with the prior art improved method for producing an electronic component and an improved electronic component.
  • the object is achieved according to the invention with the features specified in claim 1.
  • the object is achieved according to the invention with the features specified in claim 8.
  • a method for producing an electronic component having a plurality of printed circuit boards at least two printed circuit boards are connected to at least one printed circuit board module by connecting the at least two printed circuit boards electrically and thermally conductive as well as mechanically by means of a sintering-laminating process.
  • the circuit boards can be sintered and laminated together in a common process step. This allows at the same time an electrically and thermally conductive and mechanical connection of the printed circuit boards.
  • a processing time can be shortened as compared to conventional methods for manufacturing an electronic component.
  • the method enables the formation of printed circuit board modules, wherein a circuit arrangement is divided into several modules.
  • the modules can be formed such that they can be individually combined with one another for different applications. Depending on the requirements, individual modules can be exchanged. This allows for improved scalability of the electronic component as well as reduced dimensions over conventional electronic components.
  • the lamination of the printed circuit boards also allows improved protection of the printed circuit board module from external influences and allows use of the electronic component in an area with a higher ambient temperature than conventional electronic components.
  • At least one of the electrically and thermally conductive connection Contacting at least one printed circuit board of we ⁇ least one printed circuit board module a sintering paste ⁇ wear.
  • the contacting is an electrically conductive con- takt istsflache, also known as a pad, and consists in ⁇ game as copper. Which is optionally provided with a coating of silver, gold or tin.
  • one or more contacting points are provided on the surface side.
  • a sintering paste for example, a silver paste and / or a copper paste is applied to the at least one contacting point.
  • At least one plate-shaped, electrically insulating insulating material is arranged in sections at least between two printed circuit boards.
  • the at least one insulating material is a so-called prepreg, which consists of a fiber-reinforced, z. B. glass fiber reinforced, epoxy resin is formed.
  • the insulation material is in particular for
  • At least one passage opening is introduced into the substrate, the dimensions of which correspond to dimensions of the at least one contacting point of the at least one printed circuit board.
  • the dimensions of the passage opening may also be slightly larger than the dimensions of the at least one contacting point. This ensures that in the arrangement of the insulating material between the circuit boards associated with each other contacting points of the circuit boards are not electrically isolated from each other.
  • the at least one insulating material between the circuit boards arranged in such a way ⁇ is that the at least one passage opening, the min ⁇ least provided with a contacting point of the sintering paste a circuit board and at least one further Kunststoffie ⁇ tion point of at least one other circuit board aligned. This allows the electrically and thermally conductive connection of the circuit boards together.
  • the at least one further contacting point does not necessarily have to be provided with a sintering paste.
  • the at least one insulating material and the printed circuit boards are subjected to a predetermined pressure and a predetermined temperature in order to form the at least one printed circuit board module.
  • the insulation material are at least one and the printed circuit boards in a so-called ⁇ laminating press under the action of a pressure of eg. B. 30 bar and a temperature of z. B. 190 ° C to 230 ° C and then cure.
  • a pressure of eg. B. 30 bar e.g. B. 30 bar
  • a temperature of z. B. 190 ° C to 230 ° C and then cure e.g. B. 30 bar
  • the method allows the simultaneous sintering and laminating of at least two printed circuit boards.
  • the printed circuit board module formed in this case can also have more than two electrically and thermally conductive and mechanically interconnected printed circuit boards, wherein in each case an insulating material is arranged between two printed circuit boards.
  • the at least one printed circuit board module is arranged on a surface side of a wiring board. This increases just ⁇ if the functionality of the electronic component.
  • An electronic component according to the invention comprises a plurality of printed circuit boards, wherein at least two printed circuit boards are connected to at least one printed circuit board module electrically and thermally conductive and wherein the at least one printed circuit board module is formed as a sintered laminate composite.
  • the electronic component formed in this way can be produced more cost-effectively and with fewer expenditures than the prior art. Furthermore, by means of the at least one printed circuit board module, a technical flexibility of the electrical improved compared to conventional electronic components, in particular when the electronic component has a plurality of combinable PCB modules.
  • the electronic component such as a transmission control unit for affyge ⁇ drives.
  • the electronic component of the sintered composite laminate comprising at least two circuit boards and at least one section-wise between the at least two circuit boards arranged, electrically insulating isolati ⁇ onsmaterial.
  • the at least one insulating material is made of a fiber-reinforced, z. B. glass fiber reinforced, epoxy resin formed and thus inexpensive and easy to produce.
  • the printed circuit board via at least two contact points are electrically and thermally conductively connected with each other, wherein a scale layer is formed between the at least two contact points, said ⁇ iquess has at least one electrically insulating insulation material we a through opening whose dimensions corresponding to dimensions of the at least two contact points and wherein the at least one insulating material is arranged between the printed circuit boards such that the at least one through-opening and the at least two
  • At least one electronic component is arranged in at least one of the printed circuit boards.
  • the at least one electronic component is embedded in the printed circuit board.
  • the at least one electronic component is an active or passive component and part of a circuit arrangement of the electronic component.
  • the at least one electronic component is introduced by means of an embedding method in the Lei ⁇ terplatte, so that this completely in the structure the printed circuit board is integrated. This allows a compact design of the circuit board, so that a space and a weight of the circuit board can be reduced. Furthermore, the embedded components are protected against external influences.
  • At least one further electronic component can be arranged alternatively or in addition to the at least one embedded electronic component on an outer surface side of at least one printed circuit board. This increases the functionality of the circuit arrangement.
  • a circuit board module may be provided with ⁇ art injection molding at least. This increases a lifetime of the printed circuit board module.
  • FIG. 1 is a schematic sectional view of a further exemplary embodiment of a printed circuit board module according to FIG. 1 in the assembled state, schematically a perspective view of an exemplary embodiment of an electronic component having a printed circuit board module, a single module and a printed circuit board module Wiring circuit board, schematically a perspective view of another embodiment of a printed circuit ⁇ module, Figure 4 schematically shows a sectional view of another embodiment of a printed circuit board module for an electronic component in the assembled state and
  • Figure 5 schematically shows a sectional view of the circuit board module according to Figure 4 with a synthetic ⁇ injection molding. Corresponding parts are provided in all figures with the same reference numerals.
  • FIG. 1A shows a sectional view of an exemplary embodiment of a circuit board module 1 for an example shown in Figure 2 electronic component E in an unassembled state.
  • FIG. 1B shows an exemplary embodiment of a printed circuit board module 1 in an assembled state.
  • the electronic component E is for example a Ge ⁇ drive control device for a vehicle transmission, in which the electronic component E is arranged.
  • the electronic component E is thus designed in particular as an electromechanical component.
  • the electronic component E may also include any other electronic scarf ⁇ processing arrangement or represent.
  • the printed circuit board module 1 shown in FIG. 1A comprises two printed circuit boards 1.1, 1.2 and an insulating material S.
  • the printed circuit boards 1.1, 1.2 each on at least one surface side Kunststofftechniksstel- len 1.1.1, 1.2.1, which are provided here as sintering pads for electrically and thermally conductive connection of the circuit boards 1.1, 1.2.
  • the printed circuit boards 1.1, 1.2 each have a contacting point 1.1.1, 1.2.1 on surfaces facing each other.
  • solder pads and / or bond pads and / or adhesive pads and / or press pads and / or welding pads and / or further sinter pads may be arranged on the surface sides and / or on non-facing surface sides of the printed circuit boards 1.1, 1.2.
  • the contacting points 1.1.1, 1.2.1 are each an electrically conductive contacting surface, which consists of an electrically conductive material, for. As copper, exist.
  • the electrically conductive material may additionally be coated with a coating, e.g. B. of gold, silver or tin, be provided. According to the present embodiment, one of the
  • a sintering paste P for example, a silver paste and / or a copper paste is printed on the contacting 1.2.1.
  • the printed circuit boards 1.1, 1.2 may further each on at least one surface side conductor tracks L, z. B. in the form of metallizations or applied by thick-film technology traces running ways (see Figure 4), which electrically connect the electronic components 2 together.
  • the arranged between the printed circuit boards 1.1, 1.2 isolati onsmaterial ⁇ S is plate-shaped and, as a so-called prepreg formed, which consists of a fiber-reinforced, z. B. glass ⁇ fiber reinforced, epoxy resin is formed.
  • the insulation material S has a passage opening Sl, which is introduced into the insulation material S before the arrangement of the insulation material S between the circuit boards 1.1, 1.2.
  • the passage ⁇ opening Sl is formed, for example by means of separation, in particular ⁇ special cutting, a material portion of the insulating material S.
  • Dimensions of the passage ⁇ opening Sl in the direction of an insulating material korres ⁇ pondieren with dimensions of justifytechniksstel- len 1.1.1, 1.2.1 in the direction of a circuit board level.
  • the isolati onsmaterial ⁇ S is placed on the lower conductor plate 1.2 in such a way that the passage opening is approximately Sl put in alignment with themaschineie- arranged 1.2.1.
  • An orientation of the Iso ⁇ lationsmaterials S can be done for example by means of a pen. Subsequently, the upper printed circuit board 1.1 is arranged on the insulating material S such that the contacting point 1.1.1 is aligned with the passage opening S1.
  • the printed circuit boards 1.1, 1.2 each have three contacting points 1.1.1, 1.2.1 and the insulating material S corresponding to three through-holes S1, which are closed by means of the sintering paste P.
  • an aligned arrangement of all associated contact points 1.1.1, 1.2.1 and through holes Sl is required. This is also possible if the printed circuit boards 1.1, 1.2 and / or the Isolationsmate ⁇ material S have different dimensions from each other.
  • a sintering and laminating of the printed circuit boards 1.1, 1.2 thus takes place in a common process step.
  • Figure 2 shows an embodiment of an electronic component E with a printed circuit board module 1 and a single circuit board 1.1, which are each connected to a wiring board 3, in a perspective view.
  • the printed circuit board module 1 comprises a Sin ⁇ ter laminate composite SLV with three printed circuit boards 1.1 to 1.3 and two Subtraten S, the lower printed circuit board 1.1 by means of a further insulating material S 'is materially connected to a surface side of the wiring board 3.
  • the individual circuit board 1.1 is arranged on another section of the wiring board 3 and also connected by means of a further insulating material S 'materially connected to the surface side of the wiring board 3.
  • the individual printed circuit board 1.1 can also be referred to as printed circuit board module 1, which represents a single module.
  • FIG. 3 schematically shows a perspective view of a printed circuit board module 1 with four printed circuit boards 1.1 to 1.4 and three insulation materials S.
  • FIG. 4 shows schematically a sectional illustration of a further exemplary embodiment of a printed circuit board module 1 with three
  • the lower printed circuit board 1.1 comprises a plurality of electronic components 2, which are in this case formed as passive components 2.1 and embedded in the printed circuit board 1.1.
  • a middle circuit board 1.2 also includes a plurality of electronic components 2, which are embedded in the printed circuit board 1.2 ⁇ .
  • the electronic components 2 are formed, for example, as a packaged or unpackaged semiconductor elements 2.2 ⁇ out.
  • An upper circuit board 1.3 comprises both embedded electronic components 2 and electronic components 2, which are arranged on an outer side of the printed circuit board 1.3.
  • the embedded electronic components 2 represent passive components 2.1 and a semi-conductor element ⁇ 2.2.
  • the active component 2.3 is electrically conductively connected to outside conductor tracks L by means of bonding wires B.
  • the active component 2.3 can also be adhesively bonded to the printed circuit board 1.3 and / or soldered and / or connected by means of the so-called flip-chip mounting for electrical contacting.
  • Components 2.1 are glued to one of the outside conductor tracks L and / or soldered.
  • FIG. 5 shows the printed circuit board module 1 according to FIG. 4 with a plastic injection molding 4 for protection against external influences.
  • a potting compound or a plastic housing connected to the printed circuit board module 1 may be provided instead of the plastic injection molding 4, instead of the plastic injection molding 4, a potting compound or a plastic housing connected to the printed circuit board module 1 may be provided.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The invention relates to a method for producing an electronic component (E) comprising a plurality of printed circuit boards (1.1 to 1.4). At least two printed circuit boards (1.1 to 1.4) are connected together in order to form at least one printed circuit board module (1), wherein the at least two printed circuit boards (1.1 to 1.4) are connected together in an electric, thermally conductive, and mechanical manner by means of a sintering/lamination process. The invention further relates to an electronic component (E) comprising a plurality of printed circuit boards (1.1 to 1.4).

Description

Beschreibung description
Verfahren zur Herstellung einer elektronischen Komponente und elektronische Komponente Method for producing an electronic component and electronic component
Die Erfindung betrifft ein Verfahren zur Herstellung einer elektronischen Komponente. Weiterhin betrifft die Erfindung eine elektronische Komponente. The invention relates to a method for producing an electronic component. Furthermore, the invention relates to an electronic component.
Elektronische Komponenten, die beispielsweise als Getriebe¬ steuergeräte in Fahrzeugantrieben eingesetzt werden, sind allgemein bekannt. Dabei umfasst die elektronische Komponente üblicherweise auf einer Leiterplatte angeordnete, elektronische Bauteile, die eine Schaltungsanordnung bilden. Zur Spannungsversorgung sowie zur Signalleitung, z. B. von Steuersignalen oder Messsignalen zu oder von den elektronischen oder elektromechanischen Bauteilen, sind die elektronischen Bauteile beispielsweise über Stanzgitter elektrisch leitend mit Sensoren und/oder Aktoren und/oder mit Anschlusssteckern verbunden. Electronic components, which are used for example as a transmission ¬ control devices in vehicle drives, are well known. In this case, the electronic component usually comprises electronic components which are arranged on a printed circuit board and form a circuit arrangement. For power supply and signal line, z. As of control signals or measurement signals to or from the electronic or electromechanical components, the electronic components are electrically connected, for example via stamped grid with sensors and / or actuators and / or with connectors.
Zur Herstellung einer derartigen elektronischen Komponente wird oder werden insbesondere eine oder beide Außenlagen der Leiterplatte mit elektronischen Bauteilen bestückt. Dies erfolgt beispielsweise mittels Löten. Des Weiteren ist bekannt, elektronische Bauteile in die Leiterplatte einzubetten. Zum Schutz vor äußeren Einflüssen und Alterungsprozessen können die elektronischen Bauteile und/oder die Verbindungsstellen, z. B. die Lotstellen, mittels bestimmter Lackier- und/oder Ver- gussprozesse geschützt werden. To produce such an electronic component, in particular one or both outer layers of the printed circuit board is or will be equipped with electronic components. This is done for example by means of soldering. Furthermore, it is known to embed electronic components in the circuit board. To protect against external influences and aging processes, the electronic components and / or the connection points, for. B. the Lotstellen be protected by means of certain painting and / or Verguss processes.
Der Erfindung liegt die Aufgabe zugrunde, ein gegenüber dem Stand der Technik verbessertes Verfahren zur Herstellung einer elektronischen Komponente und eine verbesserte elektronische Komponente anzugeben. The invention has for its object to provide a comparison with the prior art improved method for producing an electronic component and an improved electronic component.
Hinsichtlich des Verfahrens wird die Aufgabe erfindungsgemäß mit den in Anspruch 1 angegebenen Merkmalen gelöst. Hinsichtlich der elektronischen Komponente wird die Aufgabe erfindungsgemäß mit den in Anspruch 8 angegebenen Merkmalen gelöst. With regard to the method, the object is achieved according to the invention with the features specified in claim 1. With regard to the electronic component, the object is achieved according to the invention with the features specified in claim 8.
Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche. Advantageous embodiments of the invention are the subject of the dependent claims.
Bei einem erfindungsgemäßen Verfahren zur Herstellung einer elektronischen Komponente mit einer Mehrzahl von Leiterplatten werden mindestens zwei Leiterplatten zu wenigstens einem Leiterplattenmodul miteinander verbunden, indem die mindestens zwei Leiterplatten elektrisch und thermisch leitend sowie mechanisch mittels eines Sinter-Laminier-Prozesses miteinander verbunden werden. Bei dem Verfahren können die Leiterplatten in einem gemeinsamen Prozessschritt miteinander gesintert und laminiert werden. Dies ermöglicht gleichzeitig eine elektrisch und thermisch leitende sowie mechanische Verbindung der Leiterplatten. Zur Bildung eines derartigen Leiterplattenmoduls kann eine Prozesszeit gegenüber konventionellen Verfahren zur Herstellung einer elektronischen Komponente verkürzt werden. In a method according to the invention for producing an electronic component having a plurality of printed circuit boards, at least two printed circuit boards are connected to at least one printed circuit board module by connecting the at least two printed circuit boards electrically and thermally conductive as well as mechanically by means of a sintering-laminating process. In the method, the circuit boards can be sintered and laminated together in a common process step. This allows at the same time an electrically and thermally conductive and mechanical connection of the printed circuit boards. To form such a board module, a processing time can be shortened as compared to conventional methods for manufacturing an electronic component.
Des Weiteren ermöglicht das Verfahren die Bildung von Leiterplattenmodulen, wobei eine Schaltungsanordnung in mehrere Module aufgeteilt wird. Dabei können die Module derart gebildet werden, dass diese für verschiedene Applikationen individuell miteinander kombinierbar sind. Je nach Anforderung können dabei einzelne Module ausgetauscht werden. Dies ermöglicht eine verbesserte Skalierbarkeit der elektronischen Komponente sowie verringerte Abmessungen gegenüber konventionellen elektronischen Komponenten. Das Laminieren der Leiterplatten ermöglicht zudem einen verbesserten Schutz des Leiterplattenmoduls vor äußeren Einflüssen und ermöglicht einen Einsatz der elektronischen Komponente in einem Bereich mit einer höheren Umge- bungstemperatur als konventionelle elektronische Komponenten. Furthermore, the method enables the formation of printed circuit board modules, wherein a circuit arrangement is divided into several modules. In this case, the modules can be formed such that they can be individually combined with one another for different applications. Depending on the requirements, individual modules can be exchanged. This allows for improved scalability of the electronic component as well as reduced dimensions over conventional electronic components. The lamination of the printed circuit boards also allows improved protection of the printed circuit board module from external influences and allows use of the electronic component in an area with a higher ambient temperature than conventional electronic components.
Gemäß einer Ausgestaltung der Erfindung wird auf mindestens eine zur elektrisch und thermisch leitenden Verbindung vorgesehenen Kontaktierungsstelle zumindest einer Leiterplatte des we¬ nigstens einen Leiterplattenmoduls eine Sinterpaste aufge¬ tragen . Die Kontaktierungsstelle ist eine elektrisch leitende Kon- taktierungsflache, auch bekannt als Päd, und besteht bei¬ spielsweise aus Kupfer. Welches gegebenenfalls mit einer Be- schichtung aus Silber, Gold oder Zinn versehen ist. Je nach Anforderung an die Leiterplatte sind an deren Oberflächenseite eine oder mehrere Kontaktierungsstellen vorgesehen. Als Sinterpaste wird beispielsweise eine Silberpaste und/oder eine Kupferpaste auf die mindestens eine Kontaktierungsstelle aufgebracht . Des Weiteren wird mindestens zwischen zwei Leiterplatten abschnittsweise wenigstens ein plattenförmiges , elektrisch isolierendes Isolationsmaterial angeordnet. Das wenigstens eine Isolationsmaterial ist ein sogenanntes Prepreg, welches aus einem faserverstärkten, z. B. glasfaserverstärkten, Epoxidharz gebildet ist. Das Isolationsmaterial ist insbesondere zurAccording to one embodiment of the invention is provided for at least one of the electrically and thermally conductive connection Contacting at least one printed circuit board of we ¬ least one printed circuit board module a sintering paste ¬ wear. The contacting is an electrically conductive con- taktierungsflache, also known as a pad, and consists in ¬ game as copper. Which is optionally provided with a coating of silver, gold or tin. Depending on the requirements of the circuit board one or more contacting points are provided on the surface side. As a sintering paste, for example, a silver paste and / or a copper paste is applied to the at least one contacting point. Furthermore, at least one plate-shaped, electrically insulating insulating material is arranged in sections at least between two printed circuit boards. The at least one insulating material is a so-called prepreg, which consists of a fiber-reinforced, z. B. glass fiber reinforced, epoxy resin is formed. The insulation material is in particular for
Herstellung eines Laminatverbunds der Leiterplatten vorgesehen. Preparation of a laminate composite of printed circuit boards provided.
Vor der Anordnung des wenigstens einen Isolationsmaterials zwischen den Leiterplatten wird wenigstens eine Durchgangs- Öffnung in das Substrat eingebracht, deren Abmessungen mit Abmessungen der mindestens einen Kontaktierungsstelle der zumindest einen Leiterplatte korrespondiert. Alternativ können die Abmessungen der Durchgangsöffnung auch geringfügig größer als die Abmessungen der mindestens einen Kontaktierungsstelle sein. Damit wird sichergestellt, dass bei der Anordnung des Isolationsmaterials zwischen den Leiterplatten einander zugeordnete Kontaktierungsstellen der Leiterplatten nicht elektrisch voneinander isoliert werden. Gemäß einer Ausgestaltung der Erfindung wird das wenigstens eine Isolationsmaterial zwischen den Leiterplatten derart ange¬ ordnet, dass die wenigstens eine Durchgangsöffnung, die min¬ destens eine mit Sinterpaste versehene Kontaktierungsstelle der einen Leiterplatte und zumindest eine weitere Kontaktie¬ rungsstelle wenigstens einer anderen Leiterplatte miteinander fluchten. Dies ermöglicht die elektrisch und thermisch leitende Verbindung der Leiterplatten miteinander. Die zumindest eine weitere Kontaktierungsstelle muss dabei nicht zwingend mit einer Sinterpaste versehen sein. Before the arrangement of the at least one insulating material between the printed circuit boards, at least one passage opening is introduced into the substrate, the dimensions of which correspond to dimensions of the at least one contacting point of the at least one printed circuit board. Alternatively, the dimensions of the passage opening may also be slightly larger than the dimensions of the at least one contacting point. This ensures that in the arrangement of the insulating material between the circuit boards associated with each other contacting points of the circuit boards are not electrically isolated from each other. According to one embodiment of the invention, the at least one insulating material between the circuit boards arranged in such a way ¬ is that the at least one passage opening, the min ¬ least provided with a contacting point of the sintering paste a circuit board and at least one further Kontaktie ¬ tion point of at least one other circuit board aligned. This allows the electrically and thermally conductive connection of the circuit boards together. The at least one further contacting point does not necessarily have to be provided with a sintering paste.
Weiterhin werden das wenigstens eine Isolationsmaterial und die Leiterplatten zur Bildung des wenigstens einen Leiterplat- tenmoduls mit einem vorgegebenen Druck und einer vorgegebenen Temperatur beaufschlagt. Beispielsweise werden das wenigstens eine Isolationsmaterial und die Leiterplatten in einer soge¬ nannten Laminierpresse unter Einwirkung eines Drucks von z. B. 30 bar und einer Temperatur von z. B. 190°C bis 230°C angeordnet und härten anschließend aus. Damit ermöglicht das Verfahren das gleichzeitige Sintern und Laminieren mindestens von zwei Leiterplatten. Das dabei gebildete Leiterplattenmodul kann auch mehr als zwei elektrisch und thermisch leitend sowie mechanisch miteinander verbundene Leiterplatten aufweisen, wobei jeweils zwischen zwei Leiterplatten ein Isolationsmaterial angeordnet ist . Furthermore, the at least one insulating material and the printed circuit boards are subjected to a predetermined pressure and a predetermined temperature in order to form the at least one printed circuit board module. For example, the insulation material are at least one and the printed circuit boards in a so-called ¬ laminating press under the action of a pressure of eg. B. 30 bar and a temperature of z. B. 190 ° C to 230 ° C and then cure. Thus, the method allows the simultaneous sintering and laminating of at least two printed circuit boards. The printed circuit board module formed in this case can also have more than two electrically and thermally conductive and mechanically interconnected printed circuit boards, wherein in each case an insulating material is arranged between two printed circuit boards.
Gemäß einer weiteren Ausgestaltung der Erfindung wird das wenigstens eine Leiterplattenmodul auf einer Oberflächenseite einer Verdrahtungsleiterplatte angeordnet. Dies erhöht eben¬ falls die Funktionalität der elektronischen Komponente. According to a further embodiment of the invention, the at least one printed circuit board module is arranged on a surface side of a wiring board. This increases just ¬ if the functionality of the electronic component.
Eine erfindungsgemäße elektronische Komponente umfasst eine Mehrzahl von Leiterplatten, wobei mindestens zwei Leiterplatten zu wenigstens einem Leiterplattenmodul elektrisch und thermisch leitend miteinander verbunden sind und wobei das wenigstens eine Leiterplattenmodul als ein Sinter-Laminat-Verbund ausgebildet ist . Die derart ausgebildete elektronische Komponente ist gegenüber dem Stand der Technik kostengünstiger und aufwandsverringert herstellbar. Des Weiteren ist mittels des mindestens einen Leiterplattenmoduls eine technische Flexibilität der elekt- ronischen Komponente gegenüber konventioneller elektronischer Komponenten verbessert, insbesondere wenn die elektronische Komponente eine Mehrzahl miteinander kombinierbarer Leiterplattenmodule aufweist. Die elektronische Komponente ist beispielsweise ein Getriebesteuergerät für ein Fahrzeugge¬ triebe . An electronic component according to the invention comprises a plurality of printed circuit boards, wherein at least two printed circuit boards are connected to at least one printed circuit board module electrically and thermally conductive and wherein the at least one printed circuit board module is formed as a sintered laminate composite. The electronic component formed in this way can be produced more cost-effectively and with fewer expenditures than the prior art. Furthermore, by means of the at least one printed circuit board module, a technical flexibility of the electrical improved compared to conventional electronic components, in particular when the electronic component has a plurality of combinable PCB modules. The electronic component such as a transmission control unit for a Fahrzeugge ¬ drives.
Gemäß einer Ausgestaltung der elektronischen Komponente umfasst der Sinter-Laminat-Verbund die mindestens zwei Leiterplatten und wenigstens ein abschnittsweise zwischen den mindestens zwei Leiterplatten angeordnetes, elektrisch isolierendes Isolati¬ onsmaterial. Das wenigstens eine Isolationsmaterial ist aus einem faserverstärkten, z. B. glasfaserverstärkten, Epoxidharz gebildet und damit kostengünstig und einfach herstellbar. According to one embodiment of the electronic component of the sintered composite laminate comprising at least two circuit boards and at least one section-wise between the at least two circuit boards arranged, electrically insulating isolati ¬ onsmaterial. The at least one insulating material is made of a fiber-reinforced, z. B. glass fiber reinforced, epoxy resin formed and thus inexpensive and easy to produce.
Beispielsweise sind die Leiterplatten über zumindest zwei Kontaktierungsstellen elektrisch und thermisch leitend miteinander verbunden, wobei zwischen den zumindest zwei Kontaktierungsstellen eine Sinterschicht ausgebildet ist, wobei das zumindest eine elektrisch isolierende Isolationsmaterial we¬ nigstens eine Durchgangsöffnung aufweist, deren Abmessungen mit Abmessungen der zumindest zwei Kontaktierungsstellen korrespondiert und wobei das wenigstens eine Isolationsmaterial zwischen den Leiterplatten derart angeordnet ist, dass die wenigstens eine Durchgangsöffnung und die zumindest zweiFor example, the printed circuit board via at least two contact points are electrically and thermally conductively connected with each other, wherein a scale layer is formed between the at least two contact points, said ¬ nigstens has at least one electrically insulating insulation material we a through opening whose dimensions corresponding to dimensions of the at least two contact points and wherein the at least one insulating material is arranged between the printed circuit boards such that the at least one through-opening and the at least two
Kontaktierungsstellen miteinander fluchten. Dies ermöglicht eine elektrisch und thermisch leitende Verbindung zwischen den Leiterplatten im Laminatverbund. Gemäß einer weiteren Ausgestaltung der Erfindung wird in zumindest einer der Leiterplatten mindestens ein elektronisches Bauteil angeordnet. Insbesondere wird das mindestens eine elektronische Bauteil in die Leiterplatte eingebettet. Das mindestens eine elektronische Bauteil ist ein aktives oder passives Bauteil und Bestandteil einer Schaltungsanordnung der elektronischen Komponente. Das mindestens eine elektronische Bauteil wird mittels eines Einbettungsverfahrens in die Lei¬ terplatte eingebracht, so dass dieses vollständig in den Aufbau der Leiterplatte integriert ist. Dies ermöglicht eine kompakte Bauweise der Leiterplatte, so dass ein Bauraum und ein Gewicht der Leiterplatte reduzierbar sind. Des Weiteren sind die eingebetteten Bauteile vor äußeren Einflüssen geschützt. Contact points are aligned with each other. This allows an electrically and thermally conductive connection between the printed circuit boards in the laminate composite. According to a further embodiment of the invention, at least one electronic component is arranged in at least one of the printed circuit boards. In particular, the at least one electronic component is embedded in the printed circuit board. The at least one electronic component is an active or passive component and part of a circuit arrangement of the electronic component. The at least one electronic component is introduced by means of an embedding method in the Lei ¬ terplatte, so that this completely in the structure the printed circuit board is integrated. This allows a compact design of the circuit board, so that a space and a weight of the circuit board can be reduced. Furthermore, the embedded components are protected against external influences.
In Abhängigkeit einer Anforderung an die elektronische Kom¬ ponente kann alternativ oder zusätzlich zu dem mindestens einen eingebetteten elektronischen Bauteil auf einer äußeren Oberflächenseite mindestens einer Leiterplatte mindestens ein weiteres elektronisches Bauteil angeordnet werden. Dies erhöht die Funktionalität der Schaltungsanordnung. In response to a request to the electronic component Kom ¬ least one further electronic component can be arranged alternatively or in addition to the at least one embedded electronic component on an outer surface side of at least one printed circuit board. This increases the functionality of the circuit arrangement.
Zum Schutz der elektronischen Bauteile und Kontaktierungsstellen kann das wenigstens eine Leiterplattenmodul mit Kunst¬ stoffspritzguss versehen werden. Dies erhöht eine Lebensdauer des Leiterplattenmoduls. To protect the electronic components and contact points, a circuit board module may be provided with ¬ art injection molding at least. This increases a lifetime of the printed circuit board module.
Ausführungsbeispiele der Erfindung werden im Folgenden anhand von Zeichnungen näher erläutert. Embodiments of the invention are explained in more detail below with reference to drawings.
Dabei zeigen: schematisch eine Schnittdarstellung eines Leiterplattenmoduls für eine elektronische Komponente in einem nicht zusammengesetzten Zustand, schematisch eine Schnittdarstellung eines weiteren Ausführungsbeispiels eines Leiterplattenmoduls gemäß Figur 1 im zusammengesetzten Zustand, schematisch eine perspektivische Darstellung eines Ausführungsbeispiels einer elektronischen Komponente mit einem Leiterplattenmodul, einem Einzelmodul und einer Verdrahtungsleiterplatte, schematisch eine perspektivische Darstellung eines weiteren Ausführungsbeispiel eines Leiterplatten¬ moduls, Figur 4 schematisch eine Schnittdarstellung eines weiteren Ausführungsbeispiels eines Leiterplattenmoduls für eine elektronische Komponente im zusammengesetzten Zustand und 1 is a schematic sectional view of a further exemplary embodiment of a printed circuit board module according to FIG. 1 in the assembled state, schematically a perspective view of an exemplary embodiment of an electronic component having a printed circuit board module, a single module and a printed circuit board module Wiring circuit board, schematically a perspective view of another embodiment of a printed circuit ¬ module, Figure 4 schematically shows a sectional view of another embodiment of a printed circuit board module for an electronic component in the assembled state and
Figur 5 schematisch eine Schnittdarstellung des Leiterplattenmoduls gemäß Figur 4 mit einem Kunst¬ stoffspritzguss . Einander entsprechende Teile sind in allen Figuren mit den gleichen Bezugszeichen versehen. Figure 5 schematically shows a sectional view of the circuit board module according to Figure 4 with a synthetic ¬ injection molding. Corresponding parts are provided in all figures with the same reference numerals.
Figur 1A zeigt eine Schnittdarstellung eines Ausführungsbei¬ spiels eines Leiterplattenmoduls 1 für eine beispielhaft in Figur 2 gezeigte elektronische Komponente E in einem nicht zusammengesetzten Zustand. Figur 1B zeigt ein Ausführungsbeispiel eines Leiterplattenmoduls 1 in einem zusammengesetzten Zustand . Die elektronische Komponente E ist beispielsweise ein Ge¬ triebesteuergerät für ein Fahrzeuggetriebe, in welchem die elektronische Komponente E angeordnet wird. Die elektronische Komponente E ist somit insbesondere als eine elektromechanische Komponente ausgeführt. Alternativ kann die elektronische Komponente E auch eine beliebige andere elektronische Schal¬ tungsanordnung umfassen oder darstellen. Figure 1A shows a sectional view of an exemplary embodiment of a circuit board module 1 for an example shown in Figure 2 electronic component E in an unassembled state. FIG. 1B shows an exemplary embodiment of a printed circuit board module 1 in an assembled state. The electronic component E is for example a Ge ¬ drive control device for a vehicle transmission, in which the electronic component E is arranged. The electronic component E is thus designed in particular as an electromechanical component. Alternatively, the electronic component E may also include any other electronic scarf ¬ processing arrangement or represent.
Das in Figur 1A gezeigte Leiterplattenmodul 1 umfasst zwei Leiterplatten 1.1, 1.2 und ein Isolationsmaterial S. The printed circuit board module 1 shown in FIG. 1A comprises two printed circuit boards 1.1, 1.2 and an insulating material S.
Die Leiterplatten 1.1, 1.2 sind aus einem elektrisch isolierenden Material gebildet und je nach Verwendung einlagig oder mehrlagig ausgebildet. Die Leiterplatten 1.1, 1.2 können me¬ chanisch starr oder flexibel ausgebildet sein. Beispielsweise umfasst dazu das elektrisch isolierende Material der Leiter¬ platten 1.1, 1.2 entweder ein mechanisch festes Material, z. B. Epoxidharz, oder ein mechanisch flexibles Material, wie z. B. Polyimid . Die Leiterplatten 1.1, 1.2 sind jeweils als ein Träger für elektronische Bauteile 2 (siehe Figur 4) ausgebildet, die eine Schaltungsanordnung bilden. Wie in Figur 4 gezeigt, können die elektronischen Bauteile 2 in und/oder auf der Leiterplat- te 1.1, 1.2 angeordnet sein. The printed circuit boards 1.1, 1.2 are formed of an electrically insulating material and, depending on the use, single-layered or multi-layered. The printed circuit boards 1.1, 1.2 can be me ¬ mechanically formed rigid or flexible. For example, this includes the electrically insulating material of the conductor ¬ plates 1.1, 1.2 either a mechanically strong material, eg. For example, epoxy, or a mechanically flexible material such. B. polyimide. The circuit boards 1.1, 1.2 are each formed as a support for electronic components 2 (see Figure 4), which form a circuit arrangement. As shown in FIG. 4, the electronic components 2 can be arranged in and / or on the printed circuit board 1.1, 1.2.
Des Weiteren weisen die Leiterplatten 1.1, 1.2 jeweils auf mindestens einer Oberflächenseite Kontaktierungsstel- len 1.1.1, 1.2.1 auf, welche hierbei als Sinterpads zur elektrisch und thermische leitenden Verbindung der Leiterplatten 1.1, 1.2 vorgesehen sind. Im gezeigten Ausführungsbeispiel umfassen die Leiterplatten 1.1, 1.2 an einander zugewandten Oberflächenseiten jeweils eine Kontaktierungsstel- le 1.1.1, 1.2.1. Zusätzlich können an den Oberflächenseiten und/oder an nicht einander zugewandten Oberflächenseiten der Leiterplatten 1.1, 1.2 Lötpads und/oder Bondpads und/oder Klebepads und/oder Presspads und/oder Schweißpads und/oder weitere Sinterpads angeordnet sein. Die Kontaktierungsstellen 1.1.1, 1.2.1 sind jeweils eine elektrisch leitende Kontaktierungsfläche, die aus einem elektrisch leitenden Material, z. B. Kupfer, bestehen. Das elektrische leitende Material kann zusätzlich mit einer Be- schichtung, z. B. aus Gold, Silber oder Zinn, versehen sein. Gemäß dem vorliegenden Ausführungsbeispiel wird eine derFurthermore, the printed circuit boards 1.1, 1.2 each on at least one surface side Kontaktierungsstel- len 1.1.1, 1.2.1, which are provided here as sintering pads for electrically and thermally conductive connection of the circuit boards 1.1, 1.2. In the exemplary embodiment shown, the printed circuit boards 1.1, 1.2 each have a contacting point 1.1.1, 1.2.1 on surfaces facing each other. In addition, solder pads and / or bond pads and / or adhesive pads and / or press pads and / or welding pads and / or further sinter pads may be arranged on the surface sides and / or on non-facing surface sides of the printed circuit boards 1.1, 1.2. The contacting points 1.1.1, 1.2.1 are each an electrically conductive contacting surface, which consists of an electrically conductive material, for. As copper, exist. The electrically conductive material may additionally be coated with a coating, e.g. B. of gold, silver or tin, be provided. According to the present embodiment, one of the
Kontaktierungsstellen 1.1.1, 1.2.1, hierbei die Kontaktie- rungsstelle 1.2.1, mit einer Sinterpaste P versehen. Als Sinterpaste P wird beispielsweise eine Silberpaste und/oder eine Kupferpaste auf die Kontaktierungsstelle 1.2.1 gedruckt. Contact points 1.1.1, 1.2.1, here the contact point 1.2.1, provided with a sintering paste P. As a sintering paste P, for example, a silver paste and / or a copper paste is printed on the contacting 1.2.1.
Die Leiterplatten 1.1, 1.2 können ferner jeweils auf mindestens einer Oberflächenseite Leiterbahnen L, z. B. in Form von Metallisierungen oder mittels Dickschichttechnik aufgebrachte Leiterbahnen Laufweisen (siehe Figur 4), die die elektronischen Bauteile 2 elektrisch miteinander verbinden. The printed circuit boards 1.1, 1.2 may further each on at least one surface side conductor tracks L, z. B. in the form of metallizations or applied by thick-film technology traces running ways (see Figure 4), which electrically connect the electronic components 2 together.
Das zwischen den Leiterplatten 1.1, 1.2 angeordnete Isolati¬ onsmaterial S ist plattenförmig und als ein sogenanntes Prepreg ausgebildet, welches aus einem faserverstärkten, z. B. glas¬ faserverstärkten, Epoxidharz gebildet ist. The arranged between the printed circuit boards 1.1, 1.2 isolati onsmaterial ¬ S is plate-shaped and, as a so-called prepreg formed, which consists of a fiber-reinforced, z. B. glass ¬ fiber reinforced, epoxy resin is formed.
Das Isolationsmaterial S weist im vorliegenden Ausführungs- beispiel eine Durchgangsöffnung Sl auf, die vor der Anordnung des Isolationsmaterials S zwischen den Leiterplatten 1.1, 1.2 in das Isolationsmaterial S eingebracht wird. Die Durchgangs¬ öffnung Sl wird beispielsweise mittels Heraustrennen, insbe¬ sondere Herausschneiden, eines Materialabschnitts aus dem Isolationsmaterial S gebildet. Abmessungen der Durchgangs¬ öffnung Sl in Richtung einer Isolationsmaterialebene korres¬ pondieren mit Abmessungen der Kontaktierungsstel- len 1.1.1, 1.2.1 in Richtung einer Leiterplattenebene. Zur Herstellung des Leiterplattenmoduls 1 wird das Isolati¬ onsmaterial S auf die untere Leiterplatte 1.2 derart angeordnet, dass die Durchgangsöffnung Sl fluchtend mit der Kontaktie- rungsstelle 1.2.1 angeordnet ist. Eine Ausrichtung des Iso¬ lationsmaterials S kann beispielsweise mittels eines Stifts erfolgen. Anschließend wird die obere Leiterplatte 1.1 auf dem Isolationsmaterial S derart angeordnet, dass die Kontaktie- rungsstelle 1.1.1 mit der Durchgangsöffnung Sl fluchtet. In the present exemplary embodiment, the insulation material S has a passage opening Sl, which is introduced into the insulation material S before the arrangement of the insulation material S between the circuit boards 1.1, 1.2. The passage ¬ opening Sl is formed, for example by means of separation, in particular ¬ special cutting, a material portion of the insulating material S. Dimensions of the passage ¬ opening Sl in the direction of an insulating material korres ¬ pondieren with dimensions of Kontaktierungsstel- len 1.1.1, 1.2.1 in the direction of a circuit board level. To manufacture the circuit board module 1, the isolati onsmaterial ¬ S is placed on the lower conductor plate 1.2 in such a way that the passage opening is approximately Sl put in alignment with the Kontaktie- arranged 1.2.1. An orientation of the Iso ¬ lationsmaterials S can be done for example by means of a pen. Subsequently, the upper printed circuit board 1.1 is arranged on the insulating material S such that the contacting point 1.1.1 is aligned with the passage opening S1.
Bei dem in Figur 1B gezeigten Leiterplattenmodul 1 weisen die Leiterplatten 1.1, 1.2 jeweils drei Kontaktierungsstel- len 1.1.1, 1.2.1 und das Isolationsmaterial S entsprechend drei Durchgangsöffnungen Sl auf, die mittels der Sinterpaste P verschlossen sind. Hierbei ist eine fluchtende Anordnung aller einander zugeordneten Kontaktierungsstellen 1.1.1, 1.2.1 und Durchgangsöffnungen Sl erforderlich . Dies ist auch dann möglich, wenn die Leiterplatten 1.1, 1.2 und/oder das Isolationsmate¬ rial S voneinander abweichende Abmessungen aufweisen. In the case of the printed circuit board module 1 shown in FIG. 1B, the printed circuit boards 1.1, 1.2 each have three contacting points 1.1.1, 1.2.1 and the insulating material S corresponding to three through-holes S1, which are closed by means of the sintering paste P. In this case, an aligned arrangement of all associated contact points 1.1.1, 1.2.1 and through holes Sl is required. This is also possible if the printed circuit boards 1.1, 1.2 and / or the Isolationsmate ¬ material S have different dimensions from each other.
Zur elektrisch und thermisch leitenden sowie mechanischen, insbesondere Stoffschlüssigen, Verbindung der Leiterplatten 1.1, 1.2 werden die aufeinander angeordneten Leiterplatten 1.1, 1.2 und das dazwischen angeordnete Isolationsmate¬ rial S beispielsweise in einer nicht dargestellten Laminier- presse angeordnet und mit einem vorgegebenen Druck von z. B. 30 bar und einer vorgegebenen Temperatur von z. B. 190°C bis 230°C beaufschlagt und härten anschließend unter Bildung eines Sinter-Laminat-Verbunds SLV aus, wie es beispielhaft Figur 1B zeigt. Die Kontaktierungsstellen 1.1.1, 1.2.1 sind dabei mittels einer Sinterschicht Si elektrisch und thermisch leitend miteinander verbunden. In order to electrically and thermally conductive as well as mechanical, especially cohesive, connecting the printed circuit boards 1.1, 1.2 the successive printed circuit boards arranged 1.1, 1.2 and the interposed insulating mate rial ¬ S, for example, in a non-illustrated laminating be arranged press and with a predetermined pressure of z. B. 30 bar and a predetermined temperature of z. B. 190 ° C to 230 ° C and then harden to form a sintered laminate composite SLV, as exemplified by FIG 1B shows. The contacting points 1.1.1, 1.2.1 are electrically and thermally conductively connected to each other by means of a sintered layer Si.
Ein Sintern und Laminieren der Leiterplatten 1.1, 1.2 erfolgt somit in einem gemeinsamen Prozessschritt. A sintering and laminating of the printed circuit boards 1.1, 1.2 thus takes place in a common process step.
Figur 2 zeigt ein Ausführungsbeispiel einer elektronischen Komponente E mit einem Leiterplattenmodul 1 und einer einzelnen Leiterplatte 1.1, die jeweils mit einer Verdrahtungsleiter- platte 3 verbunden sind, in einer perspektivischen Darstellung. Figure 2 shows an embodiment of an electronic component E with a printed circuit board module 1 and a single circuit board 1.1, which are each connected to a wiring board 3, in a perspective view.
Das Leiterplattenmodul 1 umfasst einen Sin¬ ter-Laminat-Verbund SLV mit drei Leiterplatten 1.1 bis 1.3 und zwei Subtraten S, wobei die untere Leiterplatte 1.1 mittels eines weiteren Isolationsmaterials S' stoffschlüssig mit einer Oberflächenseite der Verdrahtungsleiterplatte 3 verbunden ist. The printed circuit board module 1 comprises a Sin ¬ ter laminate composite SLV with three printed circuit boards 1.1 to 1.3 and two Subtraten S, the lower printed circuit board 1.1 by means of a further insulating material S 'is materially connected to a surface side of the wiring board 3.
Die einzelne Leiterplatte 1.1 ist auf einem anderen Abschnitt der Verdrahtungsleiterplatte 3 angeordnet und ebenfalls mittels eines weiteren Isolationsmaterials S' stoffschlüssig mit der Oberflächenseite der Verdrahtungsleiterplatte 3 verbunden. Die einzelne Leiterplatte 1.1 kann auch als Leiterplattenmodul 1 bezeichnet werden, welches ein Einzelmodul darstellt. Figur 3 zeigt schematisch eine perspektivische Darstellung eines Leiterplattenmoduls 1 mit vier Leiterplatten 1.1 bis 1.4 und drei Isolationsmaterialien S. The individual circuit board 1.1 is arranged on another section of the wiring board 3 and also connected by means of a further insulating material S 'materially connected to the surface side of the wiring board 3. The individual printed circuit board 1.1 can also be referred to as printed circuit board module 1, which represents a single module. FIG. 3 schematically shows a perspective view of a printed circuit board module 1 with four printed circuit boards 1.1 to 1.4 and three insulation materials S.
Figur 4 zeigt schematisch eine Schnittdarstellung eines weiteren Ausführungsbeispiels eines Leiterplattenmoduls 1 mit dreiFIG. 4 shows schematically a sectional illustration of a further exemplary embodiment of a printed circuit board module 1 with three
Leiterplatten 1.1 bis 1.3 und zwei Isolationsmaterialien S. Die untere Leiterplatte 1.1 umfasst mehrere elektronische Bauteile 2, die hierbei als passive Bauteile 2.1 ausgebildet und in die Leiterplatte 1.1 eingebettet sind. Eine mittlere Leiterplatte 1.2 umfasst ebenfalls mehrere elektronische Bauteile 2, die in der Leiterplatte 1.2 einge¬ bettet sind. Die elektronischen Bauteile 2 sind beispielsweise als gehäuste oder ungehäuste Halbleiterelemente 2.2 ausge¬ bildet . Circuit boards 1.1 to 1.3 and two insulation materials S. The lower printed circuit board 1.1 comprises a plurality of electronic components 2, which are in this case formed as passive components 2.1 and embedded in the printed circuit board 1.1. A middle circuit board 1.2 also includes a plurality of electronic components 2, which are embedded in the printed circuit board 1.2 ¬ . The electronic components 2 are formed, for example, as a packaged or unpackaged semiconductor elements 2.2 ¬ out.
Eine obere Leiterplatte 1.3 umfasst sowohl eingebettete elektronische Bauteile 2 als auch elektronische Bauteile 2, die auf einer Außenseite der Leiterplatte 1.3 angeordnet sind. Im gezeigten Ausführungsbeispiel stellen die eingebetteten elektronischen Bauteile 2 passive Bauteile 2.1 und ein Halb¬ leiterelement 2.2 dar. Auf der Außenseite sind als elektronische Bauteile 2 ebenfalls passive Bauteile 2.1 und ein aktives Bauteil 2.3 angeordnet. Das aktive Bauteil 2.3 ist im gezeigten Ausführungsbeispiel mittels Bonddrähten B elektrisch leitend mit außenseitigen Leiterbahnen L verbunden. Das aktive Bauteil 2.3 kann zur elektrischen Kontaktierung alternativ auch mit der Leiterplatte 1.3 verklebt und/oder verlötet und/oder mittels der sogenannten Flip-Chip-Montage verbunden sein. Die passivenAn upper circuit board 1.3 comprises both embedded electronic components 2 and electronic components 2, which are arranged on an outer side of the printed circuit board 1.3. In the illustrated embodiment, the embedded electronic components 2 represent passive components 2.1 and a semi-conductor element ¬ 2.2. On the outside, is for electronic components 2 also passive components and an active component 2.1 2.3 arranged. In the exemplary embodiment shown, the active component 2.3 is electrically conductively connected to outside conductor tracks L by means of bonding wires B. Alternatively, the active component 2.3 can also be adhesively bonded to the printed circuit board 1.3 and / or soldered and / or connected by means of the so-called flip-chip mounting for electrical contacting. The passive ones
Bauteile 2.1 sind mit einer der außenseitigen Leiterbahnen L verklebt und/oder verlötet. Components 2.1 are glued to one of the outside conductor tracks L and / or soldered.
Figur 5 zeigt das Leiterplattenmodul 1 gemäß Figur 4 mit einem Kunststoffspritzguss 4 zum Schutz vor äußeren Einflüssen.FIG. 5 shows the printed circuit board module 1 according to FIG. 4 with a plastic injection molding 4 for protection against external influences.
Alternativ kann anstelle des KunststoffSpritzgusses 4 auch eine Vergussmasse oder ein mit dem Leiterplattenmodul 1 verbundenes Kunststoffgehäuse vorgesehen sein. Bezugs zeichenliste Alternatively, instead of the plastic injection molding 4, a potting compound or a plastic housing connected to the printed circuit board module 1 may be provided. Reference sign list
1 Leiterplattenmodul1 PCB module
1.1 bisl.4 Leiterplatte 1.1 to 4 circuit board
1.1.1, 1.2.1 Kontaktierungsstelle 1.1.1, 1.2.1 contact point
2 elektronisches Bauteil2 electronic component
2.1 passives Bauteil 2.1 passive component
2.2 Halbleiterelement  2.2 semiconductor element
2.3 aktives Bauteil  2.3 active component
3 Verdrahtungsleiterplatte 4 Kunststoffspritzguss  3 Wiring circuit board 4 Plastic injection molding
B Bonddrähte B bonding wires
E elektronische Komponente L Leiterbahn  E electronic component L trace
P Sinterpaste  P sintering paste
S, S' Isolationsmaterial S, S 'insulation material
Si Sinterschicht Si sintered layer
Sl Durchgangsöffnung  Sl passage opening
SLV Sinter-Laminat-Verbund  SLV sintered laminate composite

Claims

Verfahren zur Herstellung einer elektronischen Komponente (E) mit einer Mehrzahl von Leiterplat¬ ten (1.1 bis 1.4), wobei mindestens zwei Leiterplat¬ ten (1.1 bis 1.4) zu wenigstens einem Leiterplattenmo¬ dul (1) miteinander verbunden werden, indem A method of manufacturing an electronic component (E) with a plurality of printed ¬ th (1.1 to 1.4), wherein at least two printed ¬ th (1.1 to 1.4) are interconnected to at least one Leiterplattenmo ¬ dul (1) by
die mindestens zwei Leiterplatten (1.1 bis 1.4) elektrisch und thermisch leitend sowie mechanisch mittels eines Sinter-Laminier-Prozesses miteinander verbunden werden. the at least two printed circuit boards (1.1 to 1.4) are connected to one another electrically and thermally conductively as well as mechanically by means of a sintering-laminating process.
Verfahren nach Anspruch 1, wobei auf mindestens eine zur elektrisch und thermisch leitenden Verbindung vorgesehenen Kontaktierungsstelle (1.2.1) zumindest einer Leiter¬ platte (1.2) des wenigstens einen Leiterplattenmoduls (1) eine Sinterpaste (P) aufgetragen wird. The method of claim 1, wherein at least one provided for the electrically and thermally conductive contact-making compound (1.2.1) at least one conductor ¬ plate (1.2) of the at least one circuit board module (1) comprises a sintered paste (P) is applied.
Verfahren nach Anspruch 1 oder 2, wobei zum Laminieren der mindestens zwei Leiterplatten (1.1 bis 1.4) wenigstens ein elektrisch isolierendes Isolationsmaterial (S) ab¬ schnittsweise zwischen den Leiterplatten (1.1 bis 1.4) angeordnet wird. The method of claim 1 or 2, wherein for laminating the at least two printed circuit boards (1.1 to 1.4) at least one electrically insulating insulation material (S) from ¬ cut-way between the circuit boards (1.1 to 1.4) is arranged.
Verfahren nach Anspruch 3, wobei vor der Anordnung des wenigstens einen Isolationsmaterials (S) zwischen den Leiterplatten (1.1 bis 1.4) wenigstens eine Durchgangs¬ öffnung (Sl) in das Isolationsmaterial (S) eingebracht wird, deren Abmessungen mit Abmessungen mindestens einer Kontaktierungsstelle (1.2.1) der zumindest einen Lei¬ terplatte (1.2) korrespondiert. Method according to claim 3, wherein prior to the arrangement of the at least one insulating material (S) between the printed circuit boards (1.1 to 1.4) at least one passage ¬ opening (Sl) in the insulating material (S) is introduced whose dimensions with dimensions of at least one contacting point (1.2 .1) the at least one Lei ¬ terplatte (1.2) corresponds.
Verfahren nach Anspruch 4, wobei das wenigstens eine Isolationsmaterial (S) zwischen den Leiterplat¬ ten (1.1 bis 1.4) derart angeordnet wird, dass die we¬ nigstens eine Durchgangsöffnung (Sl) , die mindestens eine mit Sinterpaste (P) versehene Kontaktierungsstel¬ le (1.2.1) der einen Leiterplatte (1.2) und zumindest eine weitere Kontaktierungsstelle (1.1.1) wenigstens einer anderen Leiterplatte (1.1) miteinander fluchten. The method of claim 4, wherein the, at least one insulating material (S) between the printed ¬ th (1.1 to 1.4) are arranged such that we ¬ nigstens a through hole (Sl), at least one of sintering paste (P) provided Kontaktierungsstel ¬ le (1.2.1) of a printed circuit board (1.2) and at least one another contact point (1.1.1) at least one other circuit board (1.1) are aligned.
Verfahren nach Anspruch 5, wobei das wenigstens eine Isolationsmaterial (S) und die Leiterplat¬ ten (1.1 bis 1.4) zur Bildung des wenigstens einen Leiterplattenmoduls (1) mit einem vorgegebenen Druck und einer vorgegebenen Temperatur beaufschlagt werden. The method of claim 5, wherein the at least one insulating material (S) and the Leiterplat ¬ th (1.1 to 1.4) to form the at least one printed circuit board module (1) are acted upon with a predetermined pressure and a predetermined temperature.
Verfahren nach einem der vorhergehenden Ansprüche, wobei das wenigstens eine Leiterplattenmodul (1) auf einer Oberflächenseite einer Verdrahtungsleiterplatte (3) an¬ geordnet wird. Method according to one of the preceding claims, wherein the at least one printed circuit board module (1) on a surface side of a wiring board (3) is arranged on ¬ .
Elektronische Komponente (E) mit einer Mehrzahl von Leiterplatten (1.1 bis 1.4), wobei Electronic component (E) with a plurality of printed circuit boards (1.1 to 1.4), wherein
- mindestens zwei Leiterplatten (1.1 bis 1.4) zu we¬ nigstens einem Leiterplattenmodul (1) elektrisch und thermisch leitend miteinander verbunden sind und - at least two printed circuit boards (1.1 to 1.4) are connected to a printed circuit board we ¬ nigstens module (1) is electrically and thermally conductive manner and
- das wenigstens eine Leiterplattenmodul (1) als ein Sinter-Laminat-Verbund (SLV) ausgebildet ist.  - The at least one printed circuit board module (1) is designed as a sintered laminate composite (SLV).
Elektronische Komponente (E) nach Anspruch 8, wobei der Sinter-Laminat-Verbund (SLV) die mindestens zwei Lei¬ terplatten (1.1 bis 1.4) und wenigstens ein abschnitts¬ weise zwischen den mindestens zwei Leiterplat¬ ten (1.1 bis 1.4) angeordnetes, elektrisch isolierendes Isolationsmaterial (S) umfasst. Electronic component (E) according to claim 8, wherein the sintered composite laminate (SLV), the at least two Lei ¬ terplatten (1.1 to 1.4) and at least a portion ¬, between the at least two printed ¬ th (1.1 to 1.4) is arranged, electrically insulating insulating material (S) comprises.
Elektronische Komponente (E) nach Anspruch 9, wobeiAn electronic component (E) according to claim 9, wherein
- die Leiterplatten (1.1 bis 1.4) über zumindest zwei Kontaktierungsstellen (1.1.1, 1.2.1) elektrisch und thermisch leitend miteinander verbunden sind, the printed circuit boards (1.1 to 1.4) are electrically and thermally conductively connected to one another via at least two contacting points (1.1.1, 1.2.1),
- zwischen den zumindest zwei Kontaktierungsstel¬ len (1.1.1, 1.2.1) eine Sinterschicht (Si) ausgebildet ist, - between the at least two Kontaktierungsstel ¬ len (1.1.1, 1.2.1) a sintered layer (Si) is formed,
- das elektrisch isolierende Isolationsmaterial (S) we¬ nigstens eine Durchgangsöffnung (Sl) aufweist, deren Abmessungen mit Abmessungen der zumindest zwei Kontak- tierungsstellen (1.1.1, 1.2.1) korrespondiert und - The electrically insulating insulating material (S) we ¬ least one through hole (Sl), whose Dimensions with dimensions of at least two Kontak- tierungsstellen (1.1.1, 1.2.1) corresponds and
- das wenigstens eine Isolationsmaterial (S) zwischen den Leiterplatten (1.1 bis 1.4) derart angeordnet ist, dass die wenigstens eine Durchgangsöffnung (Sl) und die zu¬ mindest zwei Kontaktierungsstellen (1.1.1, 1.2.1) miteinander fluchten. - the at least one insulating material (S) between the circuit boards arranged in (1.1 to 1.4) such that the at least one passage opening (Sl) and the at least two contact points ¬ (1.1.1, 1.2.1) are in alignment.
Elektronische Komponente (E) nach einem der Ansprüche 8 bis 10, wobei in zumindest einer der Leiterplat¬ ten (1.1 bis 1.4) mindestens ein elektronisches Bau¬ teil (2) eingebettet ist. Electronic component (E) according to any one of claims 8 to 10, wherein in at least one of the printed ¬ th (1.1 to 1.4) at least one electronic construction ¬ part (2) is embedded.
Elektronische Komponente (E) nach einem der Ansprüche 8 bis 11, wobei das wenigstens eine Leiterplattenmodul (1) mit einem Kunststoffspritzguss (4) versehen ist. Electronic component (E) according to one of claims 8 to 11, wherein the at least one printed circuit board module (1) is provided with a plastic injection molding (4).
PCT/EP2018/062089 2017-05-19 2018-05-09 Method for producing an electronic component, and electronic component WO2018210671A1 (en)

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US5601672A (en) * 1994-11-01 1997-02-11 International Business Machines Corporation Method for making ceramic substrates from thin and thick ceramic greensheets
US20030006069A1 (en) * 2001-06-19 2003-01-09 Toru Takebe Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board
DE102014010373A1 (en) * 2014-07-12 2015-01-15 Daimler Ag Electronic module for a motor vehicle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5601672A (en) * 1994-11-01 1997-02-11 International Business Machines Corporation Method for making ceramic substrates from thin and thick ceramic greensheets
US20030006069A1 (en) * 2001-06-19 2003-01-09 Toru Takebe Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board
DE102014010373A1 (en) * 2014-07-12 2015-01-15 Daimler Ag Electronic module for a motor vehicle

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