WO2015135734A1 - Power component integrated into a circuit board - Google Patents

Power component integrated into a circuit board Download PDF

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Publication number
WO2015135734A1
WO2015135734A1 PCT/EP2015/053542 EP2015053542W WO2015135734A1 WO 2015135734 A1 WO2015135734 A1 WO 2015135734A1 EP 2015053542 W EP2015053542 W EP 2015053542W WO 2015135734 A1 WO2015135734 A1 WO 2015135734A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
power module
base
component
copper layer
Prior art date
Application number
PCT/EP2015/053542
Other languages
German (de)
French (fr)
Inventor
Karin Beart
Johannes Bock
Stephanie Gross
Thomas Schmidt
Bernhard Schuch
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Publication of WO2015135734A1 publication Critical patent/WO2015135734A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/1305—Bipolar Junction Transistor [BJT]
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    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors

Definitions

  • the invention relates to a power module having at least one power component in a printed circuit board according to the preamble of claim 1 and to a base printed circuit board having such a power module according to the preamble of claim 8.
  • Automotive technology components such as transmission, engine or brake systems are increasingly electronically controlled.
  • mechatronic controls also referred to as on-site electronics, which can be generated by integration of control electronics and associated electronic components such as sensors or valves in the transmission, the engine or the brake system. That is, the control electronics and the associated electronic components are not housed in a separate protected electronics room outside the transmission, engine or brake system.
  • control unit in the gearbox makes high demands on its thermal and mechanical loading capacity.
  • the functionality has to be guaranteed over a wide temperature range (about -40 ° C up to 200 ° C) as well as for mechanical vibrations (up to about 40g).
  • control unit is at least partially attacked by aggressive media Gearbox oil and transmission oil vapor is surrounded, it must also have a very high degree of seal against these media.
  • the control unit usually a circuit carrier, for. B. includes a printed circuit board and located thereon active and passive electronic components.
  • the circuit boards are made of fiber-reinforced plastic or ceramic.
  • the components are mounted on the surface of the printed circuit board in the same orientation as the "surface-mounted” technology, ie the connecting legs of the components, also called pins, are picked up and the pad surfaces of the printed conductor structure, which are provided with solder paste or electrically conductive adhesive, are aligned soldered or fixed in a reflow soldering process or similar curing process, the pins on the underside of the component housing are thus just connected to the conductor track structure of the printed circuit board.
  • the connecting legs of the components also called pins
  • This arrangement of the components on the circuit board has in particular ⁇ special for use in transmission controls the disadvantage that the components can come into direct or indirect contact with the transmission oil. Due to the aggressive components contained in the gear oil possibly, in particular sulfur ⁇ shares in different concentrations and different states of matter, the functionalities of respective component can be adversely affected, which in individual cases can also lead to failure of the respective component.
  • the invention has for its object to admit a power module with at least one power component in a circuit board ⁇ , which provides improved protection against environmental influences, especially aggressive oils and
  • the power module according to the invention comprises at least one power component and a printed circuit board.
  • the printed circuit board has at least one upper copper layer and one lower copper layer. Between the two copper layers, an electrically insulating circuit board base material is arranged, which is designed in particular as a resin-impregnated glass fiber base fabric, a so-called prepreg material.
  • the power device is completely enclosed between the top copper layer and the bottom copper layer with the circuit board base material.
  • the power component is thereby protected against environmental influences, in particular against aggressive oils.
  • heatsink ambient ⁇ environment
  • a power component for example a transistor
  • unhoused power components are used, as these design-based produce less heat and have a smaller footprint than packaged components with the same performance.
  • Two transistors in a power module can be connected in particular as a half bridge.
  • a power component can be electrically conductively connected to the upper copper layer and the lower copper layer by means of at least one plated-through hole or an electrically conductive connecting layer.
  • a power component prefferably be connected to one or both copper layers only by means of a through-connection or only by means of an electrically conductive connection layer.
  • An electrically conductive connection layer can be realized for example by a conductive adhesive or solder.
  • the lower copper layer of the printed circuit board is in particular a copper sheet, a so-called Kupferleadframe, or a copper laminate film, wherein the circuit board can also be designed as a compact multilayer printed circuit board.
  • a Leis ⁇ processing module advantageously arranged in a cavity of the Basislei ⁇ terplatte and with the base printed circuit board by means of soldering, welding, gluing or by means of electrical Ankontak- tierungen electrically conductively connected in the form of microvias.
  • Microvia Vertical Interconnect Access refers to a vertical plated through hole with a diameter smaller than 150 ⁇ m.
  • At least one additional electrical component is arranged in the immediate vicinity of a power component and electrically conductively connected to this power component.
  • the additional electrical member is in particular disposed either on a surface of the base board, in the base board or in Leis ⁇ processing module itself.
  • the additional component may be, for example, a passive component, such as an interference suppression capacitor.
  • the base circuit board can be used as a circuit board of a vehicle transmission control.
  • Fig. 1 is a housed component on a circuit board in
  • Fig. 2 is an unpackaged component on a circuit board according to prior art
  • Fig. 3 shows an inventive power module with two Leis ⁇ processing components
  • FIG. 4 shows a power module according to the invention for connection to a base circuit board
  • FIG. 6 shows a base circuit board with integrated power module and a suppression component on the surface of the base plate
  • FIG. 7 shows a base circuit board with integrated power module and a suppression component in the power module.
  • power components such as power transistors, in particular MOSFETs, IGBTs, etc.
  • the power components can be housed or inexhaustible, with unhoused components producing less heat than packaged components of equal power.
  • Fig. 1 shows a clad component 4 on a printed circuit board in SMD technology according to the prior art.
  • a component 4 with casing 9 is equipped, for example, for the appli ⁇ case of use in a transmission control in particular by the "surface-mounted" technology on the surface 2 of a single-layer here printed circuit board, wherein the circuit board includes a top copper layer 2 and a lower copper layer 3 and electrically insulating printed circuit board base material 1 is arranged between the two copper layers 2, 3.
  • the corresponding pad surfaces on the printed circuit board are provided with soldering paste 5 as the bonding layer on which the component 4 is aligned with the connecting legs 7 and mounted in a subsequent curing process (eg Reflow soldering process, etc.).
  • FIG. 2 shows an unhoused component 4, for example a transistor, on a single-layer printed circuit board 1, 2, 3 according to the prior art.
  • the unhoused component 4 also called “bare-die”, is usually glued or soldered to the printed circuit board 12.
  • the electrically conductive connection between the terminal pad 6 on the component 4 and the upper copper layer 2 of the printed circuit board is here produced by means of a bonding wire 8 (compare "chip & wire” technique).
  • This "surface-mounted” technology has the disadvantage in particular in at ⁇ application in transmission controls that may occur as transmission oil to direct or indirect contact of the electrical components 4 with ambient media.
  • transmission oil to direct or indirect contact of the electrical components 4 with ambient media.
  • the aggressive components in the gear oil can lead to corrosion of Components 4 themselves, but also the leads such as the bonding wires 8 come. This can lead to failure of the components 4 and thus the entire transmission control.
  • the power module here comprises two power components 4, which are integrated in a printed circuit board. However, only one or even more than two power components 4 could be used. In this case, the embedding of "bare-dies" is preferred because of their smaller construction height compared to housed components.
  • the circuit board base material 1 is, in particular, a resin impregnated fiberglass base fabric, a so-called prepreg material and the lower copper layer 3 are completely enclosed with printed circuit board base material 1 and thereby protected from potentially damaging surrounding media, thus ensuring a reliable function of the power components 4 and thus of the power module 12.
  • the thickness is upper and lower Copper layer 2, 3 each in the range of up to 105 ym.
  • the copper layers 2, 3 may be thicker than conventional circuit boards of this type, the thickness normally being ⁇ 70 ym.
  • the prepreg material 1 is designed as a thermal prepreg material filled with additives having a thermal conductivity greater than 0.5 W / mK.
  • both the height of the printed circuit board can be reduced by the height of the components 4 and the bonding wires 8 and the printed circuit board overall surface around the surface of the contacts such as terminal pads.
  • a power component 4 is electrically conductively connected to the lower copper layer 3 by means of through contacts 12, for example microvias, with the upper copper layer 2 and by means of an electrically conductive connection layer 5, for example a thermal adhesive.
  • the two types of connection 12 and 5 to the copper layers 2, 3 could also be reversed.
  • a power component 4 is connected to the copper layers 2, 3 only via plated-through holes 12 or only via connecting layers 5.
  • the copper layers 2, 3 themselves are usually electrically conductively connected to each other by means of plated-through holes 12.
  • FIG. 4 shows a power module as in FIG. 3, wherein a power component 4 only has plated-through holes 12
  • FIG. 5 shows a base circuit board 11 with conductor tracks 14, wherein a power module, as disclosed in FIGS. 3 and 4, is integrated in a not explicitly highlighted recess or cavity of the base circuit board 11.
  • the base-conductor plate 11 is designed here as a multi-layer printed circuit board, but it could also be single-layer.
  • the power module with the exambau ⁇ share 4 is completely enclosed with insulating material of the base circuit board 11 and thus additionally protected from environmental influences.
  • the power module is electrically conductively connected to the conductor tracks 14 of the base circuit board 11 by means of plated-through holes 12. This connection could also be by means of a
  • Cohesive connection such as soldering, welding or gluing can be realized.
  • the additional component 13 may, for example, be a passive component, in particular an interference suppression capacitor, which is arranged in the immediate vicinity of a power component 4.
  • FIG. 7 shows a base circuit board 11 as in FIG. 6, wherein the additional electrical component 13 is arranged in the power module in the immediate vicinity of a power component 4.
  • the additional electrical component 13 could also be arranged in the insulating layer of the base circuit board 11 outside the power module in the immediate vicinity of a power component 4.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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Abstract

The invention relates to a power module with at least one power component (4) which is integrated into a circuit board. The circuit board comprises at least one upper copper layer (2) and a lower copper layer (3), and an electrically insulating circuit board base material (1) is arranged between the two copper layers (2, 3). The circuit board base material (1) is a fiberglass base cloth impregnated with resin, i.e. a prepreg material, and the at least one power component (4) is completely surrounded by the circuit board base material (1) between the upper copper layer (2) and the lower copper layer (3). The copper layers (2, 3) have a thickness of up to 105 µm, and the prepreg material (1) is designed as a thermal prepreg material which is filled with an additive and which has a heat conductivity greater than ≈0,5 W/mK.

Description

Beschreibung description
Leistungsbauteil in einer Leiterplatte integriert Die Erfindung betrifft ein Leistungsmodul mit mindestens einem Leistungsbauteil in einer Leiterplatte nach dem Oberbegriff von Anspruch 1 sowie eine Basisleiterplatte mit einem derartigen Leistungsmodul nach dem Oberbegriff von Anspruch 8. Aus dem Stand der Technik ist es allgemein bekannt, dass in der Kraftfahrzeugtechnik Komponenten wie Getriebe-, Motoren- oder Bremssysteme zunehmend elektronisch gesteuert sind. Hierzu existieren integrierte mechatronische Steuerungen, auch als Vorort-Elektroniken bezeichnet, welche durch Integration von Steuerelektronik und zugehöriger elektronischer Komponenten wie Sensoren oder Ventile in das Getriebe, den Motor oder das Bremssystem erzeugbar sind. Das heißt, die Steuerelektronik und die zugehörigen elektronischen Komponenten sind nicht in einem separaten geschützten Elektronikraum außerhalb des Getriebes, Motors oder Bremssystems untergebracht. The invention relates to a power module having at least one power component in a printed circuit board according to the preamble of claim 1 and to a base printed circuit board having such a power module according to the preamble of claim 8. From the prior art it is well known that in the Automotive technology components such as transmission, engine or brake systems are increasingly electronically controlled. For this purpose, there are integrated mechatronic controls, also referred to as on-site electronics, which can be generated by integration of control electronics and associated electronic components such as sensors or valves in the transmission, the engine or the brake system. That is, the control electronics and the associated electronic components are not housed in a separate protected electronics room outside the transmission, engine or brake system.
Im Vergleich zur konventionellen Verwendung externer An- bau-steuergeräte hat diese Anordnung enorme Vorteile im Bezug auf Qualität, Kosten, Gewicht und Funktionalität. Insbesondere resultiert daraus eine erhebliche Verringerung von unter Um¬ ständen fehleranfälligen Steckverbindungen und Leitungen. Compared to the conventional use of external attachment controllers, this arrangement has enormous advantages in terms of quality, cost, weight and functionality. In particular, this results in a considerable reduction of under prone ¬ fault prone connectors and lines.
Die Integration des Steuergerätes in das Getriebe stellt dabei hohe Anforderungen an seine thermische und mechanische Be- lastbarkeit. Die Funktionalität muss sowohl über einen breiten Temperaturbereich (etwa -40°C bis hin zu 200°C) als auch bei mechanischen Vibrationen (bis zu etwa 40g) gewährleistet sein. Da das Steuergerät zumindest zum Teil von aggressiven Medien wie Getriebeöl und Getriebeöldampf umgeben ist, muss es zudem einen sehr hohen Dichtheitsgrad gegenüber diesen Medien aufweisen. The integration of the control unit in the gearbox makes high demands on its thermal and mechanical loading capacity. The functionality has to be guaranteed over a wide temperature range (about -40 ° C up to 200 ° C) as well as for mechanical vibrations (up to about 40g). Because the control unit is at least partially attacked by aggressive media Gearbox oil and transmission oil vapor is surrounded, it must also have a very high degree of seal against these media.
In Kraftfahrzeugen werden derartige Steuergeräte mit einer elektronischen Steuereinheit und zugeordneten Komponenten für unterschiedliche Aufgaben eingesetzt, wobei die Steuereinheit in der Regel einen Schaltungsträger, z. B. eine Leiterplatte und darauf befindliche aktive und passive elektronische Bauteile umfasst. Dabei sind die Leiterplatten in der Regel aus fa- serverstärktem Kunststoff oder aus Keramik. In motor vehicles such controllers are used with an electronic control unit and associated components for different tasks, the control unit usually a circuit carrier, for. B. includes a printed circuit board and located thereon active and passive electronic components. As a rule, the circuit boards are made of fiber-reinforced plastic or ceramic.
Das Bestücken von verschiedenen Bauteilen auf der Oberfläche eines Schaltungsträgers insbesondere einer Leiterplatte mittels sog. „Surface Mounted" Technologie ist Stand der Technik. Die Bauteile können gehäust oder auch ungehäust sein. The assembly of various components on the surface of a circuit carrier, in particular a printed circuit board by means of so-called "surface-mounted" technology, is known in the art.
Dabei werden die Bauteile durch die„Surface Mounted" Technologie gleich orientiert auf der Oberfläche der Leiterplatte montiert, d.h. die Anschlussbeine der Bauteile, auch Pins genannt, werden aufsog. Padflächen der Leiterbahnstruktur, die mit Lotpaste oder elektrisch leitfähigem Kleber versehen sind, ausgerichtet und anschließend in einem Reflow-Lötprozess oder ähnlichem Aus- härteprozess verlötet oder fixiert. Die Pins auf der Unterseite des Bauteilgehäuses sind somit eben mit der Leiterbahnstruktur der Leiterplatte verbunden. In the process, the components are mounted on the surface of the printed circuit board in the same orientation as the "surface-mounted" technology, ie the connecting legs of the components, also called pins, are picked up and the pad surfaces of the printed conductor structure, which are provided with solder paste or electrically conductive adhesive, are aligned soldered or fixed in a reflow soldering process or similar curing process, the pins on the underside of the component housing are thus just connected to the conductor track structure of the printed circuit board.
Diese Anordnung der Bauteile auf der Leiterplatte hat insbe¬ sondere bei der Anwendung in Getriebesteuerungen den Nachteil, dass die Bauteile direkt oder indirekt mit dem Getriebeöl in Kontakt kommen können. Durch die im Getriebeöl unter Umständen enthaltenen aggressiven Bestandteile, insbesondere Schwefel¬ anteile in unterschiedlicher Konzentration und unterschiedlichen Aggregatzuständen, können die Funktionalitäten des jeweiligen Bauteils negativ beeinflusst werden, was in Einzelfällen auch zum Ausfall des jeweiligen Bauteils führen kann. This arrangement of the components on the circuit board has in particular ¬ special for use in transmission controls the disadvantage that the components can come into direct or indirect contact with the transmission oil. Due to the aggressive components contained in the gear oil possibly, in particular sulfur ¬ shares in different concentrations and different states of matter, the functionalities of respective component can be adversely affected, which in individual cases can also lead to failure of the respective component.
Der Erfindung liegt die Aufgabe zugrunde, ein Leistungsmodul mit mindestens einem Leistungsbauteil in einer Leiterplatte an¬ zugeben, das einen verbesserten Schutz gegenüber Umgebungseinflüssen, insbesondere aggressiven Ölen bietet und The invention has for its object to admit a power module with at least one power component in a circuit board ¬ , which provides improved protection against environmental influences, especially aggressive oils and
gleichzeitig die von dem Leistungsbauteil produzierte Wärme effektiv abzuführen. at the same time effectively dissipate the heat produced by the power component.
Diese Aufgabe wird gelöst durch ein Leistungsmodul mit den Merkmalen des Anspruchs 1. This object is achieved by a power module having the features of claim 1.
Der erfindungsgemäße Leistungsmodul umfasst wenigstens ein Leistungsbauteil und eine Leiterplatte. Die Leiterplatte weist mindestens eine obere Kupferlage und eine untere Kupferlage auf. Zwischen den beiden Kupferlagen ist ein elektrisch isolierendes Leiterplattenbasismaterial angeordnet, das insbesondere als ein mit Harz getränktes Glasfaserbasisgewebe, ein sogenanntes Prepreg-Material , ausgeführt ist. Das Leistungsbauteil ist zwischen der oberen Kupferlage und der unteren Kupferlage vollständig mit dem Leiterplattenbasismaterial umschlossen. The power module according to the invention comprises at least one power component and a printed circuit board. The printed circuit board has at least one upper copper layer and one lower copper layer. Between the two copper layers, an electrically insulating circuit board base material is arranged, which is designed in particular as a resin-impregnated glass fiber base fabric, a so-called prepreg material. The power device is completely enclosed between the top copper layer and the bottom copper layer with the circuit board base material.
Das Leistungsbauteil ist dadurch vor Umgebungseinflüssen, insbesondere vor aggressiven Ölen geschützt. Dadurch, dass die Kupferlagen eine Dicke im Bereich von bis zu 105 ym aufweisen und das Prepreg-Material ein thermisches, mit Zusatzstoffen ge¬ fülltes Prepreg-Material mit einer Wärmeleitfähigkeit größer ~ 0,5 W/mK ist, kann die von den Leistungsbauteilen in der Leiterplatte produzierte Wärme besonders effektiv an die Um¬ gebung (Kühlkörper) außerhalb der Leiterplatte abgeleitet werden . Aufgrund der erfindungsgemäßen Kupferlagen oder durch andere Technologien, die den Kupferquerschnitt partiell oder flächig erhöhen, sind zudem höhere Stromtragfähigkeiten als bei herkömmlichen Schaltungsträgern realisierbar, wobei hier Strom- tragfähigkeiten bis in den Bereich von bis 100 A und mehr möglich sind . The power component is thereby protected against environmental influences, in particular against aggressive oils. Characterized in that the copper layers having a thickness in the range of up to 105 ym, and the prepreg material a thermal greater with additives ge ¬ completed prepreg material having a thermal conductivity of ~ 0.5 W / mK, can by the power components in The printed circuit board produced heat particularly effective to the ambient ¬ environment (heatsink) outside the circuit board to be derived. Due to the copper layers according to the invention or by other technologies that increase the copper cross-section partially or surface, also higher current carrying capacities than conventional circuit carriers can be realized, with current carrying capacities up to the range of up to 100 A and more are possible here.
Ein Leistungsbauteil, beispielsweise ein Transistor, kann als Bauteil mit Gehäuse oder als Bauteil ohne Gehäuse, als soge- nanntes bare-die, ausgeführt sein . In der Regel werden ungehäuste Leistungsbauteile verwendet, da diese bauartbedingt weniger Wärme produzieren und einen geringeren Platzbedarf aufweisen als gehäuste Bauteile mit gleicher Leistung. Zwei Transistoren in einem Leistungsmodul können insbesondere als Halbbrücke ver- schaltet sein. A power component, for example a transistor, can be embodied as a component with a housing or as a component without a housing, as a so-called bare-die. As a rule, unhoused power components are used, as these design-based produce less heat and have a smaller footprint than packaged components with the same performance. Two transistors in a power module can be connected in particular as a half bridge.
Ein Leistungsbauteil kann je nach Anwendung mittels wenigstens einer Durchkontaktierung oder einer elektrisch leitenden Verbindungsschicht mit der oberen Kupferlage und der unteren Kupferlage elektrisch leitend verbunden sein. Depending on the application, a power component can be electrically conductively connected to the upper copper layer and the lower copper layer by means of at least one plated-through hole or an electrically conductive connecting layer.
Möglich ist auch, dass ein Leistungsbauteil nur mittels einer Durchkontaktierung oder nur mittels einer elektrisch leitenden Verbindungsschicht mit einer bzw. mit beiden Kupferlagen verbunden ist. Eine elektrisch leitende Verbindungsschicht kann zum Beispiel durch einen Leitkleber oder Lot realisiert werden. It is also possible for a power component to be connected to one or both copper layers only by means of a through-connection or only by means of an electrically conductive connection layer. An electrically conductive connection layer can be realized for example by a conductive adhesive or solder.
Der Einfachheit halber ist die untere Kupferlage der Leiterplatte insbesondere ein Kupferblech, ein sogenanntes Kupferleadframe, oder eine Kupferlaminatfolie, wobei die Leiterplatte auch als kompakte Mehrlagenleiterplatte ausgeführt sein kann. Vorteilhafterweise sind die zusätzlichen Füllstoffe in dem thermischen Prepreg-Material anorganische Füllstoffe insbe¬ sondere aus Aluminiumoxid. Eine weitere Aufgabe der vorliegenden Erfindung ist es, eine Basisleiterplatte mit einem Leistungsmodul gemäß einem der Ansprüche 1 bis 6 zu schaffen. For the sake of simplicity, the lower copper layer of the printed circuit board is in particular a copper sheet, a so-called Kupferleadframe, or a copper laminate film, wherein the circuit board can also be designed as a compact multilayer printed circuit board. Advantageously, the additional fillers are in the thermal prepreg material in particular inorganic fillers ¬ sondere of alumina. Another object of the present invention is to provide a base circuit board having a power module according to any one of claims 1 to 6.
Diese Aufgabe wird erfindungsgemäß gelöst durch eine Basis- leiterplatte mit den Merkmalen des Anspruchs 8. This object is achieved by a base plate with the features of claim 8.
Bei der erfindungsgemäßen Basisleiterplatte ist ein Leis¬ tungsmodul vorteilhafterweise in einer Kavität der Basislei¬ terplatte angeordnet und mit der Basisleiterplatte mittels Löten, Schweißen, Kleben oder mittels elektrischer Ankontak- tierungen in Form von Mikrovias elektrisch leitend verbunden. Is, in the inventive base board a Leis ¬ processing module advantageously arranged in a cavity of the Basislei ¬ terplatte and with the base printed circuit board by means of soldering, welding, gluing or by means of electrical Ankontak- tierungen electrically conductively connected in the form of microvias.
Mit Mikrovia (Via = Vertical Interconnect Access) wird eine vertikale Durchkontaktierung mit einem Durchmesser kleiner als 150 μιη bezeichnet. Microvia (Via = Vertical Interconnect Access) refers to a vertical plated through hole with a diameter smaller than 150 μm.
In einer besonderen Ausgestaltungsform ist mindestens ein zusätzliches elektrisches Bauteil in unmittelbarer Nähe eines Leistungsbauteils angeordnet und mit diesem Leistungsbauteil elektrisch leitend verbunden. Das zusätzliche elektrische Bauteil ist insbesondere entweder auf einer Oberfläche der Basisleiterplatte, in der Basis-leiterplatte oder im Leis¬ tungsmodul selbst angeordnet. Das zusätzliche Bauteil kann beispielsweise ein passives Bauteil, etwa ein Entstörkondensator sein. Dadurch sind in der Basisleiterplatte sehr kurze und niederimpedante Leitungswege zu erreichen. In a particular embodiment, at least one additional electrical component is arranged in the immediate vicinity of a power component and electrically conductively connected to this power component. The additional electrical member is in particular disposed either on a surface of the base board, in the base board or in Leis ¬ processing module itself. The additional component may be, for example, a passive component, such as an interference suppression capacitor. As a result, very short and low-impedance conduction paths can be achieved in the base circuit board.
Insbesondere kann die Basisleiterplatte als Leiterplatte einer KFZ-Getriebesteuerung verwendet werden. In der nachfolgenden Beschreibung werden die Merkmale und Einzelheiten der Erfindung in Zusammenhang mit den beigefügten Zeichnungen anhand von Ausführungsbeispielen näher erläutert. Dabei sind in einzelnen Varianten beschriebene Merkmale und Zusammenhänge grundsätzlich auf alle Ausführungsbeispiele übertragbar. In den Zeichnungen zeigen: In particular, the base circuit board can be used as a circuit board of a vehicle transmission control. In the following description, the features and details of the invention in conjunction with the accompanying drawings with reference to embodiments will be explained in more detail. In this case, features and relationships described in individual variants can in principle be applied to all exemplary embodiments. In the drawings show:
Fig. 1 ein gehäustes Bauteil auf einer Leiterplatte in Fig. 1 is a housed component on a circuit board in
SMD-Technologie nach Stand der Technik, State-of-the-art SMD technology,
Fig. 2 ein ungehäustes Bauteil auf einer Leiterplatte nach Stand der Technik, Fig. 3 ein erfindungsgemäßes Leistungsmodul mit zwei Leis¬ tungsbauteilen, Fig. 2 is an unpackaged component on a circuit board according to prior art, Fig. 3 shows an inventive power module with two Leis ¬ processing components,
Fig. 4 ein erfindungsgemäßes Leistungsmodul zur Anbindung an eine Basisleiterplatte, 4 shows a power module according to the invention for connection to a base circuit board,
Fig. 5 eine Basisleiterplatte mit integriertem Leistungsmodul, 5 a base circuit board with integrated power module,
Fig. 6 eine Basisleiterplatte mit integriertem Leistungsmodul und einem Entstörbauteil auf der Oberfläche der Ba- sis-leiterplatte, und 6 shows a base circuit board with integrated power module and a suppression component on the surface of the base plate, and
Fig. 7 eine Basisleiterplatte mit integriertem Leistungsmodul und einem Entstörbauteil im Leistungsmodul. Nach aktuellem Stand der Leiterplattentechnik werden Leistungsbauteile wie Leistungstransistoren insbesondere MOSFETs, IGBTs etc. auf eine Leiterplatte mit mindestens einer Lage auf die Außenlagen bestückt. Die Leistungsbauteile können gehäust oder ungenaust sein, wobei ungehäuste Bauteile weniger Wärme produzieren als gehäuste Bauteile gleicher Leistung. 7 shows a base circuit board with integrated power module and a suppression component in the power module. According to the current state of printed circuit board technology, power components such as power transistors, in particular MOSFETs, IGBTs, etc., are fitted to a printed circuit board with at least one layer on the outer layers. The power components can be housed or inexhaustible, with unhoused components producing less heat than packaged components of equal power.
Fig. 1 zeigt ein gehäustes Bauteil 4 auf einer Leiterplatte in SMD-Technologie nach dem Stand der Technik. Fig. 1 shows a clad component 4 on a printed circuit board in SMD technology according to the prior art.
Ein Bauteil 4 mit Gehäuse 9 ist zum Beispiel für den Anwen¬ dungsfall in einer Getriebesteuerung insbesondere durch die „Surface-Mounted"-Technologie auf die Oberfläche 2 einer hier einlagigen Leiterplatte bestückt, wobei die Leiterplatte eine obere Kupferlage 2 und eine untere Kupferlage 3 umfasst und zwischen den beiden Kupferlagen 2, 3 elektrisch isolierendes Leiterplattenbasismaterial 1 angeordnet ist. Die entsprechenden Padflächen auf der Leiterplatte sind mit Lötpaste 5 als Ver- bindungsschicht versehen. Auf diesen wird das Bauteil 4 mit den Anschlussbeinchen 7 ausgerichtet und in einem nachfolgenden Aushärteprozess montiert (z.B. Reflow-Lötprozess , etc.). A component 4 with casing 9 is equipped, for example, for the appli ¬ case of use in a transmission control in particular by the "surface-mounted" technology on the surface 2 of a single-layer here printed circuit board, wherein the circuit board includes a top copper layer 2 and a lower copper layer 3 and electrically insulating printed circuit board base material 1 is arranged between the two copper layers 2, 3. The corresponding pad surfaces on the printed circuit board are provided with soldering paste 5 as the bonding layer on which the component 4 is aligned with the connecting legs 7 and mounted in a subsequent curing process (eg Reflow soldering process, etc.).
Fig. 2 zeigt ein ungehäustes Bauteil 4, zum Beispiel einen Transistor, auf einer einlagigen Leiterplatte 1, 2, 3 gemäß dem Stand der Technik. Das ungehäuste Bauteil 4, auch „bare-die" genannt, ist in der Regel auf die Leiterplatte geklebt oder gelötet. Die elektrisch leitende Verbindung zwischen dem Anschlusspad 6 auf dem Bauteil 4 und der oberen Kupferlage 2 der Leiterplatte ist hier mittels eines Bonddrahts 8 hergestellt (vergleiche „chip & wire" Technik) . FIG. 2 shows an unhoused component 4, for example a transistor, on a single-layer printed circuit board 1, 2, 3 according to the prior art. The unhoused component 4, also called "bare-die", is usually glued or soldered to the printed circuit board 12. The electrically conductive connection between the terminal pad 6 on the component 4 and the upper copper layer 2 of the printed circuit board is here produced by means of a bonding wire 8 (compare "chip & wire" technique).
Diese „Surface-Mounted"-Technologie hat insbesondere bei An¬ wendung in Getriebesteuerungen den Nachteil, dass es zu direktem oder indirektem Kontakt der elektrischen Bauteile 4 mit Umgebungsmedien wie Getriebeöl kommen kann. Insbesondere durch die aggressiven Anteile im Getriebeöl kann es zu einer Korrosion der Bauteile 4 selbst, aber auch der Zuleitungen wie den Bonddrähten 8 kommen. Dies kann zu Ausfällen der Bauteile 4 und damit der gesamten Getriebesteuerung führen. This "surface-mounted" technology has the disadvantage in particular in at ¬ application in transmission controls that may occur as transmission oil to direct or indirect contact of the electrical components 4 with ambient media. In particular, by the aggressive components in the gear oil can lead to corrosion of Components 4 themselves, but also the leads such as the bonding wires 8 come. This can lead to failure of the components 4 and thus the entire transmission control.
Die genannten Nachteile können durch ein erfindungsgemäßes Leistungsmodul wie Fig. 3 weitestgehend vermieden werden. The disadvantages mentioned can be largely avoided by an inventive power module as shown in FIG. 3.
Das Leistungsmodul umfasst hier zwei Leistungsbauteile 4, die in eine Leiterplatte integriert sind. Es könnten aber nur ein oder auch mehr als zwei Leistungsbauteile 4 verwendet werden. Dabei wird das Einbetten von „bare-dies" aufgrund ihrer im Vergleich zu gehäusten Bauteilen geringeren Bauhöhe bevorzugt. In Fig. 3 handelt es sich insbesondere um zwei ungehäuste Transistoren 4, beispielsweise MOSFETs, die zu einer Halbbrücke verschaltet sind. Die Leiterplatte wird gebildet durch eine obere Kupferlage 2 und eine untere Kupferlage 3, zwischen denen ein elektrisch isolierendes Leiterplattenbasismaterial 1 angeordnet ist. Das Leiter-plattenbasismaterial 1 ist insbesondere ein mit Harz getränktes Glasfaserbasisgewebe, ein sogenanntes Prep- reg-Material . Die Leistungsbauteile 4 sind zwischen der oberen Kupferlage 2 und der unteren Kupferlage 3 vollständig mit Leiterplattenbasismaterial 1 umschlossen und dadurch wei- testgehen vor unter Umständen schädlichen Umgebungsmedien geschützt. In der Regel ist somit eine zuverlässige Funktion der Leistungsbauteile 4 und somit des Leistungsmoduls gewährleistet. Vorteilhafterweise liegt die Dicke der oberen und der unteren Kupferlage 2, 3 je im Bereich von bis zu 105 ym. Die Kupferlagen 2, 3 können dicker als bei herkömmlichen Leiterplatten dieser Art sein, wobei die Dicke normalerweise < 70 ym ist. Ferner ist das Prepreg-Material 1 als ein thermisches, mit Zusatzstoffen gefülltes Prepreg-Material mit einer Wärmeleitfähigkeit größer ~ 0,5 W/mK ausgeführt. Durch die Zugabe von Füllstoffen wie anorganische Partikel aus Aluminiumoxid zum Leiterplattenba¬ sismaterial 1 wird diese erhöhte Wärmeleitfähigkeit erreicht. Durch den Einsatz der erfindungsgemäßen Kupferlagen 2, 3 und der erfindungsgemäßen thermischen Prepregs im Leiterplattenaufbau kann die von den Leistungsbauteilen 4 produzierte Wärme besonders effektiv abgeführt werden, was sich positiv auf ihre Lebensdauer auswirkt. The power module here comprises two power components 4, which are integrated in a printed circuit board. However, only one or even more than two power components 4 could be used. In this case, the embedding of "bare-dies" is preferred because of their smaller construction height compared to housed components., In particular, there are two unhoused transistors 4, for example MOSFETs, which are connected to form a half-bridge an upper copper layer 2 and a lower copper layer 3 between which is disposed an electrically insulating circuit board base material 1. The circuit board base material 1 is, in particular, a resin impregnated fiberglass base fabric, a so-called prepreg material and the lower copper layer 3 are completely enclosed with printed circuit board base material 1 and thereby protected from potentially damaging surrounding media, thus ensuring a reliable function of the power components 4 and thus of the power module 12. Advantageously, the thickness is upper and lower Copper layer 2, 3 each in the range of up to 105 ym. The copper layers 2, 3 may be thicker than conventional circuit boards of this type, the thickness normally being <70 ym. Further, the prepreg material 1 is designed as a thermal prepreg material filled with additives having a thermal conductivity greater than 0.5 W / mK. By the addition of fillers such as inorganic particles made of alumina for Leiterplattenba ¬ sismaterial 1 this increased thermal conductivity is achieved. By using the copper layers 2, 3 according to the invention and the thermal prepregs according to the invention in the printed circuit board construction, the heat produced by the power components 4 can be dissipated particularly effectively, which has a positive effect on their service life.
Aufgrund der erfindungsgemäßen Kupferlagen 2, 3 sind auch höhere Stromtragfähigkeiten gegenüber herkömmlichen Schaltungsträgern realisierbar, wobei hier Stromtragfähigkeiten bis in den Bereich von bis 100 A und mehr möglich sind. Due to the copper layers 2, 3 according to the invention, higher current carrying capacities than conventional circuit carriers can also be realized, with current carrying capacities of up to 100 A and more being possible here.
Durch die Integration der Leistungsbauteile 4 in die Leiterplatte kann sowohl die Bauhöhe der Leiterplatte um die Höhe der Bauteile 4 und der Bonddrähte 8 als auch die Leiterplattengesamtoberfläche um die Fläche der Kontaktierungen wie Anschlusspads reduziert werden . By integrating the power components 4 into the printed circuit board, both the height of the printed circuit board can be reduced by the height of the components 4 and the bonding wires 8 and the printed circuit board overall surface around the surface of the contacts such as terminal pads.
In Fig. 3 ist ein Leistungsbauteil 4 mittels Durchkontak- tierungen 12, beispielsweise Mikrovias, mit der oberen Kup- ferlage 2 und mittels einer elektrisch leitenden Verbindungsschicht 5, zum Beispiel einem Wärmeleitkleber, mit der unteren Kupferlage 3 elektrisch leitend verbunden. Die beiden Verbindungsarten 12 und 5 zu den Kupferlagen 2, 3 könnten auch vertauscht sein. Ferner ist es denkbar, dass ein Leistungsbauteil 4 nur über Durchkontaktierungen 12 oder nur über Verbindungsschichten 5 mit den Kupferlagen 2, 3 verbunden ist. Die Kupferlagen 2, 3 selbst sind in der Regel mittels Durchkontaktierungen 12 miteinander elektrisch leitend verbunden. Die Leiterplatte kann auch als eine Mehrlagenleiterplatte, zum Beispiel eine HDI-Leiterplatte (HDI = High Density Intercon- nect) , mit mehr als zwei Kupferlagen 2, 3 ausgeführt sein. Fig. 4 zeigt ein Leistungsmodul wie in Fig. 3, wobei ein Leistungsbauteil 4 nur über Durchkontaktierungen 12 In FIG. 3, a power component 4 is electrically conductively connected to the lower copper layer 3 by means of through contacts 12, for example microvias, with the upper copper layer 2 and by means of an electrically conductive connection layer 5, for example a thermal adhesive. The two types of connection 12 and 5 to the copper layers 2, 3 could also be reversed. Furthermore, it is conceivable that a power component 4 is connected to the copper layers 2, 3 only via plated-through holes 12 or only via connecting layers 5. The copper layers 2, 3 themselves are usually electrically conductively connected to each other by means of plated-through holes 12. The printed circuit board can also be designed as a multi-layer printed circuit board, for example an HDI printed circuit board (HDI = High Density Interconnect), with more than two copper layers 2, 3. FIG. 4 shows a power module as in FIG. 3, wherein a power component 4 only has plated-through holes 12
aus-schließlich mit der oberen Kupferlage 2 verbunden ist, und wobei das Leistungsmodul mittels an der von den Leistungs- bauteilen 4 abgewandten Außenfläche der unteren Kupferlage 3 angeordneten Lötverbindung in Form von sogenannten „solder balls" 10 mit einer weiteren Leiterplatte, insbesondere einer Basisleiterplatte 11 elektrisch leitend verbindbar ist. Eine Alternative zu den„solder balls" könnten zum Beispiel sogenannte SMD-Pinleisten sein. is exclusively connected to the upper copper layer 2, and wherein the power module by means disposed on the remote from the power components 4 outer surface of the lower copper layer 3 solder joint in the form of so-called "solder balls" 10 with another circuit board, in particular a base circuit board 11th An alternative to the "solder balls" could be, for example, so-called SMD pin strips.
Fig. 5 zeigt eine Basisleiterplatte 11 mit Leiterbahnen 14, wobei ein Leistungsmodul, wie in den Fig. 3 und 4 offenbart, in einer nicht explizit hervorgehobenen Ausnehmung oder Kavität der Basisleiterplatte 11 integriert ist. Die Basis-leiterplatte 11 ist hier als Mehrlagenleiterplatte ausgeführt, sie könnte aber auch einlagig sein. Das Leistungsmodul mit den Leistungsbau¬ teilen 4 ist mit Isolationsmaterial der Basisleiterplatte 11 vollständig umschlossen und damit zusätzlich vor Umgebungs- einflüssen geschützt. Um den Wärmeabtransport von den Leis¬ tungsbauteilen 4 im Leistungsmodul in die Umgebung der Basisleiterplatte 11 optimal zu gestalten, wäre es denkbar, die Leiterbahnen 14 und das Isolationsmaterial der Basisleiterplatte 11 gemäß den Kupferlagen 2, 3 und dem Prepreg-Material 1 des erfindungsgemäßen Leistungsmoduls auszuführen. Das Leistungsmodul ist mit den Leiterbahnen 14 der Basisleiterplatte 11 ist mittels Durchkontaktierungen 12 elektrisch leitend verbunden. Diese Verbindung könnte aber auch mittels einer 5 shows a base circuit board 11 with conductor tracks 14, wherein a power module, as disclosed in FIGS. 3 and 4, is integrated in a not explicitly highlighted recess or cavity of the base circuit board 11. The base-conductor plate 11 is designed here as a multi-layer printed circuit board, but it could also be single-layer. The power module with the Leistungsbau ¬ share 4 is completely enclosed with insulating material of the base circuit board 11 and thus additionally protected from environmental influences. In order to optimally design the heat removal from the Leis ¬ processing components 4 in the power module in the vicinity of the base circuit board 11, it would be conceivable to design the conductor paths 14 and the insulating material of the base circuit board 11 in accordance with the copper layers 2, 3 and the prepreg material 1 of the power module of the invention , The power module is electrically conductively connected to the conductor tracks 14 of the base circuit board 11 by means of plated-through holes 12. This connection could also be by means of a
Stoffschlüssigen Verbindung wie Löten, Schweißen oder Kleben realisiert werden. Cohesive connection such as soldering, welding or gluing can be realized.
Fig. 6 zeigt eine Basisleiterplatte 11 wie in Fig. 5, wobei ein zusätzliches elektrisches Bauteil 13 auf einer Oberfläche der Basisleiterplatte 11 angeordnet ist und mit den Leistungs- bauteilen 4 im Leistungsmodul mittels der Durchkontaktierungen 12 elektrisch leitend verbunden ist. Das zusätzliche Bauteil 13 kann beispielsweise ein passives Bauteil, insbesondere ein Entstörkondensator sein, der in unmittelbarer Nähe eines Leistungsbauteils 4 angeordnet ist. Dadurch sind sehr kurze und niederimpedante Leitungswege geschaffen. 6 shows a base circuit board 11 as in FIG. 5, wherein an additional electrical component 13 is arranged on a surface of the base circuit board 11 and connected to the power components 4 in the power module by means of the vias 12 is electrically connected. The additional component 13 may, for example, be a passive component, in particular an interference suppression capacitor, which is arranged in the immediate vicinity of a power component 4. As a result, very short and low-impedance cable routes are created.
Fig. 7 zeigt eine Basisleiterplatte 11 wie in Fig. 6, wobei das zusätzliche elektrische Bauteil 13 im Leistungsmodul in un- mittelbarer Nähe eines Leistungsbauteils 4 angeordnet ist. Das zusätzliche elektrische Bauteil 13 könnte auch in der Isolationsschicht der Basisleiterplatte 11 außerhalb des Leistungsmoduls in unmittelbarer Nähe eines Leistungsbauteils 4 angeordnet sein. FIG. 7 shows a base circuit board 11 as in FIG. 6, wherein the additional electrical component 13 is arranged in the power module in the immediate vicinity of a power component 4. The additional electrical component 13 could also be arranged in the insulating layer of the base circuit board 11 outside the power module in the immediate vicinity of a power component 4.

Claims

Patentansprüche claims
1. Leistungsmodul mit mindestens einem Leistungsbauteil (4), integriert in eine Leiterplatte, wobei die Leiterplatte min- destens eine obere Kupferlage (2) und eine untere Kupferlage (3) umfasst und zwischen den beiden Kupferlagen (2, 3) elektrisch isolierendes Leiterplattenbasismaterial (1) angeordnet ist, wobei das Leiterplattenbasismaterial (1) ein mit Harz getränktes Glasfaserbasisgewebe, ein sogenanntes Prepreg-Material , ist und wobei das mindestens eine Leistungsbauteil (4) zwischen der oberen Kupferlage (2) und der unteren Kupferlage (3) vollständig mit Leiterplatten-basismaterial (1) umschlossen ist, 1. power module having at least one power component (4) integrated in a printed circuit board, wherein the printed circuit board at least one upper copper layer (2) and a lower copper layer (3) and between the two copper layers (2, 3) electrically insulating board base material ( 1), wherein the circuit board base material (1) is a resin impregnated fiberglass base cloth, a so-called prepreg material, and wherein the at least one power device (4) between the upper copper layer (2) and the lower copper layer (3) is completely covered with printed circuit boards Base material (1) is enclosed,
dadurch gekennzeichnet, dass characterized in that
die Kupferlagen (2, 3) eine Dicke im Bereich von bis zu 105ym aufweisen und das Prepreg-Material (1) als ein thermisches, mit Zusatzstoffen gefülltes Prepreg-Material mit einer Wärme¬ leitfähigkeit größer ~ 0,5 W/mK ausgeführt ist. the copper layers (2, 3) have a thickness in the range of up to 105ym and the prepreg material (1) is designed as a thermal, filled with additives prepreg material having a heat ¬ conductivity greater than 0.5 W / mK.
2. Leistungsmodul (4) gemäß Anspruch 1, dadurch gekennzeichnet, dass das Leistungsbauteil (4) als Bauteil (4) mit Gehäuse oder als Bauteil (4) ohne Gehäuse, als sogenanntes bare-die, aus¬ geführt ist. 2. Power module (4) according to claim 1, characterized in that the power component (4) as a component (4) with housing or as a component (4) without housing, as so-called bare-the, from ¬ out.
3. Leistungsmodul (4) gemäß einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das Leistungsbauteil (4) mittels wenigstens einer Durchkontaktierung (12) und/ oder einer elektrisch leitenden Verbindungsschicht (5) mit der oberen Kupferlage (2) und/ oder der unteren Kupferlage (3) elektrisch leitend verbunden ist. 3. Power module (4) according to one of the preceding claims, characterized in that the power component (4) by means of at least one via (12) and / or an electrically conductive connection layer (5) with the upper copper layer (2) and / or the lower Copper layer (3) is electrically connected.
4. Leistungsmodul (4) gemäß einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die untere Kupferlage (3) als Kupferblech, ein sogenanntes Kupferleadframe, oder als Kup¬ ferlaminatfolie ausgeführt ist. 4. power module (4) according to one of the preceding claims, characterized in that the lower copper layer (3) is designed as a copper sheet, a so-called Kupferleadframe, or as Kup ¬ ferlaminatfolie.
5. Leistungsmodul gemäß einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterplatte als Mehrlagen¬ leiterplatte ausgeführt ist. 5. Power module according to one of the preceding claims, characterized in that the circuit board is designed as a multilayer ¬ printed circuit board.
6. Leistungsmodul gemäß einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die zusätzlichen Füllstoffe in dem thermischen Prepreg-Material (1) anorganische Partikel aus Aluminiumoxid sind. 6. Power module according to one of the preceding claims, characterized in that the additional fillers in the thermal prepreg material (1) are inorganic particles of aluminum oxide.
7. Leistungsmodul gemäß einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterplatte als Leiterplatte einer KFZ-Getriebesteuerung ausgeführt ist. 7. Power module according to one of the preceding claims, characterized in that the circuit board is designed as a printed circuit board of a vehicle transmission control.
8. Basisleiterplatte (11), dadurch gekennzeichnet, dass ein Leistungsmodul gemäß einem der Ansprüche 1 bis 7 in einer Kavität der Basisleiterplatte (11) angeordnet ist. 8. base circuit board (11), characterized in that a power module according to one of claims 1 to 7 in a cavity of the base circuit board (11) is arranged.
9. Basisleiterplatte (11) gemäß Anspruch 8, dadurch gekenn¬ zeichnet, dass das Leistungsmodul mit der Basisleiterplatte (11) mittels Löten, Schweißen, Kleben oder elektrische Ankontak- tierungen in Form von Mikrovias elektrisch leitend verbunden ist . 9. base circuit board (11) according to claim 8, characterized marked ¬ characterized in that the power module with the base circuit board (11) by means of soldering, welding, gluing or electrical Ankontak- tions in the form of microvias is electrically connected.
10. Basisleiterplatte (11) gemäß Anspruch 8 oder 9, dadurch gekennzeichnet, dass mindestens ein zusätzliches elektrisches Bauteil (13) in unmittelbarer Nähe eines Leistungsbauteils (4), mit diesem Leistungsbauteil (4) elektrisch leitend verbunden, entweder auf einer Oberfläche der Basisleiterplatte, in der Basisleiterplatte oder im Leistungsmodul angeordnet ist. 10. The base circuit board (11) according to claim 8 or 9, characterized in that at least one additional electrical component (13) in the immediate vicinity of a power component (4), with this power component (4) electrically connected, either on a surface of the base circuit board, is arranged in the base circuit board or in the power module.
11. Basisleiterplatte (11) gemäß einem der Ansprüche 8 bis 10, dadurch gekennzeichnet, dass die Basisleiterplatte als Lei¬ terplatte einer KFZ-Getriebesteuerung ausgeführt ist. 11. Base circuit board (11) according to one of claims 8 to 10, characterized in that the base circuit board is designed as Lei ¬ terplatte a vehicle transmission control.
PCT/EP2015/053542 2014-03-12 2015-02-19 Power component integrated into a circuit board WO2015135734A1 (en)

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