DE10250697A1 - Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink - Google Patents

Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink Download PDF

Info

Publication number
DE10250697A1
DE10250697A1 DE10250697A DE10250697A DE10250697A1 DE 10250697 A1 DE10250697 A1 DE 10250697A1 DE 10250697 A DE10250697 A DE 10250697A DE 10250697 A DE10250697 A DE 10250697A DE 10250697 A1 DE10250697 A1 DE 10250697A1
Authority
DE
Germany
Prior art keywords
circuit board
heat
printed circuit
power electronics
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10250697A
Other languages
German (de)
Inventor
Ludwig Schulze Gronover
Joachim Brune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
Original Assignee
Hella KGaA Huek and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hella KGaA Huek and Co filed Critical Hella KGaA Huek and Co
Priority to DE10250697A priority Critical patent/DE10250697A1/en
Publication of DE10250697A1 publication Critical patent/DE10250697A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

A circuit board for a power electronics component (4) that is mounted on the board using surface mounted device (SMD) technology. The circuit board has upper and lower conduction tracks (3.1, 3.2) and at least one through contact (5) with which the tracks are directly contacted. The tracks serve to conduct heat away from the component. The lower track (3.2) is divided by an electrically insulating section (6).

Description

Die Erfindung betrifft eine Leiterplatte gemäß dem Oberbegriff des Anspruchs 1.The invention relates to a printed circuit board according to the generic term of claim 1.

Leiterplatten sind als elektrische oder elektronische Komponenten für z.B. Steuerungen bekannt und werden unter anderem in Kraftfahrzeugen eingesetzt.Printed circuit boards are considered electrical or electronic components for e.g. Controls are known and used, among other things, in motor vehicles.

Aus der DE 43 45 946 A1 ist eine Anordnung bestehend aus einer Leiterplatte mit mindestens einem Leistungsbauelement bekannt, das auf einer zugehörigen Lotfläche befestigt ist. Es ist mindestens eine Durchkontaktierung zur Wärmeableitung vom Leistungsbauelement zu einer Wärmesenke angeordnet, wobei die Durchkontaktierung außerhalb der Lotfläche ausgebildet ist. Zwischen dem Leistungsbauelement und der Wärmesenke besteht mindestens eine elektrisch isolierende Unterbrechung. Nachteil dieser Anordnung ist, dass das Material der elektrisch isolierenden Unterbrechung schlechter wärmeleitend ist als z.B. die Lotfläche. Daher wird der Wärmefluss zu der Durchkontaktierung behindert.From the DE 43 45 946 A1 an arrangement consisting of a printed circuit board with at least one power component is known, which is attached to an associated solder surface. At least one via for heat dissipation from the power component to a heat sink is arranged, the via being formed outside the solder surface. There is at least one electrically insulating interruption between the power component and the heat sink. The disadvantage of this arrangement is that the material of the electrically insulating interruption is less thermally conductive than, for example, the solder surface. Therefore, the heat flow to the via is blocked.

Aufgabe der Erfindung ist es, eine Leiterplatte zu schaffen, bei der die Wärme von einem Leistungsbauteil, z.B. einem Halbleiter oder einem Widerstand, ungehindert zu einer Wärmesenke abgeleitet wird.The object of the invention is a To create a circuit board in which the heat from a power component, e.g. a semiconductor or a resistor, unhindered to one heat sink is derived.

Die Aufgabe ist durch die kennzeichnenden Merkmale des Anspruchs 1 gelöst. Dadurch, dass die Leiterbahnen unmittelbar mit der Durchkontaktierung verbunden sind und dass die untere Leiterbahn durch eine elektrische Isolierung getrennt ist, wird die vom Leistungsbauteil erzeugte Wärme direkt in die Durchkontaktierung und weiter in die untere Leiterbahn geleitet. Die Wärmeableitung erfolgt also nur durch Metalle, die eine bessere Wärmeleitung aufweisen als die bei Leiterplatten eingesetzten elektrisch isolierenden Werkstoffe.The task is due to the characteristic features of claim 1 solved. The fact that the conductor tracks are connected directly to the plated-through hole are and that the lower trace by electrical insulation is separated, the heat generated by the power component is direct routed into the via and further into the lower conductor track. The heat dissipation is only done by metals that have better heat conduction have as the electrically insulating used in printed circuit boards Materials.

Die Unteransprüche betreffen die vorteilhafte Ausgestaltung der Erfindung.The subclaims relate to the advantageous embodiment the invention.

Wenn wie nach Anspruch 2 die elektrische Isolierung auf oder kurz beabstandet zu einer Mittelachse der unteren Leiterbahn verläuft, erfolgt die Wärmeableitung weitgehend symmetrisch und somit gleichmäßig.If as according to claim 2, the electrical insulation on or a short distance from a central axis of the lower conductor track runs, the heat is dissipated largely symmetrical and therefore even.

Die Füllung der Durchkontaktierung mit Lötzinn nach Anspruch 3 bewirkt einen höheren Wärmefluss durch die Durchkontaktierung.The filling of the via with solder according to claim 3 causes a higher heat flow through the via.

Die Erfindung wird anhand des in der Zeichnung vereinfacht dargestellten Ausführungsbeispiels näher erläutert. Es zeigenThe invention is based on the in the drawing, illustrated in simplified form, the embodiment. It demonstrate

1 einen Teil einer Leiterplatte vergrößert senkrecht von oben und 2 einen Schnitt gemäß 1. 1 part of a circuit board enlarged vertically from above and 2 a cut according to 1 ,

Wie aus den Figuren ersichtlich besteht eine Leiterplatte 1 aus einer Platte 2 mit darauf befestigten Leiterbahnen 3, 3.1, 3.2 und mindestens einem Leistungsbauteil 4.As can be seen from the figures, there is a printed circuit board 1 from a plate 2 with conductor tracks attached to it 3 . 3.1 . 3.2 and at least one power component 4 ,

Die Platte 2 besteht wie bekannt aus isolierendem Material wie z.B. Keramik oder Kunststoff. In die Platte 2 sind entsprechend den Erfordernissen durchgehende, senkrecht zu den Hauptflächen verlaufende Bohrungen eingelassen.The plate 2 consists, as is known, of insulating material such as ceramic or plastic. In the plate 2 are drilled through, perpendicular to the main surfaces, according to the requirements.

Auf beiden Hauptflächen, das heißt auf den Oberflächen der Platte 2, die sich gegenüberliegen und am größten sind, sind die Leiterbahnen 3, 3.1, 3.2 aus z.B. Kupfer, die Kontaktflächen und/oder flächige Schichten wie die Leiterbahnen 3.1, 3.2 sowie bahnförmige Schichten wie die Leiterbahn 3 umfassen, unlösbar befestigt. Jede Leiterbahn 3, 3.1, 3.2 hat eine Dicke von ca. 20 – 400 μm.On both main surfaces, i.e. on the surfaces of the plate 2 that are opposite and largest are the traces 3 . 3.1 . 3.2 made of copper, for example, the contact surfaces and / or flat layers such as the conductor tracks 3.1 . 3.2 as well as sheet-like layers like the conductor track 3 include, permanently attached. Every trace 3 . 3.1 . 3.2 has a thickness of approx. 20 - 400 μm.

Auf zwei flächig ausgebildeten oberen Leiterbahnen 3.1 ist ein Leistungsbauteil 4, hier ein Widerstand, in SMD (Surface Mounted Device) – Technik, das heißt auf einer Oberfläche der Leiterplatte 1, befestigt. Auf der dem Leistungsbauteil 4 gegenüberliegenden Oberfläche der Platte 2 ist eine weitere flächig ausgebildete, untere Leiterbahn 3.2 angeordnet, die den oberen Leiterbahnen 3.1 genau gegenüberliegt. Jede Fläche dieser gegenüberliegenden Leiterbahnen 3.1, 3.2 ist größer als die mit der Leiterplatte 1 in Kontakt stehende Fläche des Leistungsbauteils 4.On two flat upper traces 3.1 is a power component 4 , here a resistor, in SMD (Surface Mounted Device) technology, that is, on a surface of the circuit board 1 , attached. On the power component 4 opposite surface of the plate 2 is another flat, lower conductor track 3.2 arranged that the upper conductor tracks 3.1 is exactly opposite. Any surface of these opposite traces 3.1 . 3.2 is larger than that with the circuit board 1 contact surface of the power component 4 ,

Die Leiterbahnen 3.1, 3.2 sind durch herkömmliche Durchkontaktierungen 5 in den entsprechenden Bohrungen elektrisch und thermisch leitend verbunden. Die Durchkontaktierungen 5 sind mit Lötzinn gefüllt.The conductor tracks 3.1 . 3.2 are through conventional vias 5 electrically and thermally conductively connected in the corresponding holes. The vias 5 are filled with solder.

Die untere Leiterbahn 3.2 ist durch eine elektrische Isolierung 6 getrennt. Diese verläuft längs einer Mittelachse der unteren Leiterbahn 3.2. Die Isolierung 6 ist in diesem Beispiel als Trennung der Leiterbahn 3.2, das heißt als ein länglicher schmaler Streifen ohne Material, ausgeführt und verhindert einen Kurzschluss zwischen unterschiedliche Potentiale führenden Leiterbahnen bzw. mit einer Wärmesenke.The lower trace 3.2 is through electrical insulation 6 Cut. This runs along a central axis of the lower conductor track 3.2 , The insulation 6 is in this example as a separation of the conductor track 3.2 , that is to say as an elongated narrow strip without material, and prevents a short circuit between conductor tracks carrying different potentials or with a heat sink.

In direktem Kontakt mit der unteren Leiterbahn 3.2 steht die nicht dargestellte Wärmesenke, die die Wärme sicher ableitet. Die Wärmesenke ist z.B. ein Teil eines Gehäuses.In direct contact with the lower trace 3.2 stands the heat sink, not shown, which safely dissipates the heat. The heat sink is part of a housing, for example.

Die Herstellung der Leiterplatte 1 erfolgt wie üblich für SMD- Leiterplatten mit dem Unterschied, dass die unteren Leiterbahnen 3.2 in zwei elektrisch voneinander isolierte Teile aufgeteilt werden. Die Durchkontaktierungen 5 werden durch z.B. Wellenlöten mit dem Lötzinn gefüllt.The manufacture of the circuit board 1 is done as usual for SMD circuit boards with the difference that the lower conductor tracks 3.2 be divided into two electrically insulated parts. The vias 5 are filled with solder, for example by wave soldering.

Im Betrieb erzeugt das Leistungsbauteil 4 Wärme. Diese wird über die oberen Leiterbahnen 3.1 durch die Durchkontaktierungen 5 in die untere Leiterbahn 3.2 abgeleitet und von hier von der Wärmesenke übernommen. Die Wärmesenke strahlt die Wärme z.B. in die Umgebung ab.The power component generates during operation 4 Warmth. This is over the top traces 3.1 through the vias 5 in the lower lei terbahn 3.2 derived and taken from here by the heat sink. The heat sink radiates heat, for example, into the environment.

Claims (3)

Leiterplatte, mit mindestens einem Leistungsbauteil, das in SMD- Technik auf der Leiterplatte befestigt ist, mit mindestens einer oberen wärmeableitenden, auf der einen Seite der Leiterplatte angeordneten Leiterbahn, auf der das Leistungsbauteil befestigt ist, mit einer unteren wärmeableitenden Leiterbahn auf der anderen Seite der Leiterplatte, mit mindestens einer Durchkontaktierung zur Wärmeableitung, wobei die Durchkontaktierung seitlich beabstandet vom Leistungsbauteil ausgebildet ist und mit einer elektrischen Isolierung, dadurch gekennzeichnet, dass die Leiterbahnen (3.1, 3.2) unmittelbar mit der Durchkontaktierung (5) verbunden sind und dass die untere Leiterbahn (3.2) durch eine elektrische Isolierung (6) getrennt ist.Printed circuit board, with at least one power component, which is attached to the printed circuit board using SMD technology, with at least one upper heat-dissipating conductor track arranged on one side of the printed circuit board, on which the power component is fastened, with a lower heat-dissipating conductor track on the other side of the Printed circuit board, with at least one through hole for heat dissipation, the through hole being laterally spaced from the power component and with electrical insulation, characterized in that the conductor tracks ( 3.1 . 3.2 ) directly with the via ( 5 ) are connected and that the lower conductor track ( 3.2 ) by electrical insulation ( 6 ) is separated. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, dass die elektrische Isolierung auf oder kurz beabstandet zu einer Mittelachse der unteren Leiterbahn (3.2) verläuft.Printed circuit board according to claim 1, characterized in that the electrical insulation on or a short distance from a central axis of the lower conductor track ( 3.2 ) runs. Leiterplatte nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Durchkontaktierung (5) mit Lötzinn gefüllt ist.Printed circuit board according to claim 1 or 2, characterized in that the plated-through hole ( 5 ) is filled with solder.
DE10250697A 2002-10-31 2002-10-31 Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink Withdrawn DE10250697A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10250697A DE10250697A1 (en) 2002-10-31 2002-10-31 Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10250697A DE10250697A1 (en) 2002-10-31 2002-10-31 Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink

Publications (1)

Publication Number Publication Date
DE10250697A1 true DE10250697A1 (en) 2004-05-13

Family

ID=32103203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10250697A Withdrawn DE10250697A1 (en) 2002-10-31 2002-10-31 Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink

Country Status (1)

Country Link
DE (1) DE10250697A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005014413A1 (en) * 2005-03-24 2006-09-28 Conti Temic Microelectronic Gmbh Arrangement for heat dissipation
GB2426386A (en) * 2005-05-13 2006-11-22 Lear Corp Cooling a component mounted on a PCB
EP1962566A3 (en) * 2007-02-22 2010-01-20 SIIX Corporation Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
CN110381662A (en) * 2019-06-12 2019-10-25 浙江达峰科技有限公司 Frequency converter mounts part cooling mechanism and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4302917C1 (en) * 1993-02-03 1994-07-07 Bosch Gmbh Robert Arrangement for heat dissipation of power components mounted on printed circuit boards
DE4326506A1 (en) * 1993-08-06 1995-02-09 Bosch Gmbh Robert Electrical appliance, in particular a switching device or controller for motor vehicles

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4302917C1 (en) * 1993-02-03 1994-07-07 Bosch Gmbh Robert Arrangement for heat dissipation of power components mounted on printed circuit boards
DE4326506A1 (en) * 1993-08-06 1995-02-09 Bosch Gmbh Robert Electrical appliance, in particular a switching device or controller for motor vehicles

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
NÜHRMANN,Dieter: Das große Werkbuch Elektronik, Franzis' Verlag GmbH, Poing, 1998, 4.Aufl., ISBN 3-7723-6547-7, S.518-523 *
NÜHRMANN,Dieter: Das große Werkbuch Elektronik, Franzis' Verlag GmbH, Poing, 1998, 4.Aufl., ISBN 3-7723-6547-7, S.518-523;
TRAISTER,John E.: Design guidelines for surface mount technology, Academic Press, Inc., 1990, ISBN 0-12-697400-4, S.56-67 *
TRAISTER,John E.: Design guidelines for surface mount technology, Academic Press, Inc., 1990, ISBN 0-12-697400-4, S.56-67;

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005014413A1 (en) * 2005-03-24 2006-09-28 Conti Temic Microelectronic Gmbh Arrangement for heat dissipation
GB2426386A (en) * 2005-05-13 2006-11-22 Lear Corp Cooling a component mounted on a PCB
EP1962566A3 (en) * 2007-02-22 2010-01-20 SIIX Corporation Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices
EP2244541A1 (en) * 2007-02-22 2010-10-27 SIIX Corporation Surface mount circuit board, method for manufacturing a surface mount circuit board, and method for mounting surface mount electronc devices
CN110381662A (en) * 2019-06-12 2019-10-25 浙江达峰科技有限公司 Frequency converter mounts part cooling mechanism and preparation method thereof
CN110381662B (en) * 2019-06-12 2020-10-02 浙江达峰科技有限公司 Heat dissipation mechanism for frequency converter mounting part and manufacturing method thereof

Similar Documents

Publication Publication Date Title
EP0920055B1 (en) Cooling device for a heat generating component on a printed board
DE102006027482B3 (en) Housed semiconductor circuit arrangement e.g. power semiconductor module, has two conductive layers with contact device to joint surface of semiconductor component, where part of conductive layers is part of another contact device
DE102013213448B4 (en) Electronic assembly with power semiconductor
DE10306643B4 (en) Arrangement in pressure contact with a power semiconductor module
DE102006015198A1 (en) Connecting device for electronic components
DE19855389A1 (en) Electronic device
DE4332115B4 (en) Arrangement for cooling at least one heat sink printed circuit board
DE102006025531A1 (en) Converter module
DE102014218240A1 (en) Power component integrated in a printed circuit board
DE102008019797B4 (en) Cooling arrangement and inverter
DE3305167C2 (en) Electrical circuit arrangement with a circuit board
DE10141114C1 (en) Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink
DE102012206505A1 (en) Electronic device for use in vehicle, has heat reception passage formed in wiring pattern of board with potential as other wiring pattern and lying opposite to heat radiation passage over isolation portion of boards in transverse manner
DE10250697A1 (en) Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink
DE4416403A1 (en) Cooling system for printed circuit board
DE102012202562A1 (en) MULTILAYER CONDUCTOR PLATE
DE202016101292U1 (en) Power semiconductor device
DE3903615A1 (en) Electrical printed circuit board
DE102013104237B4 (en) circuitry
DE102018124186A1 (en) Electronic device and arrangement of such on a mounting rail
DE19928576C2 (en) Surface mountable LED device with improved heat dissipation
WO2017054981A1 (en) Electronic module for a transmission controller
DE102018111534A1 (en) Device for dissipating heat from a printed circuit board
DE102007039800B3 (en) Cooling device for electronic component, has interconnected device with end-sided connection section and carrying section of electronic component, and two sections are connected together by narrow bridge-shaped section
WO2022053397A1 (en) Printed circuit board and circuit arrangement

Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: HELLA KGAA HUECK & CO., 59557 LIPPSTADT, DE

8139 Disposal/non-payment of the annual fee