DE102007021740A1 - Leiterplatte mit integriertem Pressfit-Pin - Google Patents

Leiterplatte mit integriertem Pressfit-Pin Download PDF

Info

Publication number
DE102007021740A1
DE102007021740A1 DE200710021740 DE102007021740A DE102007021740A1 DE 102007021740 A1 DE102007021740 A1 DE 102007021740A1 DE 200710021740 DE200710021740 DE 200710021740 DE 102007021740 A DE102007021740 A DE 102007021740A DE 102007021740 A1 DE102007021740 A1 DE 102007021740A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
pressfit
inner layer
pressfit pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200710021740
Other languages
German (de)
English (en)
Inventor
Thomas Preuschl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Priority to DE200710021740 priority Critical patent/DE102007021740A1/de
Priority to PCT/EP2008/055766 priority patent/WO2008138898A1/fr
Publication of DE102007021740A1 publication Critical patent/DE102007021740A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE200710021740 2007-05-09 2007-05-09 Leiterplatte mit integriertem Pressfit-Pin Withdrawn DE102007021740A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200710021740 DE102007021740A1 (de) 2007-05-09 2007-05-09 Leiterplatte mit integriertem Pressfit-Pin
PCT/EP2008/055766 WO2008138898A1 (fr) 2007-05-09 2008-05-09 Plaquette comportant une broche à ajustement pressé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200710021740 DE102007021740A1 (de) 2007-05-09 2007-05-09 Leiterplatte mit integriertem Pressfit-Pin

Publications (1)

Publication Number Publication Date
DE102007021740A1 true DE102007021740A1 (de) 2008-11-13

Family

ID=39772972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200710021740 Withdrawn DE102007021740A1 (de) 2007-05-09 2007-05-09 Leiterplatte mit integriertem Pressfit-Pin

Country Status (2)

Country Link
DE (1) DE102007021740A1 (fr)
WO (1) WO2008138898A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014202910A1 (de) * 2014-02-18 2015-08-20 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung eines Kraftfahrzeugs

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120781A (ja) * 1987-10-31 1989-05-12 Taiyo Yuden Co Ltd 多層配線基板モジュール
US5386085A (en) * 1991-10-31 1995-01-31 Hughes Aircraft Company Multilayer electrical circuit structure including partially embedded pins for external connection
EP0752739A1 (fr) * 1995-07-03 1997-01-08 Berg Electronics Manufacturing B.V. Connecteur, de préférence connecteur à angle droit, avec assemblage intégré de circuit imprimé
DE29700703U1 (de) * 1997-01-16 1998-05-14 Bosch Gmbh Robert Einrichtung zur Kontaktierung elektrischer Bauelemente
US6554654B1 (en) * 2001-12-31 2003-04-29 Hewlett-Packard Development Company, L.P. Multi-pin edge connector for circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050919A (ja) * 1996-07-31 1998-02-20 Oki Electric Ind Co Ltd クリップリード端子束、クリップリード端子の接続方法、リード端子接続用基板およびリード端子付き基板の製造方法
US7227758B2 (en) * 2003-07-21 2007-06-05 Delphi Technologies, Inc. Printed circuit board assembly with integrated connector
US7297875B2 (en) * 2004-04-27 2007-11-20 Merrimac Industries, Inc. Fusion bonded assembly with attached leads
JP4686218B2 (ja) * 2005-03-11 2011-05-25 矢崎総業株式会社 メタルコア基板及びこれを利用した車載システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120781A (ja) * 1987-10-31 1989-05-12 Taiyo Yuden Co Ltd 多層配線基板モジュール
US5386085A (en) * 1991-10-31 1995-01-31 Hughes Aircraft Company Multilayer electrical circuit structure including partially embedded pins for external connection
EP0752739A1 (fr) * 1995-07-03 1997-01-08 Berg Electronics Manufacturing B.V. Connecteur, de préférence connecteur à angle droit, avec assemblage intégré de circuit imprimé
DE29700703U1 (de) * 1997-01-16 1998-05-14 Bosch Gmbh Robert Einrichtung zur Kontaktierung elektrischer Bauelemente
US6554654B1 (en) * 2001-12-31 2003-04-29 Hewlett-Packard Development Company, L.P. Multi-pin edge connector for circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014202910A1 (de) * 2014-02-18 2015-08-20 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung eines Kraftfahrzeugs

Also Published As

Publication number Publication date
WO2008138898A1 (fr) 2008-11-20

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OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee