WO2008134965A1 - Module et ensemble électrique - Google Patents

Module et ensemble électrique Download PDF

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Publication number
WO2008134965A1
WO2008134965A1 PCT/CN2008/070801 CN2008070801W WO2008134965A1 WO 2008134965 A1 WO2008134965 A1 WO 2008134965A1 CN 2008070801 W CN2008070801 W CN 2008070801W WO 2008134965 A1 WO2008134965 A1 WO 2008134965A1
Authority
WO
WIPO (PCT)
Prior art keywords
positioning
substrate
pin
pin structure
module
Prior art date
Application number
PCT/CN2008/070801
Other languages
English (en)
Chinese (zh)
Inventor
Songbai Chen
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Publication of WO2008134965A1 publication Critical patent/WO2008134965A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits

Definitions

  • the invention relates to the field of electronic technology, and in particular to a module and an electronic component. Background technique
  • High-density miniaturization is the trend of electronic products development, and it is also a challenge that the electronic assembly process has always faced.
  • Increasing the layout density of single-board has become a necessary condition for electronic products to achieve high-density miniaturization, and some common circuits on the circuit board, especially in one piece.
  • the circuit unit that is repeated many times on the motherboard is integrated into the module and then assembled to the motherboard as a conventional device. In this way, not only the three-dimensional space is fully utilized, the floor space is reduced, but the assembly efficiency and quality are improved while the layout density is increased, and the production cost is reduced.
  • a module is neither a special semiconductor device nor a passive component.
  • the module is an integrated circuit component that includes a variety of devices designed according to the principles of optimized circuit and system structure. Broadly speaking, modular technology can be understood as a single unit that integrates different component packages.
  • the module itself requires one assembly and a secondary assembly that is mounted to the motherboard. According to the module's secondary assembly on the motherboard, the module can be divided into vertical module and horizontal module.
  • the vertical module can effectively utilize the three-dimensional space of the single board, but the existing vertical modules are mostly based on a single-row pin structure, so that the number of I/O ports derived in a limited space is naturally small. Restrict the bottleneck of module circuit integration.
  • FIG. 1 is a schematic diagram of the outline and pin of a conventional vertical single-row in-line module.
  • a plurality of pins 111 (also referred to as pins) functioning as an I/O connection and supporting before assembly are They are injection molded together and then assembled as a unit to the module substrate 112.
  • the secondary assembly generally adopts the process of wave soldering or through-hole reflow soldering to realize the connection between the vertical module 11 and the motherboard 12.
  • the vertical module 11 is also provided with components 113 on the vertical module, and the mother board is also provided with a mother.
  • the pins are in a single row and are located on one side of the module. After the assembly is completed, one pin realizes an I/O port connection.
  • the inventors have found that at least the following problems exist in the prior art, that a single row of pins makes the number of pins available for deriving an I/O port small, which limits the high integration of the module circuit. development of.
  • the design of the pin-in pins reduces the surface mount rate of the entire board.
  • the assembly of the plug-in module requires a hole in the motherboard and a large via hole, which is disadvantageous for the increase in the wiring density on the board.
  • FIG. 2 is a schematic view of the shape and pin of the conventional vertical single-row surface mount module.
  • a plurality of pairs of pins 111 are connected by connecting strips 22 at both ends before one assembly, and a pair of connections are shown in FIG.
  • the pin 21 is integrated into the module substrate 112 as a whole.
  • the secondary assembly generally uses a reflow soldering process to connect the module to the motherboard.
  • the I/O connection and support pins have the left and right wings on the two sides of the module, the two wings of the pair of pins are connected together, and only one I/O port can be realized after the assembly is completed. Connection.
  • the inventors have found that at least the following problems exist in the prior art, the surface mount pins on the left and right sides of the module are actually integrated, and the number of pins that can be used to derive the I/O port is still small. If you want to increase the number of I/O ports of the circuit, you must increase the size of the module board, which increases the floor space and limits the development of high integration of the module circuit.
  • the embodiments of the present invention provide a module and an electronic component, which can improve the integration degree of the module circuit and improve the coplanarity of the pins.
  • an embodiment of the present invention provides a module including a substrate and a pin structure
  • the pin structure comprises a pin and a pin carrier; each pin is mounted on the pin carrier independently of each other; the pin carrier is provided with a positioning post for passing through the substrate Positioning holes enable assembly with the substrate;
  • the pin structure is at least two, respectively disposed on two sides of the substrate for connecting the motherboard and the substrate;
  • a positioning hole corresponding to the positioning post disposed on the lead structure is disposed on the substrate, and the pin structure is assembled through the positioning hole; the positioning holes on the substrate are located on the same straight line.
  • an embodiment of the present invention provides an electronic component including a module and a motherboard;
  • the module includes a substrate and a pin structure
  • the pin structure includes a pin and a pin carrier; the pins are mounted on the pin carrier independently of each other; the pin structure is at least two, respectively disposed on both sides of the substrate for connecting the mother a plate and the substrate;
  • the pin carrier is provided with at least two positioning posts, and the positioning hole corresponding to the positioning post disposed on the lead structure is disposed on the substrate, and the positioning holes on the substrate are located on the same straight line; A positioning post on the pin carrier is assembled with the substrate through the positioning hole.
  • FIG. 1 is a schematic view of a shape and a pin of a conventional vertical single-row in-line module
  • FIG. 2 is a schematic view of a shape and a pin of a conventional vertical single-row surface mount module
  • FIG. 3 is a schematic view showing an embodiment of a module and a pin of the present invention.
  • FIG. 4 is a schematic view of an embodiment of a module assembled to a motherboard of the present invention.
  • Figure 5 is a front elevational view of a modular embodiment of the present invention after assembly
  • FIG. 6a-6b are schematic views of the assembly of the positioning post at the A section of Fig. 5;
  • 6c-6d are schematic views of the assembly of the positioning post at the B section of Fig. 5;
  • FIG. 7a-7d are schematic views showing an example of a pin shape in a module embodiment of the present invention.
  • Fig. 8 is a schematic view showing an embodiment of a positioning post structure on a pin structure in a module embodiment of the present invention.
  • FIG. 9a-Fig. 9b are schematic views showing the assembly of the positioning post at the B section of Fig. 5 when the positioning post structure shown in Fig. 8 is used;
  • Figure 11 is a schematic illustration of a double row pin lead vertical module. detailed description
  • a module 11 of the present invention mainly comprises a substrate 1, a pin structure 3.
  • the pin structure 3 includes a pin 4 and a pin carrier 0; each of the pins 4 is mounted on the pin carrier 0 independently of each other; the pin structure 3 is at least two, respectively disposed on both sides of the substrate 1. , for connecting the substrate 1 and the motherboard 12;
  • the pin carrier 0 is provided with at least two positioning posts 6 .
  • the substrate 1 is provided with a positioning hole 7 corresponding to the positioning post 6 disposed on the lead structure 3 , and the positioning hole 7 on the substrate 1 is located On the same line;
  • the positioning post 6 on the lead carrier 0 is assembled with the substrate 1 through the positioning hole 7.
  • the lead structure 3 can further be provided with a boss 5 for a patch for one assembly, and the positioning post 6 can be disposed on the boss 5.
  • FIG. 3 is a schematic diagram of an embodiment of a module and a pin of the present invention.
  • the embodiment is a vertical double-row surface mount module, which mainly includes: a substrate 1, two pin structures 3; and a cap 9 may also be included.
  • Each of the pin structures 3 includes: a pin 4, a pin carrier 0, in this embodiment, a pin 5 is disposed on the pin carrier 0, and the positioning post 6 is disposed on the boss 5;
  • the substrate 1 includes: a positioning hole 7 corresponding to the positioning posts of the two ends, and a positioning hole 8 corresponding to the intermediate positioning column; and the component 2 on the substrate may also be included.
  • the pin 4 is a surface mount metal pin, which is disposed on each of the pin structures 3, and the pins are independent of each other, and the pin structures on both sides of the substrate 1 are also independent of each other, and can be connected differently. I/O port.
  • Each of the lead structures 3 has two positioning posts 6 each, wherein one of the two positioning posts 6 of each of the pin structures 3 is disposed on the boss 5 of one of the two ends of the pin structure 3, and If one of the lead structures 5 has a positioning post on one of the bosses 5, the post 5 of the corresponding end of the other pin structure 3 is not provided with a post;
  • the other of the two positioning posts 6 of each of the above-described pin structures 3 is disposed on the boss 5 at the intermediate position of each of the pin structures 3.
  • the positioning post on the boss 5 located at the intermediate position of the pin structure 3 is slightly offset from the midpoint position, which is offset from the position of the positioning post on the boss 5 at the intermediate position of the other pin structure 3, so as to position the two positions during mounting.
  • the columns do not interfere with each other.
  • the size, shape and material of the positioning post 6 depend on the actual structural requirements, such as a cylindrical shape, and the length of the cylinder is not greater than the thickness of the substrate. It should be noted that the shape of the positioning post is merely an example, and is not used to define the shape of the positioning post, for example, the shape of the cubic column, the special shape, and the like; The material is not limited to the same material as the lead carrier, such as a metal harpoon lock.
  • Positioning holes 6 on the corresponding pin structures 3 on the substrate 1 are respectively provided with at least three positioning holes on the same horizontal line, wherein the openings at the two ends of the substrate corresponding to the positions of the positioning posts are positioned at corresponding ends
  • the positioning hole 7 of the column and the opening corresponding to the position of the positioning column in the middle are positioning holes 8 corresponding to the intermediate positioning column.
  • the positioning hole 7 corresponding to the positioning posts of the two ends may be a circular hole or a waist hole, etc.; the positioning hole 8 corresponding to the intermediate positioning column is a waist hole, and cooperates with two positioning posts in the middle of the double-sided pin structure 3,
  • the waist hole is in a horizontal direction parallel to the bottom end of the substrate 1.
  • the shape of the positioning hole is merely an example, and is not used to define the shape of the positioning hole. For example, it may be a quadrilateral such as a rectangle, a square, a profiled shape, or the like.
  • the positions of the positioning post and the positioning hole are not limited to the positions shown in FIG. 3, as long as the positioning holes are located on the same horizontal line, the substrate and the motherboard can be stably assembled, and how many positioning columns and positioning are set. It is another technical problem in the art to determine the position of the hole and the position to stabilize the substrate and the mother board, and is not related to the present invention, and therefore will not be described in detail herein.
  • FIG. 4 is a schematic view of an embodiment of assembly of a module of the present invention.
  • the metal pin adopts a surface mount design, and a plurality of pins are Plastically sealed together, the injection mold is manufactured into a lead plastic body and assembled as a whole onto the module substrate.
  • the lead plastic sealing material is an insulating, high temperature resistant, antistatic material.
  • the bottoms of all pins 4 are on the same plane to ensure the quality of the electrical and mechanical connections when assembled to the motherboard substrate. If the surface-mount pins on both sides of the substrate are the same, it is only necessary to open the mold once.
  • the boss 5 in the middle portion of the lead molding body can be used for the patch at the time of assembly, and the size of the suction surface 10 satisfies the pick-up requirement of the placement machine.
  • a card cap 9 for secondary assembly of the patch is mounted on the top of the substrate.
  • the assembly of the vertical double-row surface mount module includes one assembly and two assembly.
  • FIG. 5 is a front view of a module embodiment of the present invention assembled once.
  • the method of assembling once is: mounting the device on the one side of the module substrate while mounting the pin structure, and the positioning post on the lead plastic body is inserted into the positioning hole at the corresponding position on the module substrate, and the length of the positioning column is not greater than the thickness of the substrate, The solder printing process on the other side is ensured; likewise, when the device is mounted on the other side of the module substrate, the positioning post on the lead plastic body is inserted into the remaining two positioning holes of the substrate to complete the positioning, and then reflow soldering is performed to complete the assembly. .
  • the module is assembled to the motherboard through the surface mount pin structure on the module, and the secondary assembly can be performed by machine mounting and reflow soldering.
  • 6a-6b are schematic views of the assembly of the positioning post at the A section of Fig. 5, and Figs. 6a-6b clearly show the assembly between the positioning post located in the middle of the lead structure 3 and the positioning hole 8 of the corresponding intermediate positioning post.
  • 6c-6d is a schematic view of the assembly of the positioning post at the B section of FIG. 5, and FIGS. 6c-6d clearly show the positioning post located at both ends of the lead structure 3 and the positioning holes 7 of the corresponding two positioning posts. The assembly between the two is indicated.
  • the pin shape of the connection portion between the module and the motherboard may be a wing shape, an inverted F shape, a J shape, or the like, but is not limited to these three shapes.
  • 7a-7d are schematic views of an example of a pin shape of the present invention, FIG. 7a is a perspective view of a wing pin, FIG. 7b is a schematic view of a wing pin, FIG. 7c is a schematic view of an inverted F pin, and FIG. 7d is a J pin.
  • schematic diagram. 7a-7d are only examples.
  • the shape and size of the individual pins of the module of the present invention are not limited to the above four shapes, and the size, the spacing, etc. are mainly related to the module substrate size, the component layout on the module substrate, and the number of I/O ports. related.
  • the pins of the module of the present invention are independent of each other, and the pin structures on both sides of the substrate 1 are independent of each other and can be connected to different I/O ports.
  • FIG. 8 is a lead structure in a module embodiment of the present invention.
  • the positioning holes at all positions on the module substrate are on the same horizontal line.
  • 9a-9b are schematic views showing the assembly of the positioning post at the B section of Fig. 5 when the positioning post structure shown in Fig. 8 is used, and Figs. 9a-9b clearly show that the positioning post at both ends of the lead structure 3 passes through.
  • the assembly of the module substrate is inserted into the positioning hole of the opposite pin plastic body.
  • FIG. 10 shows that the middle one of the waist holes shown in FIG. 3 is changed to two circular holes 108.
  • the spacing between the two circular holes 108 is not particularly required, as long as the two circular holes are located on the same horizontal line.
  • the center line of the substrate may be symmetrical; or other shapes such as a waist shape may be used to position the holes.
  • the original circular holes at both ends are changed to waist-shaped holes, which are redundant for the insertion of the positioning posts, avoiding interference between the positioning holes and the positioning posts.
  • more than three positioning holes may be positioned on the substrate.
  • the structure of all the modules of the present invention is equally applicable to the double-row pin vertical module shown in Fig. 11, and the pin 111 in the figure is a double-row pin.

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  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne un module (11) comprenant : un substrat (1) et deux structures de broche (3). La structure de broche comprend des broches (4) et un support de broche (0). Chaque broche est placée indépendamment sur le support de broche. Le nombre de structures de broche est de deux ou plus. Elles sont placées des deux côtés du substrat respectivement, et utilisées pour connecter le substrat et la carte mère (12). Au moins deux protubérances de positionnement (6) sont placées sur le support de broche. Les orifices de positionnement (7) sur le substrat correspondent aux protubérances de positionnement sur le support de broche, et ils sont placés sur la même ligne droite. Les protubérances de positionnement sur le support de broche sont assemblées avec le substrat à travers les orifices de positionnement. L'invention concerne également un ensemble électrique comprenant le module et la carte mère. Le module et l'ensemble électrique permettent d'assurer la coplanarité des broches assemblées et de la carte mère.
PCT/CN2008/070801 2007-04-30 2008-04-25 Module et ensemble électrique WO2008134965A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN 200710107162 CN100585848C (zh) 2007-04-30 2007-04-30 一种模块和电子装置
CN200710107162.5 2007-04-30

Publications (1)

Publication Number Publication Date
WO2008134965A1 true WO2008134965A1 (fr) 2008-11-13

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ID=39943125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/070801 WO2008134965A1 (fr) 2007-04-30 2008-04-25 Module et ensemble électrique

Country Status (2)

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CN (1) CN100585848C (fr)
WO (1) WO2008134965A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403252B (zh) * 2010-12-03 2013-07-21 Asustek Comp Inc 電子模組及應用其之電子裝置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101867286B (zh) * 2010-06-29 2015-05-13 中兴通讯股份有限公司 一种dc/dc模块电源
CN102340559A (zh) * 2010-07-20 2012-02-01 上海闻泰电子科技有限公司 一种移动终端组合式电路板及其组装方法
CN102290698A (zh) * 2011-07-20 2011-12-21 聚信科技有限公司 一种立式焊接系统及组装立式表贴模块的方法
CN103280424B (zh) * 2012-12-12 2015-10-28 贵州振华风光半导体有限公司 一种高集成度功率厚膜混合集成电路的集成方法
CN103151276B (zh) * 2012-12-12 2015-08-19 贵州振华风光半导体有限公司 一种高集成度功率薄膜混合集成电路的集成方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
US6815614B1 (en) * 2003-09-05 2004-11-09 Power-One Limited Arrangement for co-planar vertical surface mounting of subassemblies on a mother board
US6824407B1 (en) * 2003-06-03 2004-11-30 Hon Hai Precision Ind. Co., Ltd. Card edge connector with latch
CN1937323A (zh) * 2005-09-20 2007-03-28 第一电子工业株式会社 电接插件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6824407B1 (en) * 2003-06-03 2004-11-30 Hon Hai Precision Ind. Co., Ltd. Card edge connector with latch
US6815614B1 (en) * 2003-09-05 2004-11-09 Power-One Limited Arrangement for co-planar vertical surface mounting of subassemblies on a mother board
CN1937323A (zh) * 2005-09-20 2007-03-28 第一电子工业株式会社 电接插件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403252B (zh) * 2010-12-03 2013-07-21 Asustek Comp Inc 電子模組及應用其之電子裝置

Also Published As

Publication number Publication date
CN100585848C (zh) 2010-01-27
CN101299426A (zh) 2008-11-05

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