WO2008130080A1 - Procédé de production d'une poudre conductrice pour le dépôt autocatalytique - Google Patents

Procédé de production d'une poudre conductrice pour le dépôt autocatalytique Download PDF

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Publication number
WO2008130080A1
WO2008130080A1 PCT/KR2007/004101 KR2007004101W WO2008130080A1 WO 2008130080 A1 WO2008130080 A1 WO 2008130080A1 KR 2007004101 W KR2007004101 W KR 2007004101W WO 2008130080 A1 WO2008130080 A1 WO 2008130080A1
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WO
WIPO (PCT)
Prior art keywords
plating
protrusions
manufacturing
plating layer
powder
Prior art date
Application number
PCT/KR2007/004101
Other languages
English (en)
Inventor
Won Il Son
Jeong Hee Jin
Seok Heon Oh
Original Assignee
Hanwha Chemical Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanwha Chemical Corporation filed Critical Hanwha Chemical Corporation
Publication of WO2008130080A1 publication Critical patent/WO2008130080A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

Definitions

  • the present invention relates to a manufacturing method of conductive electroless plating powder having excellent conductivity and adhesion, more precisely a manufacturing method of protrusion type conductive plating powder based on electroless plating method, in which 0.3-1.0 [M sized micro protrusions are on the plating layer and the area without protrusions is plated smoothly, resulting in the excellent electric resistance, adhesion between the plating layer and resin plating powder and regularity.
  • Conductive resin powders have been widely used for preventing static electricity of an electronic machine or its parts, for absorbing electric waves or for forming an electromagnetic shied. Recently, plating powder has been used as a conductive material for electric connection of micro- parts of electronic equipment, for example connection between electrode of LCD panel and circuit board of LSI chip, and connection between electrode terminals of micro pitch, etc.
  • the conventional manufacturing method of plating powder is generally exemplified by physical coating of resin powder surface with metal particles (Japanese Patent Application No. 1993-55263) and a method of laying protrusions of metal particles on the surface of the substrate powder (Japanese Patent Application No. 2002-55952) .
  • micro protrusions According to the above description on the method above, at least 80% of the micro protrusions has 0.02-0.3 ⁇ m. size. Most of the micro protrusions are up to 0.3 //m in height. When it is tried to conduct electricity between electrodes of LCD board with weak weight, point contact in which only micro protrusions are connected is no made. Besides, in spite of excellent connection stability, insufficient resin exclusivity interrupts reliable electric resistance.
  • Korean Patent No. 0602726 describes a method of electroless conductive plating, in which nickel or nickel alloy membrane is formed on the surface of spherical core particle of 1-20 ⁇ m in mean diameter by electroless plating and micro protrusions of 0.05-4 ⁇ m are formed on the outmost layer of the membrane and the micro protrusions form a continuous membrane which comprising micro protrusions and nickel membrane at the same time.
  • this method is the electroless nickel plating on non-conductive particles which is to produce conductive electroless plating powder by forming nickel micro protrusions and nickel membrane simultaneously based on autolysis of nickel plating solution.
  • the present inventors studied to develop conductive electroless plating powder having excellent conductivity and adhesion.
  • the present inventors completed this invention by developing a manufacturing method of conductive plating powder based on electroless plating method forming metal plating layer on the surface of the substrate of resin powder in electroless plating solution, which favors the production of conductive plating powder having excellent adhesion between the plating layer and the resin powder and regularity as well as excellent electric resistance resulted from that the plating layer has 0.3 ⁇ 1.
  • Ojtan sized micro protrusions on its surface and the area without protrusions is plated smoothly.
  • the conductive electroless plating powder prepared by the method of the present invention has excellent conductivity and adhesion in which the first metal plating layer contains 0.3-1.0 ⁇ m sized micro protrusions and the rest area of the layer without protrusions is plated smoothly. It is another object of the present invention to plate the first metal plating layer and micro protrusions with different metals.
  • the present invention provides a manufacturing method of conductive electroless plating powder comprising the steps of forming the first metal plating layer by plating the surface of resin powder used as a core material; forming metal protrusions by using the same or a different metal; and forming the second metal plating layer by plating the protrusions and the upper part of the first metal plating layer without protrusions with the same or a different metal.
  • the protrusion type conductive plating powder of the present invention comprises: core material (1) using resin powder; first electroless metal plating layer (2) plated on the surface of the core material (1); transition metal protrusions (3) formed on top of the first electroless metal plating layer (2); and second electroless metal plating layer (4) plated on the protrusions (3) and on the top of the first electroless metal plating layer (2) .
  • the protrusion type conductive plating powder can additionally include the gold plating layer (5) formed on the top of the second electroless metal plating layer (4) .
  • the plating powder of the present invention is characterized by forming 0.3-1.0 ⁇ m sized spherical protrusions (3) on ⁇ of the surface at least 5 and forming smooth plating layer where protrusions are not formed.
  • the present invention provides a manufacturing method of protrusion type conductive plating powder, in which the first electroless metal plating layer is formed on the surface of a core material using resin powder based on electroless plating; and transition metal protrusions are formed on the surface of the resin powder by simultaneous addition of transition metal and a reducing agent.
  • the conductive plating powder coated with the second electroless metal plating layer is dispersed in displacement gold plating solution to induce displacement gold plating; and the displacement gold plating solution is regulated as alkali, to which a reducing agent is added in order to form the reduced gold plating layer on the displacement gold plating layer.
  • the gold plating layer is formed precisely and regularly, and the metal of the first electroless metal plating layer is prevented from being eluted.
  • the preferable alkali condition herein indicates pH 10 - 14.
  • the present inventors found out that the method of forming metal plating layer on the surface of resin powder by electroless plating can produce conductive plating powder having excellent regularity and adhesion between the plating layer and the resin powder because the plating powder has 0.3-1.0 ⁇ m sized micro protrusions and the area where protrusions are not generated is plated very smoothly. And the inventors further completed this invention by confirming that the method of the invention has advantages of sufficient resin exclusion by protrusions during micro-connection of electrode and high conductivity.
  • the resin used for the electroless plating core material is not limited.
  • the mean diameter of resin powder is 0.5 ⁇ 1000 ⁇ m. It the mean diameter is less than 0.5 ⁇ m, it will be hard for the conductive powder to contact the electrode. If there is a gap between electrodes, contact fail will be observed. If the mean diameter is more than 1000 ⁇ m, micro conductive connection will be difficult.
  • the mean diameter has to be in that range and 1 ⁇
  • 100 ⁇ m is preferred, 2 ⁇ 20 ⁇ m is more preferred and 3 ⁇ 10 ⁇ m is most preferred.
  • the aspect ratio of the resin powder, in this invention is less than 2, and more preferably less than 1.2 and most preferably less than 1.06. If the aspect ratio is larger than 2, particle diameter will not be regular, suggesting that when the conductive powders are forced to contact electrode, the numbers of non-contacting particles are increased. Therefore, the ratio is preferably limited to the above and more preferably limited to the range of 1-2.
  • the preferable coefficient of variation (Cv) of the rein particle diameter is up to 30%, preferably up to 20%, more preferably up to 10% and most preferably 1-30%. If the Cv is more than 30%, particle diameter is not regular, so that the contact of the conductive powder to the electrode is difficult, suggesting that the numbers of non-contacting particles increase. So, Cv has to be adjusted in the above range.
  • the standard deviation and number average mean diameter can be calculated by particle size analyzer (Accusizer model 780-particle sizing systems, Inc) .
  • the first metal layer is formed on the surface of the resin powder substrate by electroless plating method, and the transition metal solution reduced by a reducing agent is added thereto in order to generate protrusions on the first metal plating layer.
  • the transition metal is reduced on the first metal plating layer.
  • the second electroless plating layer is formed on the reduced transition metal protrusions and on the first electroless nickel plating layer to produce the protrusion type conductive ball.
  • the resin substrate particle is added into SnCl 2 solution, by which Sn 2+ ion is adhered on the surface of the resin substrate. Then, Pd is reduced on the surface of the resin substrate by using PdCl 2 solution to form catalytic nuclei, resulting in the formation of the first plating membrane layer.
  • the metal used for forming the first plating membrane layer is any of conductive metals that are appropriate for electroless plating, for example Au, Ag, Co, Cu, Ni, Pd, Pt and Sn or an alloy thereof.
  • the double or multiple plating layers with two or more different metals can also be formed.
  • the preferable metal membrane layer is Ni membrane layer.
  • Ni membrane layer has excellent adhesion with resin substrate particle and is able to form the electroless plating membrane layer having excellent peel resistance.
  • the allowed thickness of the membrane layer is 10 ⁇ 100 ran, but not always limited thereto .
  • the transition metal is selected from the group consisting of Pd, Cu, Ru, Pt, Ag, Co and an alloy thereof, which are usable as catalytic nuclei of the second electroless plating.
  • the double or multiple plating layers with two or more different metals can also be formed.
  • the concentration and the amount of addition of the metal solution for plating are associated with the size and the number of protrusions. It is preferred for the metal solution to contain transition metal by 0.01 ⁇ 100 g/L. If the content of transition metal is too low, eduction of the transition metal will be difficult and the size of the protrusions will be too small.
  • the reducing agent for the transition metal is not limited and any reducing agent that is able to reduce the transition metal solution can be accepted.
  • any reducing agent that is able to reduce the transition metal solution can be accepted.
  • one or more compounds selected from the group consisting of erythorbic acid compound, hydrazine compound, hydroquinone compound, boron compound and phosphoric acid compound or their salts can be used as the reducing agent.
  • the addition of such reducing agent favors the generation of transition metal protrusions having excellent stability with favored eduction speed.
  • the erythorbic acid compound is exemplified by L-ascobic acid salts
  • the hydrazine compound is exemplified by P- hydrazine benzenesulfonic acid and hydrazine sulfate derivatives
  • the hydroquinone compound is exemplified by methyl hydroquinone, chlorohydroquinone and methoxy hydroquinone
  • the boron compound is exemplified by sodium borohydride and dimetyl amino bromide
  • the phosphoric acid compound is exemplified by sodium hyperphosphite and pyrophosphite .
  • the reducing agent and the reducing agent derivatives of the invention can be used independently or as a mixture of at least two compounds.
  • the content of the reducing agent in the plating solution of the invention is not limited. But if the content of the reducing agent is too low, eduction of the transition metal will be difficult and costs will be increased too much. Therefore, the preferable content of the reducing agent in the total plating solution is 0.01-50 g/L and 0.1g ⁇ 20 g/L is more preferred.
  • the preferable temperature for the formation of protrusions by transition metal is at least 40 ° C. However, if the temperature is too high, the plating solution might be degraded and water will be evaporated badly, suggesting that the contents of components of the plating solution will be changed. So, the temperature of the plating solution is preferably adjusted to 20 ⁇ 80 ° C. pH of the plating solution is regulated as pH 3 ⁇ 14 with the addition of a reducing agent.
  • the pH is preferably regulated as 3-14 and more preferably as 5-12.
  • the pH regulator can ' be inorganic salt, for example sodium hydroxide, ammonium chloride, etc.
  • the content of the pH regulator in the plating solution is preferably 10-200 g/L.
  • the plating powder can be used as a substrate to form at least two metal layers on top of the plating membrane layer.
  • Au layer can be formed easily on the top of Ni membrane layer, which favors connectivity with the plating membrane layer.
  • the Ni-Au double membrane layers provide higher conductivity than the single membrane layer.
  • the thickness of the single membrane layer is 10 - 200 ran, and the thickness of the double membrane layers is 10 - 300 ran, but not always limited thereto.
  • the conductive plating powder prepared by the method of the present invention has excellent conductivity and adhesion between the plating layers, which satisfy the request of micro wiring, and is high quality and high value plating powder which is not limited by capacitance during connection.
  • the protrusion type conductive plating powder of the present invention is characterized by regular shaped and sized protrusions and excellent resin exclusion during thermo-compression to electrode by anisotropic conductive film because the protrusions are regular and the area where protrusions are not formed is smoothly plated; excellent connection reliability with electrode; and excellent adhesion between the elaborated plating layer and the resin powder and excellent regularity.
  • the present invention provides high quality conductive electroless plating powder that can satisfy the need of micro wiring without limitation by capacitance during connection.
  • Figure 1 is a cross-section showing the example of the conductive electroless plating powder of the present invention.
  • Figure 2 is a photograph of SEM (x 6,000) showing the surface of the plating powder prepared in example 1 of the invention.
  • Figure 3 is a photograph of SEM (x 20,000) showing the surface of the plating powder prepared in example 1 of the invention.
  • Figure 4 is a photograph of SEM (x 6,000) showing the surface of the plating powder prepared in example 2 of the invention.
  • Figure 5 is a photograph of SEM (x 10,000) showing the surface of the plating powder prepared in example 2 of the invention.
  • Figure 6 is a photograph of SEM (x 6,000) showing the surface of the plating powder prepared in example 3 of the invention.
  • Figure 7 is a photograph of SEM (x 18,000) showing the surface of the plating powder prepared in example 3 of the invention.
  • Figure 8 is a photograph of SEM (x 6,000) showing the surface of the plating powder prepared in example 4 of the invention .
  • Figure 9 is a photograph of SEM (x 20,000) showing the surface of the plating powder prepared in example 4 of the invention.
  • Figure 10 is a photograph of SEM (x 10,000) showing the surface of the plating powder prepared in comparative example 1 of the invention.
  • Figure 11 is a photograph of SEM (x 20,000) showing the surface of the plating powder prepared in comparative example
  • Figure 12 is a photograph of SEM (x 8,000) showing the surface of the plating powder prepared in comparative example 2 of the invention.
  • Figure 13 is a photograph of SEM (x 6,000) showing the surface of the plating powder prepared in comparative example
  • Figure 14 is a photograph of SEM (x 20,000) showing the surface of the plating powder prepared in comparative example 3 of the invention.
  • core material 2 first electroless metal plating layer 3 : transition metal protrusions 4 : second electroless metal plating layer
  • transition metal protrusions 0.5 g of Pd CI 2 , the transition metal, was dissolved in 500 g of ultra pure water in the first nickel plating dispersed solution. 10 g of hydrazine, the reducing agent, was diluted in 500 g of ultra pure water. pH was regulated as 6.0. 200 g of each solution was added simultaneously to generate Pd protrusions on the first electroless nickel plating powder. The size of the Pd protrusion was 10 run at average. ⁇ Second electroless nickel plating>
  • the first electroless nickel plating powder having Pd protrusions on its surface was plated with electroless plating solution (Union 440, Union Specialty) .
  • the electroless plating solution was divided into solution A (IM, nickel sulfate) and solution B (reducing agent, 2M, NaH 2 PO 4 ) , which were slowly added by using a micro quantifying pump at the speed of 3 m ⁇ /min for 80 minutes.
  • the second electroless nickel plating layer was formed with stirring at the same temperature until hydrogen foaming stopped.
  • the obtained nickel plating powder was washed several times, substituted with alcohol, and vacuum dried at 80 ° C to give nickel plating powder.
  • the thickness of the nickel plating layer was approximately 120 ran.
  • Figure 2 is a photograph of SEM showing the surface of the plating powder prepared in example 1 (x 6000) to confirm regularity of protrusion distribution.
  • Figure 3 illustrates the sizes and numbers of protrusions on the ⁇ of the surface of the metal particle (x 20,000) .
  • the protrusion size was 280 ⁇ 400 nm and the size of the largest protrusion was approximately 600 nm.
  • the area of the surface where protrusions were not generated was plated evenly.
  • the size and number of protrusion and electric resistance and adhesion were investigated and the results are shown in Table 1. [Example 2]
  • the pretreatment process was performed by the same manner as described in example 1 and the first and the second electroless nickel plating were also performed by the same manner as described above.
  • the difference was that 1 g of H 2 PtCl 6 was used as a transition metal, which was dissolved in 500 g of ultra pure water and the reducing solution of example 1 was used as a reducing agent to generate protrusion type conductive balls by forming Pt protrusions on the first electroless nickel plating layer.
  • the results are shown in Figure 4 and Figure 5.
  • the sizes and numbers of the protrusions on the ⁇ of the surface of the metal particle were measured using SEM photograph (x 20K) and electric resistance and adhesion were investigated. The results are shown in Table 1. [Example 3]
  • Displacement gold plating solution was prepared by dissolving 10.0 g of potassium gold cyanide, 150 g of ethylenediaminetetraacetic acid and 70 g of ammonium citrate completely in 3 L of de-ionized water. At that time, pH was
  • the obtained plating powder was washed with 1 L of de- ionized water 5 times, followed by substitution with alcohol to eliminate the remaining moisture completely. Then, the powder was vacuum-dried at 80 ° C to give gold plating powder.
  • the gold plating powder obtained above was cut by FIB (Forced Ion Beam) and the section was observed under SEM. The thickness of the gold plating layer was approximately 20 ran.
  • Gold plating was performed by the same manner as described in example 3 except that the protrusion type nickel plating powder produced in example 2 was used.
  • the obtained plating powder is shown in Figures 8 and 9.
  • the sizes and numbers of the protrusions on the H of the surface of the gold coated plating powder were measured and the electric resistance and adhesion were also investigated.
  • the results are shown in Table 1.
  • Comparative Example 1 An experiment was performed by the same manner as described in example 1 except that the surface of resin powder was plated with nickel without forming transition metal protrusions thereon and displacement gold plating was carried out on the resultant nickel plating powder by the same manner as described in example 3.
  • the surface of the plating powder was photographed by SEM (x 6000) to observe regularity of the plating powder and the protrusions.
  • connection resistance The conductive particles were mixed in epoxy binder at the density of 250,000 particles/m ⁇ f, which was placed between flexible print circuit boards having 200 x 100 ⁇ m bonding wire pattern. Bonding was performed at 190 ° C with compressing pressure of 60 N for 20 seconds. Then, electric resistance was measured.
  • the surface of the plating powder was photographed by SEM (x 20,000) to observe the sizes and numbers of protrusions formed on the H of the surface area of the metal particle.
  • the method of the present invention provides conductive powder which has excellent electric resistance because bigger and regular protrusions are formed and the area where protrusions are not formed is plated smoothly and evenly and has elaborate plating layer, excellent regularity and adhesion between the plating layer and the resin powder, compared with the conventional art.
  • the protrusion type conductive plating powder prepared by the method of the present invention contains protrusions which are bigger and regular, has excellent resin exclusivity during thermo-compression to electrode by anisotropic conductive film because the surface area where protrusions are not formed is also plated evenly and smoothly, has excellent connection reliability with electrode and has excellent regularity and adhesion between the elaborated plating layer and the resin powder. Therefore, the present invention provides high guality conductive electroless plating powder that can satisfy the need of micro wiring without limitation by capacitance during connection.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)

Abstract

La présente invention concerne un procédé de production d'une poudre conductrice pour le dépôt autocatalytique qui présente une excellente conductivité et adhérence et concerne plus précisément un procédé de production d'une poudre de revêtement conductrice reposant sur un procédé de dépôt autocatalytique qui comprend l'étape de formation d'une couche de revêtement métallique sur la surface du substrat en poudre de résine dans une solution de dépôt autocatalytique. La couche de revêtement comporte des micro-protubérances d'une taille comprise entre 0,3 et 1,0 μm sur la surface et la région sur laquelle aucune protubérance est formée est également revêtue de manière continue et uniforme, de sorte que la poudre de revêtement conductrice obtenue présente une excellente résistance électrique, une excellente adhérence entre la couche de revêtement préparée et la poudre de résine et une excellente régularité.
PCT/KR2007/004101 2007-04-23 2007-08-27 Procédé de production d'une poudre conductrice pour le dépôt autocatalytique WO2008130080A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0039307 2007-04-23
KR1020070039307A KR100879578B1 (ko) 2007-04-23 2007-04-23 도전성 무전해 도금분체의 제조방법

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KR (1) KR100879578B1 (fr)
TW (1) TWI422444B (fr)
WO (1) WO2008130080A1 (fr)

Cited By (4)

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Publication number Priority date Publication date Assignee Title
CN103736994A (zh) * 2014-01-15 2014-04-23 南京德磊科技有限公司 一种化学镀镍溶液的处理方法
JP2015092475A (ja) * 2013-10-02 2015-05-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015109271A (ja) * 2013-10-23 2015-06-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016018705A (ja) * 2014-07-09 2016-02-01 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法

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KR100979281B1 (ko) * 2010-02-09 2010-09-01 인천화학 주식회사 도전성 분체의 제조 방법
JP5943019B2 (ja) * 2014-02-26 2016-06-29 日立金属株式会社 導電性粒子、導電性粉体、導電性高分子組成物および異方性導電シート

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JP2000319541A (ja) * 1999-05-13 2000-11-21 Shin Etsu Chem Co Ltd 金属被覆粉体の製造方法
JP2003234020A (ja) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子

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Publication number Priority date Publication date Assignee Title
JPH1173818A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2000319541A (ja) * 1999-05-13 2000-11-21 Shin Etsu Chem Co Ltd 金属被覆粉体の製造方法
JP2003234020A (ja) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015092475A (ja) * 2013-10-02 2015-05-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2018198217A (ja) * 2013-10-02 2018-12-13 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015109271A (ja) * 2013-10-23 2015-06-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN103736994A (zh) * 2014-01-15 2014-04-23 南京德磊科技有限公司 一种化学镀镍溶液的处理方法
CN103736994B (zh) * 2014-01-15 2015-11-18 南京德磊科技有限公司 一种化学镀镍溶液的处理方法
JP2016018705A (ja) * 2014-07-09 2016-02-01 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法

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KR100879578B1 (ko) 2009-01-22
TW200916235A (en) 2009-04-16
TWI422444B (zh) 2014-01-11

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