WO2008129621A1 - 回路基板端子間の接続構造 - Google Patents

回路基板端子間の接続構造 Download PDF

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Publication number
WO2008129621A1
WO2008129621A1 PCT/JP2007/057854 JP2007057854W WO2008129621A1 WO 2008129621 A1 WO2008129621 A1 WO 2008129621A1 JP 2007057854 W JP2007057854 W JP 2007057854W WO 2008129621 A1 WO2008129621 A1 WO 2008129621A1
Authority
WO
WIPO (PCT)
Prior art keywords
connecting structure
circuit substrate
circuit
end portions
terminals
Prior art date
Application number
PCT/JP2007/057854
Other languages
English (en)
French (fr)
Inventor
Masahito Kawabata
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to PCT/JP2007/057854 priority Critical patent/WO2008129621A1/ja
Publication of WO2008129621A1 publication Critical patent/WO2008129621A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　熱圧着による接続部の良否を、両端部に配置した電気的接続検査ランドにより精度よく判断できる回路基板端子間の接続構造を提供する。 　回路基板端子間の接続構造は、硬質基板１００と、軟質基板１０６とを備え、回路パターン１０１と回路パターン１０７とを、接着剤２０３を介して熱圧着で接続する際に、接着エリア１０３Ａの両端部に配置した、一方の２本の第２ダミー端子１０２と、他方の１本の第１ダミー端子１０８とを接続することで、両端部の接続評価回路が形成されるように構成したものである。
PCT/JP2007/057854 2007-04-09 2007-04-09 回路基板端子間の接続構造 WO2008129621A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/057854 WO2008129621A1 (ja) 2007-04-09 2007-04-09 回路基板端子間の接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/057854 WO2008129621A1 (ja) 2007-04-09 2007-04-09 回路基板端子間の接続構造

Publications (1)

Publication Number Publication Date
WO2008129621A1 true WO2008129621A1 (ja) 2008-10-30

Family

ID=39875169

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/057854 WO2008129621A1 (ja) 2007-04-09 2007-04-09 回路基板端子間の接続構造

Country Status (1)

Country Link
WO (1) WO2008129621A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013218237A (ja) * 2012-04-12 2013-10-24 Japan Display Inc 液晶表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09189916A (ja) * 1996-01-10 1997-07-22 Canon Inc 回路集合体及びそれを作製する方法
JPH10301137A (ja) * 1997-04-25 1998-11-13 Optrex Corp 液晶表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09189916A (ja) * 1996-01-10 1997-07-22 Canon Inc 回路集合体及びそれを作製する方法
JPH10301137A (ja) * 1997-04-25 1998-11-13 Optrex Corp 液晶表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013218237A (ja) * 2012-04-12 2013-10-24 Japan Display Inc 液晶表示装置
US9329446B2 (en) 2012-04-12 2016-05-03 Japan Display Inc. Liquid crystal display device and method of manufacturing the same

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