WO2008120519A1 - Appareil de manipulateur de point d'outil - Google Patents

Appareil de manipulateur de point d'outil Download PDF

Info

Publication number
WO2008120519A1
WO2008120519A1 PCT/JP2008/053517 JP2008053517W WO2008120519A1 WO 2008120519 A1 WO2008120519 A1 WO 2008120519A1 JP 2008053517 W JP2008053517 W JP 2008053517W WO 2008120519 A1 WO2008120519 A1 WO 2008120519A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
tcp
tcp handler
probe card
carrier tape
Prior art date
Application number
PCT/JP2008/053517
Other languages
English (en)
Japanese (ja)
Inventor
Hisashi Murano
Katsuhiro Imaizumi
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to JP2009507437A priority Critical patent/JPWO2008120519A1/ja
Publication of WO2008120519A1 publication Critical patent/WO2008120519A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

Abstract

Selon l'invention, dans un manipulateur de point d'outil (2), une bande support (5) sur laquelle plusieurs points d'outil sont formés est transférée, la bande support (5) est comprimée contre une carte sonde (8) ayant une sonde (81) électriquement connectée à une tête d'essai (11), et un plot d'essai de point d'outil est connecté à la sonde (81) de la carte sonde (8). Ainsi, le manipulateur de point d'outil teste successivement les points d'outil. Le manipulateur de point d'outil comporte un élément de nettoyage (93) qui est introduit entre la bande support (5) et la carte sonde (8) par une étape de nettoyage (91) pour nettoyer la sonde (81) de la carte sonde (8). Par le manipulateur de point d'outil (2), la sonde (81) peut être aisément nettoyée même pendant un moment où le manipulateur de point d'outil (2) est actionné.
PCT/JP2008/053517 2007-03-29 2008-02-28 Appareil de manipulateur de point d'outil WO2008120519A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009507437A JPWO2008120519A1 (ja) 2007-03-29 2008-02-28 Ｔｃｐハンドリング装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089810 2007-03-29
JP2007-089810 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120519A1 true WO2008120519A1 (fr) 2008-10-09

Family

ID=39808103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053517 WO2008120519A1 (fr) 2007-03-29 2008-02-28 Appareil de manipulateur de point d'outil

Country Status (4)

Country Link
JP (1) JPWO2008120519A1 (fr)
KR (1) KR20090132617A (fr)
TW (1) TW200902997A (fr)
WO (1) WO2008120519A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059010A (ja) * 2009-09-11 2011-03-24 Ueno Seiki Kk テストコンタクト、そのクリーニング方法及び半導体製造装置
JP2011149917A (ja) * 2009-12-22 2011-08-04 Micronics Japan Co Ltd プローブ清掃ユニット及びそれを備えたパネル検査装置並びにプローブ清掃方法
EP2426794A1 (fr) * 2010-09-06 2012-03-07 Rasco GmbH Nettoyage d'un contacteur dans un manipulateur de test-in-strip pour circuits imprimés
JP2022003330A (ja) * 2020-06-12 2022-01-11 致茂電子股▲分▼有限公司Chroma Ate Inc. 洗浄治具

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012068032A (ja) * 2010-09-21 2012-04-05 Tesetsuku:Kk Ｔｃｐ試験装置
KR102440287B1 (ko) * 2020-08-24 2022-09-06 (주)퓨쳐하이테크 전자부품 착탈장치와 그를 이용한 시험장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0679149U (ja) * 1993-04-23 1994-11-04 安藤電気株式会社 研磨シートつきテープキャリア
JPH11145212A (ja) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd プローブカードの洗浄装置
JPH11295392A (ja) * 1998-04-15 1999-10-29 Micronics Japan Co Ltd プローブに付着している異物の除去装置
JP2000223539A (ja) * 1999-01-29 2000-08-11 Tokyo Electron Ltd クリーナ及びクリーニング方法
JP2002307316A (ja) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd 接触子先端及び側面クリーニング用具
WO2004068154A1 (fr) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Dispositif de manipulation de tcp et procede de correction de deviation approprie
JP2006208009A (ja) * 2005-01-25 2006-08-10 Ricoh Co Ltd 回路基板検査装置、記憶媒体、回路基板検査方法、回路基板製造方法及び回路基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0679149U (ja) * 1993-04-23 1994-11-04 安藤電気株式会社 研磨シートつきテープキャリア
JPH11145212A (ja) * 1997-11-07 1999-05-28 Matsushita Electric Ind Co Ltd プローブカードの洗浄装置
JPH11295392A (ja) * 1998-04-15 1999-10-29 Micronics Japan Co Ltd プローブに付着している異物の除去装置
JP2000223539A (ja) * 1999-01-29 2000-08-11 Tokyo Electron Ltd クリーナ及びクリーニング方法
JP2002307316A (ja) * 2001-04-09 2002-10-23 Nihon Micro Coating Co Ltd 接触子先端及び側面クリーニング用具
WO2004068154A1 (fr) * 2003-01-31 2004-08-12 Japan Engineering Co.,Ltd. Dispositif de manipulation de tcp et procede de correction de deviation approprie
JP2006208009A (ja) * 2005-01-25 2006-08-10 Ricoh Co Ltd 回路基板検査装置、記憶媒体、回路基板検査方法、回路基板製造方法及び回路基板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059010A (ja) * 2009-09-11 2011-03-24 Ueno Seiki Kk テストコンタクト、そのクリーニング方法及び半導体製造装置
JP2011149917A (ja) * 2009-12-22 2011-08-04 Micronics Japan Co Ltd プローブ清掃ユニット及びそれを備えたパネル検査装置並びにプローブ清掃方法
EP2426794A1 (fr) * 2010-09-06 2012-03-07 Rasco GmbH Nettoyage d'un contacteur dans un manipulateur de test-in-strip pour circuits imprimés
JP2022003330A (ja) * 2020-06-12 2022-01-11 致茂電子股▲分▼有限公司Chroma Ate Inc. 洗浄治具
JP7274525B2 (ja) 2020-06-12 2023-05-16 致茂電子股▲分▼有限公司 洗浄治具

Also Published As

Publication number Publication date
TW200902997A (en) 2009-01-16
JPWO2008120519A1 (ja) 2010-07-15
KR20090132617A (ko) 2009-12-30

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