WO2008120481A1 - 多層回路基板及び半導体装置 - Google Patents

多層回路基板及び半導体装置 Download PDF

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Publication number
WO2008120481A1
WO2008120481A1 PCT/JP2008/050524 JP2008050524W WO2008120481A1 WO 2008120481 A1 WO2008120481 A1 WO 2008120481A1 JP 2008050524 W JP2008050524 W JP 2008050524W WO 2008120481 A1 WO2008120481 A1 WO 2008120481A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
multilayered circuit
semiconductor device
transition temperature
glass transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050524
Other languages
English (en)
French (fr)
Inventor
Hironori Maruyama
Kensuke Nakamura
Toru Meura
Hiroshi Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007188945A external-priority patent/JP5194601B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to US12/593,749 priority Critical patent/US8227703B2/en
Priority to CN2008800106831A priority patent/CN101647327B/zh
Priority to KR1020097022226A priority patent/KR101396700B1/ko
Publication of WO2008120481A1 publication Critical patent/WO2008120481A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　本発明の多層回路基板は、複数組の導体回路層と絶縁層から形成され、ビア接続により導通接続したスルーホールを有するコア基板を含まない片面積層の多層回路基板であって、前記絶縁層のガラス転移温度が１７０°C以上であり、ガラス転移温度以下の線膨張係数が３５ｐｐｍ以下であり、弾性率が５ＧＰａ以上であることを特徴とする。
PCT/JP2008/050524 2007-04-03 2008-01-17 多層回路基板及び半導体装置 Ceased WO2008120481A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/593,749 US8227703B2 (en) 2007-04-03 2008-01-17 Multilayered circuit board and semiconductor device
CN2008800106831A CN101647327B (zh) 2007-04-03 2008-01-17 多层电路基板及半导体装置
KR1020097022226A KR101396700B1 (ko) 2007-04-03 2008-01-17 다층 회로 기판 및 반도체 장치

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007097871 2007-04-03
JP2007-097871 2007-04-03
JP2007188945A JP5194601B2 (ja) 2006-07-20 2007-07-20 多層回路基板及び半導体装置
JP2007-188945 2007-07-20

Publications (1)

Publication Number Publication Date
WO2008120481A1 true WO2008120481A1 (ja) 2008-10-09

Family

ID=39808067

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050524 Ceased WO2008120481A1 (ja) 2007-04-03 2008-01-17 多層回路基板及び半導体装置

Country Status (1)

Country Link
WO (1) WO2008120481A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277426A (ja) * 2000-03-28 2001-10-09 Matsushita Electric Works Ltd 金属箔張積層板及びこれへの非貫通孔の穿孔方法
JP2001279006A (ja) * 2000-03-30 2001-10-10 Mitsubishi Gas Chem Co Inc 高比誘電率プリプレグの製造方法
JP2005038906A (ja) * 2003-07-15 2005-02-10 Dainippon Printing Co Ltd コア層を持たない薄型の配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277426A (ja) * 2000-03-28 2001-10-09 Matsushita Electric Works Ltd 金属箔張積層板及びこれへの非貫通孔の穿孔方法
JP2001279006A (ja) * 2000-03-30 2001-10-10 Mitsubishi Gas Chem Co Inc 高比誘電率プリプレグの製造方法
JP2005038906A (ja) * 2003-07-15 2005-02-10 Dainippon Printing Co Ltd コア層を持たない薄型の配線板

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