WO2008117706A1 - Ａｌ－Ｎｉ－Ｂ系合金スパッタリングターゲット - Google Patents

Ａｌ－Ｎｉ－Ｂ系合金スパッタリングターゲット Download PDF

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Publication number
WO2008117706A1
WO2008117706A1 PCT/JP2008/055035 JP2008055035W WO2008117706A1 WO 2008117706 A1 WO2008117706 A1 WO 2008117706A1 JP 2008055035 W JP2008055035 W JP 2008055035W WO 2008117706 A1 WO2008117706 A1 WO 2008117706A1
Authority
WO
WIPO (PCT)
Prior art keywords
sputtering target
al3ni
alloy sputtering
compound
alloy
Prior art date
Application number
PCT/JP2008/055035
Other languages
English (en)
French (fr)
Inventor
Kenji Matsuzaki
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2008516659A priority Critical patent/JPWO2008117706A1/ja
Priority to TW097110948A priority patent/TW200905003A/zh
Publication of WO2008117706A1 publication Critical patent/WO2008117706A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon

Abstract

　本発明は、スパッタリング時のアーキングの発生を抑制したＡｌ－Ｎｉ系合金スパッタリングターゲットを提供することを目的とする。本発明は、Ｎｉ及びＢを含有し、Ａｌ３Ｎｉ化合物が析出しているＡｌ－Ｎｉ－Ｂ系合金スパッタリングターゲットにおいて、前記Ａｌ３Ｎｉ化合物の全析出量に対して、Ｂ含有粒子を内包するＡｌ３Ｎｉ化合物の割合が２％以上であり、前記Ａｌ３Ｎｉ化合物の平均粒径が２０μｍ以下であることを特徴とするものである。
PCT/JP2008/055035 2007-03-28 2008-03-19 Ａｌ－Ｎｉ－Ｂ系合金スパッタリングターゲット WO2008117706A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008516659A JPWO2008117706A1 (ja) 2007-03-28 2008-03-19 Ａｌ−Ｎｉ−Ｂ系合金スパッタリングターゲット
TW097110948A TW200905003A (en) 2007-03-28 2008-03-27 Al-Ni-B based alloy sputtering target

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007083710 2007-03-28
JP2007-083710 2007-03-28

Publications (1)

Publication Number Publication Date
WO2008117706A1 true WO2008117706A1 (ja) 2008-10-02

Family

ID=39788442

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055035 WO2008117706A1 (ja) 2007-03-28 2008-03-19 Ａｌ－Ｎｉ－Ｂ系合金スパッタリングターゲット

Country Status (5)

Country Link
JP (1) JPWO2008117706A1 (ja)
KR (1) KR20090031500A (ja)
CN (1) CN101542010A (ja)
TW (1) TW200905003A (ja)
WO (1) WO2008117706A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023287A (ja) * 2009-07-17 2011-02-03 Nippon Seiki Co Ltd 有機ｅｌパネルの製造方法
JP2018204099A (ja) * 2017-04-11 2018-12-27 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 銅、リチウム、及び少なくとも１種のアルカリ土類金属又は希土類金属の添加物を含むアルミニウム合金、及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003089864A (ja) * 2001-09-18 2003-03-28 Mitsui Mining & Smelting Co Ltd アルミニウム合金薄膜及びその薄膜を有する配線回路並びにその薄膜を形成するターゲット材
WO2006117954A1 (ja) * 2005-04-26 2006-11-09 Mitsui Mining & Smelting Co., Ltd. Ａｌ－Ｎｉ－Ｂ合金配線材料及びそれを用いた素子構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003089864A (ja) * 2001-09-18 2003-03-28 Mitsui Mining & Smelting Co Ltd アルミニウム合金薄膜及びその薄膜を有する配線回路並びにその薄膜を形成するターゲット材
WO2006117954A1 (ja) * 2005-04-26 2006-11-09 Mitsui Mining & Smelting Co., Ltd. Ａｌ－Ｎｉ－Ｂ合金配線材料及びそれを用いた素子構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023287A (ja) * 2009-07-17 2011-02-03 Nippon Seiki Co Ltd 有機ｅｌパネルの製造方法
JP2018204099A (ja) * 2017-04-11 2018-12-27 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 銅、リチウム、及び少なくとも１種のアルカリ土類金属又は希土類金属の添加物を含むアルミニウム合金、及びその製造方法
US11846010B2 (en) 2017-04-11 2023-12-19 The Boeing Company Aluminum alloy with additions of copper, lithium and at least one alkali or rare earth metal, and method of manufacturing the same

Also Published As

Publication number Publication date
CN101542010A (zh) 2009-09-23
KR20090031500A (ko) 2009-03-26
JPWO2008117706A1 (ja) 2010-07-15
TW200905003A (en) 2009-02-01

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