WO2008117607A1 - 静電チャック及びこれを備えたプラズマ処理装置 - Google Patents

静電チャック及びこれを備えたプラズマ処理装置 Download PDF

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Publication number
WO2008117607A1
WO2008117607A1 PCT/JP2008/053216 JP2008053216W WO2008117607A1 WO 2008117607 A1 WO2008117607 A1 WO 2008117607A1 JP 2008053216 W JP2008053216 W JP 2008053216W WO 2008117607 A1 WO2008117607 A1 WO 2008117607A1
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WO
WIPO (PCT)
Prior art keywords
electrostatick
chuck
electrode
layer
processing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053216
Other languages
English (en)
French (fr)
Inventor
Toshihiro Hayami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
Original Assignee
Sumitomo Precision Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co Ltd filed Critical Sumitomo Precision Products Co Ltd
Publication of WO2008117607A1 publication Critical patent/WO2008117607A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

　本発明は、どのような基板に対してもより吸着力を高めることができる静電チャックなどに関する。静電チャック（２１）は、本体（２３）、及びこの本体（２３）の上面に積層された絶縁膜（２４），電極（２５）及び絶縁層（２６）からなる基台（２２）と、電極（２５）に直流電圧を印加する直流電源（２９）とを備え、絶縁膜（２４）は本体（２３）の上面に、電極（２５）は絶縁膜（２４）の上面に、絶縁層（２６）は電極（２５）の上面に形成される。前記絶縁層（２６）は、ポリイミドからなる層（２７）とセラミックからなる層（２８）との２層構造に形成されて、ポリイミド層（２７）が電極（２５）の上面に、セラミック層（２８）がポリイミド層（２７）の上面に形成される。基板Ｋはセラミック層（２８）の表面に載置される。
PCT/JP2008/053216 2007-03-23 2008-02-26 静電チャック及びこれを備えたプラズマ処理装置 Ceased WO2008117607A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-075964 2007-03-23
JP2007075964A JP2008235735A (ja) 2007-03-23 2007-03-23 静電チャック及びこれを備えたプラズマ処理装置

Publications (1)

Publication Number Publication Date
WO2008117607A1 true WO2008117607A1 (ja) 2008-10-02

Family

ID=39788346

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053216 Ceased WO2008117607A1 (ja) 2007-03-23 2008-02-26 静電チャック及びこれを備えたプラズマ処理装置

Country Status (3)

Country Link
JP (1) JP2008235735A (ja)
TW (1) TW200845287A (ja)
WO (1) WO2008117607A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130107415A1 (en) * 2011-10-28 2013-05-02 Applied Materials, Inc. Electrostatic chuck
CN103227086B (zh) * 2012-01-31 2015-09-30 中微半导体设备(上海)有限公司 一种用于等离子体处理装置的载片台
CN103227085B (zh) * 2012-01-31 2015-12-09 中微半导体设备(上海)有限公司 一种用于等离子体处理装置的载片台
CN104752301B (zh) * 2013-12-31 2018-05-25 北京北方华创微电子装备有限公司 一种静电卡盘以及腔室

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846020A (ja) * 1994-01-31 1996-02-16 Applied Materials Inc 耐食性静電チャック
JP2007027315A (ja) * 2005-07-14 2007-02-01 Tokyo Electron Ltd 静電吸着電極、基板処理装置および静電吸着電極の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846020A (ja) * 1994-01-31 1996-02-16 Applied Materials Inc 耐食性静電チャック
JP2007027315A (ja) * 2005-07-14 2007-02-01 Tokyo Electron Ltd 静電吸着電極、基板処理装置および静電吸着電極の製造方法

Also Published As

Publication number Publication date
JP2008235735A (ja) 2008-10-02
TW200845287A (en) 2008-11-16

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