WO2008117607A1 - Electrostatick chuck and plasma processing equipment with electrostatick chuck - Google Patents

Electrostatick chuck and plasma processing equipment with electrostatick chuck Download PDF

Info

Publication number
WO2008117607A1
WO2008117607A1 PCT/JP2008/053216 JP2008053216W WO2008117607A1 WO 2008117607 A1 WO2008117607 A1 WO 2008117607A1 JP 2008053216 W JP2008053216 W JP 2008053216W WO 2008117607 A1 WO2008117607 A1 WO 2008117607A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatick
chuck
electrode
layer
processing equipment
Prior art date
Application number
PCT/JP2008/053216
Other languages
French (fr)
Japanese (ja)
Inventor
Toshihiro Hayami
Original Assignee
Sumitomo Precision Products Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co., Ltd. filed Critical Sumitomo Precision Products Co., Ltd.
Publication of WO2008117607A1 publication Critical patent/WO2008117607A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

An electrostatick chuck which can enhance attraction force for any substrate. The electrostatick chuck (21) comprises a base mount (22) consisting of a body (23) and an insulating film (24), an electrode (25) and an insulating layer (26) laminated on the upper surface of the body (23), and a DC power supply (29) for applying a DC voltage to the electrode (25) wherein the insulating film (24) is formed on the upper surface of the body (23), the electrode (25) is formed on the upper surface of the insulating film (24) and the insulating layer (26) is formed on the upper surface of the electrode (25). The insulating layer (26) has a two-layerstructure of a polyimide layer (27) and a ceramic layer (28) wherein the polyimide layer (27) is formed on the upper surface of the electrode (25), and the ceramic layer (28) is formed on the upper surface of the polyimide layer (27). A substrate K is mounted on the surface of the ceramic layer (28).
PCT/JP2008/053216 2007-03-23 2008-02-26 Electrostatick chuck and plasma processing equipment with electrostatick chuck WO2008117607A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007075964A JP2008235735A (en) 2007-03-23 2007-03-23 Electrostatic chuck and plasma processing equipment having it
JP2007-075964 2007-03-23

Publications (1)

Publication Number Publication Date
WO2008117607A1 true WO2008117607A1 (en) 2008-10-02

Family

ID=39788346

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053216 WO2008117607A1 (en) 2007-03-23 2008-02-26 Electrostatick chuck and plasma processing equipment with electrostatick chuck

Country Status (3)

Country Link
JP (1) JP2008235735A (en)
TW (1) TW200845287A (en)
WO (1) WO2008117607A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130107415A1 (en) * 2011-10-28 2013-05-02 Applied Materials, Inc. Electrostatic chuck
CN103227086B (en) * 2012-01-31 2015-09-30 中微半导体设备(上海)有限公司 A kind of slide holder for plasma processing apparatus
CN103227085B (en) * 2012-01-31 2015-12-09 中微半导体设备(上海)有限公司 A kind of slide holder for plasma processing apparatus
CN104752301B (en) * 2013-12-31 2018-05-25 北京北方华创微电子装备有限公司 A kind of electrostatic chuck and chamber

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846020A (en) * 1994-01-31 1996-02-16 Applied Materials Inc Corrosion-resisting electrostatic chuck
JP2007027315A (en) * 2005-07-14 2007-02-01 Tokyo Electron Ltd Electrostatic attraction electrode, method of manufacturing the same and substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846020A (en) * 1994-01-31 1996-02-16 Applied Materials Inc Corrosion-resisting electrostatic chuck
JP2007027315A (en) * 2005-07-14 2007-02-01 Tokyo Electron Ltd Electrostatic attraction electrode, method of manufacturing the same and substrate processing apparatus

Also Published As

Publication number Publication date
TW200845287A (en) 2008-11-16
JP2008235735A (en) 2008-10-02

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