WO2008117489A1 - 半導体装置製造用接着フィルム - Google Patents

半導体装置製造用接着フィルム Download PDF

Info

Publication number
WO2008117489A1
WO2008117489A1 PCT/JP2007/070517 JP2007070517W WO2008117489A1 WO 2008117489 A1 WO2008117489 A1 WO 2008117489A1 JP 2007070517 W JP2007070517 W JP 2007070517W WO 2008117489 A1 WO2008117489 A1 WO 2008117489A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive film
semiconductor device
producing
conductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/070517
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Kondo
Yasuhiro Amano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US12/593,004 priority Critical patent/US20100119759A1/en
Publication of WO2008117489A1 publication Critical patent/WO2008117489A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/02—Copolymers with acrylonitrile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1405—Capsule or particulate matter containing [e.g., sphere, flake, microballoon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

【課題】半導体装置の製造方法において、最終的に除去される接着フィルムであって、導体の一部が封止樹脂から突出したいわゆるスタンドオフを有する半導体装置の製造に好適に用いられ、かつ良好なワイヤボンディング性能を有する半導体装置製造用接着フィルムを提供すること。 【解決手段】（ａ）導体の少なくとも一部を接着フィルムに埋没させる工程、 （ｂ）導体上に半導体チップを搭載する工程、 （ｃ）半導体チップと導体とを結線する工程、 （ｄ）封止樹脂により半導体チップを封止する工程、及び （ｅ）接着フィルムを除去する工程、 を有する半導体装置の製造方法に使用される、熱硬化性接着剤層を有する接着フィルムであって、該熱硬化性接着剤層に層状粘土鉱物が含有されていることを特徴とする半導体装置製造用接着フィルム。
PCT/JP2007/070517 2007-03-27 2007-10-22 半導体装置製造用接着フィルム Ceased WO2008117489A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/593,004 US20100119759A1 (en) 2007-03-27 2007-10-22 Adhesive film for producing semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007081745A JP5067927B2 (ja) 2007-03-27 2007-03-27 半導体装置製造用接着フィルム
JP2007-081745 2007-03-27

Publications (1)

Publication Number Publication Date
WO2008117489A1 true WO2008117489A1 (ja) 2008-10-02

Family

ID=39788231

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070517 Ceased WO2008117489A1 (ja) 2007-03-27 2007-10-22 半導体装置製造用接着フィルム

Country Status (4)

Country Link
US (1) US20100119759A1 (ja)
JP (1) JP5067927B2 (ja)
TW (1) TW200839976A (ja)
WO (1) WO2008117489A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041525A (ja) * 2010-07-20 2012-03-01 Hitachi Chem Co Ltd 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
KR101285852B1 (ko) 2011-08-23 2013-07-15 도레이첨단소재 주식회사 자석부착층을 갖는 점착테이프를 이용한 전자부품의 봉지 방법
TWI488930B (zh) * 2012-03-12 2015-06-21 Ｌｇ化學股份有限公司 壓感性黏著組成物
CN109037084A (zh) * 2018-07-27 2018-12-18 星科金朋半导体（江阴）有限公司 一种qfn指纹识别芯片的封装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294580A (ja) * 1999-04-12 2000-10-20 Nitto Denko Corp 半導体チップの樹脂封止方法及びリ−ドフレ−ム等貼着用粘着テ−プ
JP2005183734A (ja) * 2003-12-19 2005-07-07 Nitto Denko Corp 半導体装置製造用接着フィルム
JP2006299196A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd ポリイミドフィルムおよび複合フィルム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4319892B2 (ja) * 2003-11-07 2009-08-26 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294580A (ja) * 1999-04-12 2000-10-20 Nitto Denko Corp 半導体チップの樹脂封止方法及びリ−ドフレ−ム等貼着用粘着テ−プ
JP2005183734A (ja) * 2003-12-19 2005-07-07 Nitto Denko Corp 半導体装置製造用接着フィルム
JP2006299196A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd ポリイミドフィルムおよび複合フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041525A (ja) * 2010-07-20 2012-03-01 Hitachi Chem Co Ltd 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール

Also Published As

Publication number Publication date
JP5067927B2 (ja) 2012-11-07
US20100119759A1 (en) 2010-05-13
TW200839976A (en) 2008-10-01
JP2008244095A (ja) 2008-10-09

Similar Documents

Publication Publication Date Title
CN201011655Y (zh) 一种大功率半导体器件的框架
WO2010077082A3 (ko) 발광소자 패키지 및 그 제조방법
WO2008136352A1 (ja) 半導体ウエハーの接合方法および半導体装置の製造方法
WO2009011077A1 (ja) 半導体装置及びその製造方法
WO2012060621A3 (ko) 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
WO2011071603A3 (en) Module package with embedded substrate and leadframe
TW200625572A (en) Three dimensional package structure of semiconductor chip embedded in substrate and method for fabricating the same
WO2007130643A3 (en) Die-on-leadframe (dol) with high voltage isolation
TW200640326A (en) Wiring board and method of manufacturing the same
WO2011030283A3 (en) Oled devices with protection cover
TW200951359A (en) LED lamp module and its fabricating method
JP2010153498A5 (ja)
EP1970422A3 (en) Adhesive film for stacking semiconductor chips
DE602007005610D1 (de) Verfahren zur herstellung einer halbleitervorrichtung und dadurch hergestellte halbleitervorrichtung
WO2008117489A1 (ja) 半導体装置製造用接着フィルム
WO2007117829A3 (en) Method for bonding a semiconductor substrate to a metal substrate
TW200802633A (en) Wiring board and method for manufacturing the same, and semiconductor device
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
WO2012049087A3 (en) Semiconductor module and method of manufacturing a semiconductor module
CN104810360A (zh) 电源模块封装以及制造电源模块封装的方法
WO2010123647A3 (en) Substrate based light source package with electrical leads
WO2009072493A1 (ja) 感光性接着剤、半導体装置及び半導体装置の製造方法
TW200741900A (en) Production method for semiconductor device
SG113568A1 (en) Process for producing semiconductor devices, and heat resistant adhesive tape used in this process
TW200742015A (en) Chip package and method for fabricating the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07830251

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12593004

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07830251

Country of ref document: EP

Kind code of ref document: A1