WO2008114711A1 - Adhésif sensible à la pression soluble dans l'eau pour le remplacement de fines billes de brasage - Google Patents

Adhésif sensible à la pression soluble dans l'eau pour le remplacement de fines billes de brasage Download PDF

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Publication number
WO2008114711A1
WO2008114711A1 PCT/JP2008/054711 JP2008054711W WO2008114711A1 WO 2008114711 A1 WO2008114711 A1 WO 2008114711A1 JP 2008054711 W JP2008054711 W JP 2008054711W WO 2008114711 A1 WO2008114711 A1 WO 2008114711A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder balls
pressure sensitive
sensitive adhesive
water soluble
mask
Prior art date
Application number
PCT/JP2008/054711
Other languages
English (en)
Japanese (ja)
Inventor
Takeo Kuramoto
Kaichi Tsuruta
Takashi Hori
Takeo Saitoh
Shinichi Nomoto
Original Assignee
Senju Metal Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd. filed Critical Senju Metal Industry Co., Ltd.
Priority to JP2009505189A priority Critical patent/JPWO2008114711A1/ja
Publication of WO2008114711A1 publication Critical patent/WO2008114711A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C09J139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/58—Ethylene oxide or propylene oxide copolymers, e.g. pluronics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Un dispositif à monter des billes de brasage est utilisé dans le montage de billes de brasage sur une plaque à circuits imprimés. De fines billes de brasage ayant un diamètre de particules de pas plus de 0,2 mm ont un faible poids propre et, de ce fait, lors de génération d'électricité statique, les billes de brasage nécessaires sont également désavantageusement amenées à tomber par pulvérisation d'air ou par impact. De plus, les billes de brasage, qui sont tombées une fois, ont un faible poids propre et sont désavantageusement à nouveau déposées par de l'électricité statique générée sur une tête d'adsorption. Pour résoudre ce problème, un procédé est utilisé dans lequel des billes de brasage sont placées dans une forme en vrac sur un masque tel qu'un masque métallique et sont grattées avec une raclette, telle qu'une raclette en polyuréthane pour faire tomber les billes de brasage au travers des trous du masque ouvert à la même position qu'une électrode dans un substrat de module pour fixer les billes avec un adhésif sensible à la pression appliqué en revêtement sur le substrat de module, ce par quoi une redéposition de billes de brasage sur le masque est évitée. L'adhésif sensible à la pression utilisé dans ce procédé possède une masse moléculaire de pas moins de 200, une viscosité de pas moins de 5000 mPa.s, et une adhérence de 50 à 300 gf. Des adhésifs sensibles à la pression appropriés sont des matières adhésives sensibles à la pression choisies parmi des matières liquides hautement visqueuses, à savoir des agents actifs non ioniques de copolymère oxyde d'éthylène-polyoxyéthylène, des éthylènediamines additionnées par condensation d'oxyde d'éthylène-oxyde de propylène, ou des oligomères d'uréthane solubles dans l'eau, ou des systèmes obtenus par mélange avec une matière liquide de résines solubles dans l'eau, par exemple des produits d'addition d'oxyde d'éthylène sur le PVA, des éther polymères ou des copolymères de vinylpyrrolidone-acétate de vinyle, avec une matière liquide.
PCT/JP2008/054711 2007-03-15 2008-03-14 Adhésif sensible à la pression soluble dans l'eau pour le remplacement de fines billes de brasage WO2008114711A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505189A JPWO2008114711A1 (ja) 2007-03-15 2008-03-14 微細はんだボール配置用水溶性粘着剤

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007065982 2007-03-15
JP2007-065982 2007-03-15

Publications (1)

Publication Number Publication Date
WO2008114711A1 true WO2008114711A1 (fr) 2008-09-25

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ID=39765819

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PCT/JP2008/054711 WO2008114711A1 (fr) 2007-03-15 2008-03-14 Adhésif sensible à la pression soluble dans l'eau pour le remplacement de fines billes de brasage

Country Status (3)

Country Link
JP (1) JPWO2008114711A1 (fr)
TW (1) TW200838378A (fr)
WO (1) WO2008114711A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155928A (ja) * 2008-12-26 2010-07-15 Fujifilm Corp インク組成物及び画像形成方法
WO2015037107A1 (fr) 2013-09-12 2015-03-19 千住金属工業株式会社 Flux de nettoyage, pâte à braser de nettoyage et jonction brasée
CN111117124A (zh) * 2018-10-30 2020-05-08 华南理工大学 一种热水可溶的聚乙烯醇膜及其制备方法和应用
WO2023238676A1 (fr) * 2022-06-10 2023-12-14 ナガセケムテックス株式会社 Composition adhésive soluble dans l'eau pour capture de composants, feuille adhésive soluble dans l'eau pour capture de composants, et procédé de production de composant électronique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104494A (ja) * 1988-10-07 1990-04-17 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
JPH03268891A (ja) * 1990-03-16 1991-11-29 Nippondenso Co Ltd 水溶性フラックス
JPH11297886A (ja) * 1998-04-14 1999-10-29 Nippon Avionics Co Ltd はんだバンプ形成方法
JP2006148146A (ja) * 2003-03-10 2006-06-08 Hitachi Metals Ltd 導電性ボールの搭載方法および搭載装置
JP2006245469A (ja) * 2005-03-07 2006-09-14 Hitachi Metals Ltd 実装球搭載・固定用ペースト
WO2007026410A1 (fr) * 2005-08-31 2007-03-08 Senju Metal Industry Co., Ltd Procédé de fabrication de feuille de transfert de perles de brasage et feuille de transfert de perles de brasage

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104494A (ja) * 1988-10-07 1990-04-17 Hitachi Chem Co Ltd プリント配線板の半田フラックス前駆体
JPH03268891A (ja) * 1990-03-16 1991-11-29 Nippondenso Co Ltd 水溶性フラックス
JPH11297886A (ja) * 1998-04-14 1999-10-29 Nippon Avionics Co Ltd はんだバンプ形成方法
JP2006148146A (ja) * 2003-03-10 2006-06-08 Hitachi Metals Ltd 導電性ボールの搭載方法および搭載装置
JP2006245469A (ja) * 2005-03-07 2006-09-14 Hitachi Metals Ltd 実装球搭載・固定用ペースト
WO2007026410A1 (fr) * 2005-08-31 2007-03-08 Senju Metal Industry Co., Ltd Procédé de fabrication de feuille de transfert de perles de brasage et feuille de transfert de perles de brasage

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155928A (ja) * 2008-12-26 2010-07-15 Fujifilm Corp インク組成物及び画像形成方法
WO2015037107A1 (fr) 2013-09-12 2015-03-19 千住金属工業株式会社 Flux de nettoyage, pâte à braser de nettoyage et jonction brasée
KR20160054553A (ko) 2013-09-12 2016-05-16 센주긴조쿠고교 가부시키가이샤 세정용 플럭스, 세정용 솔더 페이스트 및 납땜 조인트
US10259083B2 (en) 2013-09-12 2019-04-16 Senju Metal Industry Co., Ltd. Cleaning flux, cleaning solder paste, and solder joint
CN111117124A (zh) * 2018-10-30 2020-05-08 华南理工大学 一种热水可溶的聚乙烯醇膜及其制备方法和应用
CN111117124B (zh) * 2018-10-30 2021-02-12 华南理工大学 一种热水可溶的聚乙烯醇膜及其制备方法和应用
WO2023238676A1 (fr) * 2022-06-10 2023-12-14 ナガセケムテックス株式会社 Composition adhésive soluble dans l'eau pour capture de composants, feuille adhésive soluble dans l'eau pour capture de composants, et procédé de production de composant électronique

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TW200838378A (en) 2008-09-16

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