WO2008114635A1 - 感放射線性樹脂組成物 - Google Patents

感放射線性樹脂組成物 Download PDF

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Publication number
WO2008114635A1
WO2008114635A1 PCT/JP2008/054258 JP2008054258W WO2008114635A1 WO 2008114635 A1 WO2008114635 A1 WO 2008114635A1 JP 2008054258 W JP2008054258 W JP 2008054258W WO 2008114635 A1 WO2008114635 A1 WO 2008114635A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
resin composition
sensitive resin
formation
excellence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054258
Other languages
English (en)
French (fr)
Inventor
Satoshi Ishikawa
Kousuke Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2009505136A priority Critical patent/JP5093226B2/ja
Publication of WO2008114635A1 publication Critical patent/WO2008114635A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

　本発明の感放射線性樹脂組成物は、（Ａ）アルカリ可溶性共重合体と（Ｂ）エチレン性不飽和二重結合を有する化合物と（Ｃ）下記式（１）で表される化合物および下記式（２）で表される化合物を含む感放射線性ラジカル重合開始剤とを含有する。本発明の感放射線性樹脂組成物は、優れた解像性を有し、基板との密着性に優れ、メッキ液に対する濡れ性と耐メッキ性を示し、所望のメッキ造形物を形成後の硬化膜の基板からの剥離性にも優れ、バンプ形成用および配線形成用材料として好適である。
PCT/JP2008/054258 2007-03-20 2008-03-10 感放射線性樹脂組成物 Ceased WO2008114635A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505136A JP5093226B2 (ja) 2007-03-20 2008-03-10 感放射線性樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007073411 2007-03-20
JP2007-073411 2007-03-20

Publications (1)

Publication Number Publication Date
WO2008114635A1 true WO2008114635A1 (ja) 2008-09-25

Family

ID=39765742

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054258 Ceased WO2008114635A1 (ja) 2007-03-20 2008-03-10 感放射線性樹脂組成物

Country Status (3)

Country Link
JP (1) JP5093226B2 (ja)
TW (1) TWI416258B (ja)
WO (1) WO2008114635A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010113349A (ja) * 2008-10-10 2010-05-20 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2010128129A (ja) * 2008-11-27 2010-06-10 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物
JP4849197B1 (ja) * 2010-07-30 2012-01-11 日立化成工業株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターン製造方法、リードフレームの製造方法、プリント配線板、及びプリント配線板の製造方法
JP2013249452A (ja) * 2012-06-04 2013-12-12 Hitachi Chemical Co Ltd 液状硬化性樹脂組成物、画像表示用装置、及び画像表示用装置の製造方法
KR20150073077A (ko) 2013-12-20 2015-06-30 제이에스알 가부시끼가이샤 홀 패턴의 형성 방법, 홀 패턴 형성용 수지 조성물 및, 적층체
JP2017005193A (ja) * 2015-06-15 2017-01-05 日立化成株式会社 導体回路を有する構造体及びその製造方法並びに感光性樹脂組成物
JP2020086318A (ja) * 2018-11-29 2020-06-04 東京応化工業株式会社 感光性樹脂組成物、パターン化された硬化膜の製造方法、及びパターン化された硬化膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039709A (ja) * 1998-07-24 2000-02-08 Jsr Corp 感放射線性樹脂組成物、バンプ形成用および配線形成用材料ならびにドライフィルムレジスト
JP2004302389A (ja) * 2003-04-01 2004-10-28 Jsr Corp 感光性樹脂膜およびこれからなる硬化膜
JP2007052351A (ja) * 2005-08-19 2007-03-01 Jsr Corp バンプ形成用樹脂組成物、バンプ形成用二層積層膜、およびバンプ形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039709A (ja) * 1998-07-24 2000-02-08 Jsr Corp 感放射線性樹脂組成物、バンプ形成用および配線形成用材料ならびにドライフィルムレジスト
JP2004302389A (ja) * 2003-04-01 2004-10-28 Jsr Corp 感光性樹脂膜およびこれからなる硬化膜
JP2007052351A (ja) * 2005-08-19 2007-03-01 Jsr Corp バンプ形成用樹脂組成物、バンプ形成用二層積層膜、およびバンプ形成方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010113349A (ja) * 2008-10-10 2010-05-20 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2010128129A (ja) * 2008-11-27 2010-06-10 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物
JP4849197B1 (ja) * 2010-07-30 2012-01-11 日立化成工業株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターン製造方法、リードフレームの製造方法、プリント配線板、及びプリント配線板の製造方法
WO2012014580A1 (ja) * 2010-07-30 2012-02-02 日立化成工業株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターン製造方法、リードフレームの製造方法、プリント配線板、及びプリント配線板の製造方法
JP2013249452A (ja) * 2012-06-04 2013-12-12 Hitachi Chemical Co Ltd 液状硬化性樹脂組成物、画像表示用装置、及び画像表示用装置の製造方法
KR20150073077A (ko) 2013-12-20 2015-06-30 제이에스알 가부시끼가이샤 홀 패턴의 형성 방법, 홀 패턴 형성용 수지 조성물 및, 적층체
JP2017005193A (ja) * 2015-06-15 2017-01-05 日立化成株式会社 導体回路を有する構造体及びその製造方法並びに感光性樹脂組成物
JP2020086318A (ja) * 2018-11-29 2020-06-04 東京応化工業株式会社 感光性樹脂組成物、パターン化された硬化膜の製造方法、及びパターン化された硬化膜
JP7175168B2 (ja) 2018-11-29 2022-11-18 東京応化工業株式会社 感光性樹脂組成物、パターン化された硬化膜の製造方法、及びパターン化された硬化膜

Also Published As

Publication number Publication date
TWI416258B (zh) 2013-11-21
TW200848928A (en) 2008-12-16
JP5093226B2 (ja) 2012-12-12
JPWO2008114635A1 (ja) 2010-07-01

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