WO2008114582A1 - 超音波探触子及びその製造方法並びに超音波診断装置 - Google Patents

超音波探触子及びその製造方法並びに超音波診断装置 Download PDF

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Publication number
WO2008114582A1
WO2008114582A1 PCT/JP2008/053366 JP2008053366W WO2008114582A1 WO 2008114582 A1 WO2008114582 A1 WO 2008114582A1 JP 2008053366 W JP2008053366 W JP 2008053366W WO 2008114582 A1 WO2008114582 A1 WO 2008114582A1
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WIPO (PCT)
Prior art keywords
cmut chip
ultrasonic wave
ultrasonic
backing layer
ultrasonic probe
Prior art date
Application number
PCT/JP2008/053366
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English (en)
French (fr)
Inventor
Shuzo Sano
Akifumi Sako
Takashi Kobayashi
Mikio Izumi
Original Assignee
Hitachi Medical Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Medical Corporation filed Critical Hitachi Medical Corporation
Priority to EP08720914A priority Critical patent/EP2130495A4/en
Priority to CN2008800089319A priority patent/CN101636112B/zh
Priority to US12/525,353 priority patent/US8540640B2/en
Priority to JP2009505109A priority patent/JP5049340B2/ja
Publication of WO2008114582A1 publication Critical patent/WO2008114582A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/221—Arrangements for directing or focusing the acoustical waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/106—Number of transducers one or more transducer arrays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

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  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

　本発明に係る超音波探触子は、バイアス電圧に応じて電気機械結合係数または感度が変化する複数の振動要素を有し超音波を送受波するｃＭＵＴチップ２０と、前記ｃＭＵＴチップ２０の超音波放射側に設けられる音響レンズ２６と、前記ｃＭＵＴチップ２０の背面側に設けられ前記超音波の伝播を吸収するバッキング層２２と、前記ｃＭＵＴチップ２０の周縁部から前記バッキング層２２の側面に設けられ前記ｃＭＵＴチップ２０の電極と接続される信号パターンが配置される電気配線部（フレキシブル基板７２）と、前記ｃＭＵＴチップ２０及び前記音響レンズ２６及び前記バッキング層２２及び前記電気配線部（フレキシブル基板７２）を格納する筐体部（超音波探触子カバー２５）と、を備える超音波探触子２において、前記ｃＭＵＴチップ２０の超音波放射側に、グランド電位のグランド層（導電膜７６）が設けられる。
PCT/JP2008/053366 2007-03-20 2008-02-27 超音波探触子及びその製造方法並びに超音波診断装置 WO2008114582A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08720914A EP2130495A4 (en) 2007-03-20 2008-02-27 ULTRASONIC PROBE, METHOD FOR MANUFACTURING SAME, AND ULTRASONIC DIAGNOSTIC DEVICE
CN2008800089319A CN101636112B (zh) 2007-03-20 2008-02-27 超声波探头及其制造方法及超声波诊断装置
US12/525,353 US8540640B2 (en) 2007-03-20 2008-02-27 Ultrasonic probe and method for manufacturing the same and ultrasonic diagnostic device
JP2009505109A JP5049340B2 (ja) 2007-03-20 2008-02-27 超音波探触子及び超音波診断装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007072604 2007-03-20
JP2007-072604 2007-03-20

Publications (1)

Publication Number Publication Date
WO2008114582A1 true WO2008114582A1 (ja) 2008-09-25

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Application Number Title Priority Date Filing Date
PCT/JP2008/053366 WO2008114582A1 (ja) 2007-03-20 2008-02-27 超音波探触子及びその製造方法並びに超音波診断装置

Country Status (5)

Country Link
US (1) US8540640B2 (ja)
EP (1) EP2130495A4 (ja)
JP (1) JP5049340B2 (ja)
CN (1) CN101636112B (ja)
WO (1) WO2008114582A1 (ja)

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WO2013005563A1 (ja) * 2011-07-04 2013-01-10 オリンパス株式会社 超音波ユニットおよび超音波内視鏡
JP2015154480A (ja) * 2014-02-12 2015-08-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 電気音響変換器
US9968263B2 (en) 2013-09-08 2018-05-15 Canon Kabushiki Kaisha Probe, subject information acquisition apparatus, and method for manufacturing the probe
JP2018079042A (ja) * 2016-11-16 2018-05-24 セイコーエプソン株式会社 超音波トランスデューサーデバイス、超音波プローブおよび超音波装置
US10424719B2 (en) 2015-11-30 2019-09-24 Seiko Epson Corporation Piezoelectric module, ultrasonic module, and electronic apparatus
JP2019193093A (ja) * 2018-04-24 2019-10-31 株式会社日立製作所 超音波送受信素子とこれを備える超音波検査装置、スマートフォン、およびタブレット
US10551355B2 (en) 2015-03-31 2020-02-04 Canon Kabushiki Kaisha Probe and subject information obtaining apparatus using the same
US10813623B2 (en) 2016-11-29 2020-10-27 Seiko Epson Corporation Ultrasonic device, ultrasonic apparatus, and thickness design method
JP2020184694A (ja) * 2019-05-08 2020-11-12 株式会社日立製作所 超音波探触子及びそれを用いた超音波送受信装置

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JP6073855B2 (ja) * 2012-02-23 2017-02-01 株式会社日立製作所 超音波診断装置及び超音波探触子
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KR102184454B1 (ko) 2014-08-25 2020-11-30 삼성전자주식회사 초음파 변환기 모듈, 초음파 변환기 및 초음파 변환기의 제조 방법
CN114557728A (zh) 2016-06-30 2022-05-31 富士胶片株式会社 超声波内窥镜
JP6939219B2 (ja) 2017-08-03 2021-09-22 セイコーエプソン株式会社 超音波装置
CN110743772B (zh) * 2019-09-27 2021-08-03 苏州佳世达电通有限公司 超音波探头及超音波探头的制造方法
CN110743768B (zh) * 2019-09-27 2021-07-02 苏州佳世达电通有限公司 超音波探头
CN113397602B (zh) * 2021-05-21 2022-10-14 深圳市赛禾医疗技术有限公司 心脏内三维超声成像导管及系统、心脏三维模型构建方法

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JP2015154480A (ja) * 2014-02-12 2015-08-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 電気音響変換器
US10551355B2 (en) 2015-03-31 2020-02-04 Canon Kabushiki Kaisha Probe and subject information obtaining apparatus using the same
US10424719B2 (en) 2015-11-30 2019-09-24 Seiko Epson Corporation Piezoelectric module, ultrasonic module, and electronic apparatus
JP2018079042A (ja) * 2016-11-16 2018-05-24 セイコーエプソン株式会社 超音波トランスデューサーデバイス、超音波プローブおよび超音波装置
US10945707B2 (en) 2016-11-16 2021-03-16 Seiko Epson Corporation Ultrasonic transducer device, ultrasonic probe, and ultrasonic apparatus
US10813623B2 (en) 2016-11-29 2020-10-27 Seiko Epson Corporation Ultrasonic device, ultrasonic apparatus, and thickness design method
JP2019193093A (ja) * 2018-04-24 2019-10-31 株式会社日立製作所 超音波送受信素子とこれを備える超音波検査装置、スマートフォン、およびタブレット
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JP2020184694A (ja) * 2019-05-08 2020-11-12 株式会社日立製作所 超音波探触子及びそれを用いた超音波送受信装置
JP7236320B2 (ja) 2019-05-08 2023-03-09 富士フイルムヘルスケア株式会社 超音波探触子及びそれを用いた超音波送受信装置

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EP2130495A4 (en) 2012-03-28
CN101636112A (zh) 2010-01-27
CN101636112B (zh) 2011-10-26
EP2130495A1 (en) 2009-12-09
US20100179430A1 (en) 2010-07-15
JP5049340B2 (ja) 2012-10-17
US8540640B2 (en) 2013-09-24
JPWO2008114582A1 (ja) 2010-07-01

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