WO2008114444A1 - 電子装置の放熱構造及び回路基板ユニット及び筐体 - Google Patents

電子装置の放熱構造及び回路基板ユニット及び筐体 Download PDF

Info

Publication number
WO2008114444A1
WO2008114444A1 PCT/JP2007/055747 JP2007055747W WO2008114444A1 WO 2008114444 A1 WO2008114444 A1 WO 2008114444A1 JP 2007055747 W JP2007055747 W JP 2007055747W WO 2008114444 A1 WO2008114444 A1 WO 2008114444A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
radiation structure
casing
piu
circuit substrate
Prior art date
Application number
PCT/JP2007/055747
Other languages
English (en)
French (fr)
Inventor
Hironori Tanaka
Akira Sawada
Mitsuaki Hayashi
Minoru Fujii
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/055747 priority Critical patent/WO2008114444A1/ja
Publication of WO2008114444A1 publication Critical patent/WO2008114444A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本発明は電子装置の放熱構造に係り、プリント回路基板（３２）にＬＳＩ（３７）が配設されたＰＩＵ（３０Ａ）と、このＰＩＵ（３０Ａ）が挿入され奥部に設けられたＢＷＢ（６２）に装着される筐体とを有する電子装置に設けられ、ＬＳＩ（３７）で発生する熱を放熱する電子装置の放熱構造において、ＰＩＵ（３０Ａ）に設けられ、ＬＳＩ（３７）と熱的に接続するＰＩＵ放熱体（４０Ａ）と、ＢＷＢ（６２）に配設されたＢＷＢ放熱体（７０Ａ）と、ＰＩＵ放熱体（４０Ａ）とＢＷＢ放熱体（７０Ａ）を熱的に接続する熱的接続機構（８０）とを設ける。
PCT/JP2007/055747 2007-03-20 2007-03-20 電子装置の放熱構造及び回路基板ユニット及び筐体 WO2008114444A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055747 WO2008114444A1 (ja) 2007-03-20 2007-03-20 電子装置の放熱構造及び回路基板ユニット及び筐体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055747 WO2008114444A1 (ja) 2007-03-20 2007-03-20 電子装置の放熱構造及び回路基板ユニット及び筐体

Publications (1)

Publication Number Publication Date
WO2008114444A1 true WO2008114444A1 (ja) 2008-09-25

Family

ID=39765565

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/055747 WO2008114444A1 (ja) 2007-03-20 2007-03-20 電子装置の放熱構造及び回路基板ユニット及び筐体

Country Status (1)

Country Link
WO (1) WO2008114444A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2605627A1 (en) * 2011-12-16 2013-06-19 Vetco Gray Controls Limited Heat sink mounting apparatus and method
EP2961252A1 (en) * 2014-06-26 2015-12-30 General Electric Company Systems and methods for passive cooling of components within electrical devices
WO2023284923A1 (de) * 2021-07-14 2023-01-19 Continental Automotive Technologies GmbH Elektronisches gerät mit einer schaltungsanordnung
WO2023160963A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gmbh Vorrichtung mit austauschbaren elektronikbaugruppen eines kraftfahrzeugs

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149840U (ja) * 1974-10-14 1976-04-15
JPS5899888U (ja) * 1981-12-28 1983-07-07 沖電気工業株式会社 電子回路ユニツト構造
JPS63155798A (ja) * 1986-12-19 1988-06-28 富士通株式会社 電子回路ユニツトの放熱構造
JPH05327252A (ja) * 1992-05-27 1993-12-10 Fujitsu Ltd 間隔可変形熱伝導装置
JPH0883990A (ja) * 1994-09-09 1996-03-26 Shinano Polymer Kk 熱伝導素子及びこれを用いた放熱構造
JPH0923082A (ja) * 1995-07-07 1997-01-21 Oki Electric Ind Co Ltd 電子回路ユニットの冷却構造
JPH09127190A (ja) * 1995-10-31 1997-05-16 Ando Electric Co Ltd Ｉｃテスタ用テストヘッドの冷却構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149840U (ja) * 1974-10-14 1976-04-15
JPS5899888U (ja) * 1981-12-28 1983-07-07 沖電気工業株式会社 電子回路ユニツト構造
JPS63155798A (ja) * 1986-12-19 1988-06-28 富士通株式会社 電子回路ユニツトの放熱構造
JPH05327252A (ja) * 1992-05-27 1993-12-10 Fujitsu Ltd 間隔可変形熱伝導装置
JPH0883990A (ja) * 1994-09-09 1996-03-26 Shinano Polymer Kk 熱伝導素子及びこれを用いた放熱構造
JPH0923082A (ja) * 1995-07-07 1997-01-21 Oki Electric Ind Co Ltd 電子回路ユニットの冷却構造
JPH09127190A (ja) * 1995-10-31 1997-05-16 Ando Electric Co Ltd Ｉｃテスタ用テストヘッドの冷却構造

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2605627A1 (en) * 2011-12-16 2013-06-19 Vetco Gray Controls Limited Heat sink mounting apparatus and method
WO2013087938A1 (en) * 2011-12-16 2013-06-20 Vetco Gray Controls Limited Heat sink mounting apparatus and method
AU2012351487A1 (en) * 2011-12-16 2014-07-10 Ge Oil & Gas Uk Limited Heat sink mounting apparatus and method
CN104137661A (zh) * 2011-12-16 2014-11-05 韦特柯格雷控制系统有限公司 散热器安装装置和方法
AU2012351487B2 (en) * 2011-12-16 2017-02-02 Ge Oil & Gas Uk Limited Heat sink mounting apparatus and method
AU2012351487C1 (en) * 2011-12-16 2017-07-13 Ge Oil & Gas Uk Limited Heat sink mounting apparatus and method
US9772147B2 (en) 2011-12-16 2017-09-26 Ge Oil & Gas Uk Limited Heat sink mounting apparatus and method
EP2961252A1 (en) * 2014-06-26 2015-12-30 General Electric Company Systems and methods for passive cooling of components within electrical devices
US9521782B2 (en) 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
WO2023284923A1 (de) * 2021-07-14 2023-01-19 Continental Automotive Technologies GmbH Elektronisches gerät mit einer schaltungsanordnung
WO2023160963A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gmbh Vorrichtung mit austauschbaren elektronikbaugruppen eines kraftfahrzeugs

Similar Documents

Publication Publication Date Title
JP2007310716A5 (ja)
TWI257285B (en) Heat-dissipating module of electronic device
WO2006099936A3 (de) Vorrichtung und verfahren zur bestimmung der temperatur eines kühlkörpers
WO2006029265A3 (en) Liquid cooled heat sink with cold plate retention mechanism
IL239825A0 (en) Use cooling by direct injection for electronics
EP1672464A3 (en) Mobile terminal device and method for radiating heat therefrom
WO2008126564A1 (ja) 放熱部材、それを用いた回路基板、電子部品モジュール及びその製造方法
TW200712850A (en) Heatsink assembly
TW200701871A (en) Heat dissipation device
TW200631194A (en) LED module
WO2007002957A3 (en) Systems for integrated cold plate and heat spreader
WO2008114444A1 (ja) 電子装置の放熱構造及び回路基板ユニット及び筐体
TWI341153B (en) Printed wiring board with a pin for mounting a component and an electronic device using the same
TW200744431A (en) Electronic device
WO2006109206A3 (en) Electronic circuit module comprising a heat producing component
TW200640349A (en) Electronic device
TW200617643A (en) Computer having thermoelectric device
WO2006102875A3 (de) Leiterplattenanordnung
WO2008000551A3 (de) Kühlkörper
WO2009041317A1 (ja) 表示装置
WO2008039990A3 (en) Electronic control module
TW200612808A (en) Heat sink fixing device
WO2008030452A3 (en) Integrated saw device heater
WO2012001593A3 (en) Lighting device
TWI265776B (en) Electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07739190

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07739190

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP