WO2008108170A1 - 真空装置、基板搬送方法 - Google Patents

真空装置、基板搬送方法 Download PDF

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Publication number
WO2008108170A1
WO2008108170A1 PCT/JP2008/052823 JP2008052823W WO2008108170A1 WO 2008108170 A1 WO2008108170 A1 WO 2008108170A1 JP 2008052823 W JP2008052823 W JP 2008052823W WO 2008108170 A1 WO2008108170 A1 WO 2008108170A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
rollers
pressing
vacuum device
held
Prior art date
Application number
PCT/JP2008/052823
Other languages
English (en)
French (fr)
Inventor
Toshiyuki Koizumi
Kouichi Niikura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to KR1020097018498A priority Critical patent/KR101298876B1/ko
Priority to JP2009502507A priority patent/JP4842370B2/ja
Priority to EP08711629.9A priority patent/EP2123581A4/en
Publication of WO2008108170A1 publication Critical patent/WO2008108170A1/ja
Priority to US12/585,096 priority patent/US8393460B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)

Abstract

　省スペースで大型基板を搬送可能な真空装置を提供する。本発明の真空装置（２０）は下部ローラと、押圧ローラと、押圧機構とを複数ずつ有しており、基板（７）は搬送ローラ（２３）と搬送ローラ（２３）の間の位置で、下部ローラと押圧ローラに挟み込まれるので、基板（７）が転倒しない。基板（７）は押圧ローラに接触し、押圧ローラを押し戻して、押圧ローラと下部ローラの間に挟みこまれるので、基板（７）が挟み込まれる際に破損しない。
PCT/JP2008/052823 2007-03-07 2008-02-20 真空装置、基板搬送方法 WO2008108170A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097018498A KR101298876B1 (ko) 2007-03-07 2008-02-20 진공 장치, 기판 반송 방법
JP2009502507A JP4842370B2 (ja) 2007-03-07 2008-02-20 真空装置、基板搬送方法
EP08711629.9A EP2123581A4 (en) 2007-03-07 2008-02-20 VACUUM DEVICE AND METHOD FOR TRANSPORTING A SUBSTRATE
US12/585,096 US8393460B2 (en) 2007-03-07 2009-09-03 Vacuum apparatus and method for conveying substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007056629 2007-03-07
JP2007-056629 2007-03-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/585,096 Continuation-In-Part US8393460B2 (en) 2007-03-07 2009-09-03 Vacuum apparatus and method for conveying substrate

Publications (1)

Publication Number Publication Date
WO2008108170A1 true WO2008108170A1 (ja) 2008-09-12

Family

ID=39738067

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052823 WO2008108170A1 (ja) 2007-03-07 2008-02-20 真空装置、基板搬送方法

Country Status (7)

Country Link
US (1) US8393460B2 (ja)
EP (1) EP2123581A4 (ja)
JP (1) JP4842370B2 (ja)
KR (1) KR101298876B1 (ja)
CN (1) CN101626969A (ja)
TW (1) TWI408094B (ja)
WO (1) WO2008108170A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051416B1 (ko) * 2009-05-28 2011-07-25 주식회사 태성기연 판유리 이송장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5745631B2 (ja) * 2011-08-12 2015-07-08 川崎重工業株式会社 板材の搬送装置及び板材の搬送方法
US8773656B2 (en) * 2011-08-24 2014-07-08 Corning Incorporated Apparatus and method for characterizing glass sheets
CN107934547A (zh) * 2017-12-21 2018-04-20 东莞科耀机电设备有限公司 一种pcb板材输送机
WO2021013754A1 (en) * 2019-07-19 2021-01-28 Saint-Gobain Glass France Device for conveying a sheet of substrate
CN114823443A (zh) * 2021-01-22 2022-07-29 芝浦机械电子装置株式会社 基板搬送装置以及基板处理装置
CN114104692A (zh) * 2021-11-25 2022-03-01 济南二机床集团有限公司 一种立式工装板交换传输机构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63101240A (ja) * 1986-07-16 1988-05-06 ライボルト−ヘレ−ウス・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 真空被覆装置用の搬送機構
JPH10265018A (ja) 1997-03-25 1998-10-06 Hitachi Electron Eng Co Ltd 基板の搬送装置
JP2004281617A (ja) * 2003-03-14 2004-10-07 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを備えた基板処理装置
JP2006513117A (ja) * 2003-04-30 2006-04-20 アプライド フィルムズ ゲーエムベーハー アンド コンパニー カーゲー 真空チャンバ内で平らな基板を移送するための装置

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DE1908109B2 (de) * 1969-02-19 1971-08-05 Deutsche Tafelglas AG Detag, 3510Furth Führungsvorrichtung fur stehend trans portiertes tafelförmiges Gut, insbesondere fur die Herstellung von Doppel oder Mehr fachglasscheiben
US4042128A (en) * 1975-11-26 1977-08-16 Airco, Inc. Substrate transfer apparatus for a vacuum coating system
AT405724B (de) * 1984-06-14 1999-11-25 Lisec Peter Vorrichtung zum abtragenden bearbeiten der randbereiche einer glastafel
US4650064A (en) * 1985-09-13 1987-03-17 Comptech, Incorporated Substrate rotation method and apparatus
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JP2001230264A (ja) 2000-02-16 2001-08-24 Arufu Giken:Kk メッキ装置における長尺リードフレーム搬送機構
KR100486692B1 (ko) * 2002-03-29 2005-05-03 주식회사 엘지이아이 연속처리가 가능한 열교환기 표면처리장치
JP2006008396A (ja) 2004-06-29 2006-01-12 Toshiba Corp 板状部材の搬送装置および搬送方法と、フラットパネルディスプレイの製造装置および製造方法
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JP2006191039A (ja) * 2005-01-05 2006-07-20 Samsung Sdi Co Ltd トレイ移送装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63101240A (ja) * 1986-07-16 1988-05-06 ライボルト−ヘレ−ウス・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 真空被覆装置用の搬送機構
JPH10265018A (ja) 1997-03-25 1998-10-06 Hitachi Electron Eng Co Ltd 基板の搬送装置
JP2004281617A (ja) * 2003-03-14 2004-10-07 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを備えた基板処理装置
JP2006513117A (ja) * 2003-04-30 2006-04-20 アプライド フィルムズ ゲーエムベーハー アンド コンパニー カーゲー 真空チャンバ内で平らな基板を移送するための装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2123581A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101051416B1 (ko) * 2009-05-28 2011-07-25 주식회사 태성기연 판유리 이송장치

Also Published As

Publication number Publication date
CN101626969A (zh) 2010-01-13
JP4842370B2 (ja) 2011-12-21
TWI408094B (zh) 2013-09-11
EP2123581A4 (en) 2013-12-25
JPWO2008108170A1 (ja) 2010-06-10
TW200902412A (en) 2009-01-16
EP2123581A1 (en) 2009-11-25
US8393460B2 (en) 2013-03-12
KR101298876B1 (ko) 2013-08-21
KR20090117785A (ko) 2009-11-12
US20100006397A1 (en) 2010-01-14

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