WO2008100004A1 - Procédé et appareil permettant de placage de boîtier d'un dissipateur thermique à plaques plat par brasage - Google Patents

Procédé et appareil permettant de placage de boîtier d'un dissipateur thermique à plaques plat par brasage Download PDF

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Publication number
WO2008100004A1
WO2008100004A1 PCT/KR2007/005622 KR2007005622W WO2008100004A1 WO 2008100004 A1 WO2008100004 A1 WO 2008100004A1 KR 2007005622 W KR2007005622 W KR 2007005622W WO 2008100004 A1 WO2008100004 A1 WO 2008100004A1
Authority
WO
WIPO (PCT)
Prior art keywords
flat plate
case
bonding
case assembly
heat spreader
Prior art date
Application number
PCT/KR2007/005622
Other languages
English (en)
Inventor
Hyuck-Jin Kwon
Hyun-Tae Kim
Su-Hyeon Kim
Hwan-Hee Oh
Yong-Duck Lee
Original Assignee
Ls Mtron, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Mtron, Ltd. filed Critical Ls Mtron, Ltd.
Publication of WO2008100004A1 publication Critical patent/WO2008100004A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Definitions

  • the present invention relates to method and apparatus for manufacturing a flat plate heat spreader, in particular, to a method for bonding a case of a flat plate heat spreader and a bonding apparatus used in the method.
  • the flat plate heat spreader comprises a case assembly including a lower case and an upper case, and a heat spread medium interposed between the lower case and the upper case, such as a screen mesh, and the lower case and the upper case are bonded together except a refrigerant inlet.
  • a refrigerant is injected into the case assembly and the refrigerant inlet is tightly sealed, and thus the flat plate heat spreader is completely manufactured.
  • a technique for bonding the lower case and the upper case includes mainly TIG (Tungsten Insert Gas) welding, laser welding, soldering or brazing.
  • FIGs. 1 to 3 are views illustrating a conventional apparatus for bonding a case based on brazing.
  • the case bonding apparatus comprises a lower mold 30 having a groove 10 for receiving a case assembly.
  • the lower mold 30 has a high frequency coil 20 surrounding the groove 10 where the case assembly will be mounted.
  • a case assembly 40 is mounted in the groove 10 of the lower mold 30, and the apparatus is ready for a case bonding process.
  • an upper mold 50 and the lower mold 30 are adhered closely together, and a high frequency induction heating is performed on a welding material 45 of the case assembly 40 through the high frequency coil 20 to melt the welding material 45.
  • the present invention was designed to solve the above-mentioned conventional problems, and an object of the present invention is to provide a case bonding apparatus, in which cases of various shapes of flat plate heat spreaders can be bonded, and a bonding method using the same.
  • Another object of the present invention is to provide a case bonding apparatus which can maintain uniformly a thermal distribution applied to a welding material when bonding a case, and a bonding method using the same.
  • the apparatus further comprises a cooling means for cooling and solidifying the welding material after the welding material included in the case assembly is melted.
  • the cooling means injects a cooling gas between the upper flat plate and the lower flat plate to cool the melted welding material in the case assembly.
  • the apparatus further comprises an atmosphere creating means for creating an atmosphere by providing an oxidation preventing gas to prevent oxidation of the surface of the case assembly caused by the high frequency induction heating when bonding the case assembly, and the oxidation preventing gas is an argon gas or a nitrogen gas.
  • the adhering means moves the upper flat plate or the lower flat plate vertically by a press cylinder located above the upper flat plate or below the lower flat plate.
  • the high frequency coil in the upper flat plate is arranged uniformly on the same level as a plane horizontal to the upper flat plate.
  • a method for bonding a case of a flat plate heat spreader based on brazing the case being formed of a case assembly including an upper case and a lower case such that a space for receiving a heat spread medium in the case assembly is formed and a welding material is secured along a bonding portion between the upper case and the lower case
  • the method comprises (a) placing the case assembly on a lower flat plate having a flat upper surface; (b) applying power to an upper flat plate formed in the shape of a plate of a predetermined thickness and having a frequency coil arranged uniformly therein to heat the upper flat plate; and (c) adhering closely the lower flat plate and the heated upper flat plate with the case assembly interposed therebetween and melting the welding material of the case assembly to bond the lower case and the upper case of the case assembly together.
  • the method further comprises injecting a cooling gas between the upper flat plate and the lower flat plate to cool and solidify the welding material after melting the welding material.
  • an atmosphere is created by providing an oxidation preventing gas to prevent oxidation of the surface of the case assembly caused by the high frequency induction heating when bonding the case assembly, and the oxidation preventing gas is an argon gas or a nitrogen gas.
  • FIGs. 1 to 3 are views illustrating a conventional apparatus for bonding a case based on brazing.
  • FIG. 4 is a perspective view illustrating an apparatus for bonding a case of a flat plate heat spreader according to an embodiment of the present invention.
  • FIGs. 5 to 7 are cross-sectional views illustrating the operation of the apparatus for bonding a case of a flat plate heat spreader according an embodiment of the present invention.
  • FIG. 8 is a flow chart illustrating steps of a method for bonding a case of a flat plate heat spreader according to an embodiment of the present invention. Best Mode for Carrying Out the Invention
  • FIG. 4 is a perspective view illustrating an apparatus for bonding a case of a flat plate heat spreader according to an embodiment of the present invention.
  • the apparatus 100 for bonding a case assembly 200 of a flat plate heat spreader comprises a lower flat plate 110 on which the case assembly 200 of the flat plate heat spreader is placed, an upper flat plate 120 having a high frequency coil 122 arranged uniformly therein, a cooling means (not shown) for injecting a cooling gas, an atmosphere creating means (not shown) configured to prevent oxidation of the case assembly 200, and an adhering means 130 for adhering closely the lower flat plate 110 and the upper flat plate 120.
  • the case assembly 200 to be bonded includes an upper case and a lower case such that a space for receiving a heat spread medium in the case assembly 200 is formed and a welding material is secured along a bonding portion between the upper case and the lower case.
  • the case assembly 200 may further include a medium injecting tube for injecting the heat spread medium inside.
  • the lower flat plate 110 is a support having a flat upper surface, on which the case assembly 200 is placed, and is movable vertically by the adhering means 130 to be mentioned below. And, the lower flat plate 110 does not have a separate mold, and thus various shapes of case assemblies can be placed on the lower flat plate 110, and the lower flat plate 110 has such a sufficient area that case assemblies of various sizes can be placed.
  • the upper flat plate 120 has the high frequency coil 122 arranged therein, and is formed in the shape of a plate having a predetermined thickness.
  • the upper flat plate 120 is also movable vertically by the adhering means 130 to be mentioned below.
  • the upper flat plate 120 has a flat surface, which is contacted with the case assembly 200 when the upper flat plate 120 is adhered to the lower flat plate 110. And, when a high frequency current is applied to the high frequency coil 122, the high frequency coil 122 in the upper flat plate 120 emits heat, and thus the upper flat plate 120 is heated.
  • the high frequency coil 122 is arranged uniformly in the upper flat plate 120, which allows to heat and melt uniformly the welding material of the case assembly 200 even though the welding material has any form.
  • the high frequency coil 122 may be arranged uniformly on the plane in the form of a square coil.
  • the present invention is not limited in this regard, and the high frequency coil 122 may be arranged in the form of a circular coil, a polygonal coil or a zigzag coil.
  • the adhering means 130 is configured to move the lower flat plate 110 or and the upper flat plate 120 vertically to adhere closely the case assembly 200 located on the lower flat plate 110 and the upper flat plate 120.
  • the adhering means 130 may be realized to various kinds of adhering means, for example a press cylinder installed below the lower flat plate 110 as shown in the drawings. The press cylinder 130 is operated to move upward or downward so that the lower flat plate 110 is moved vertically.
  • the press cylinder 130 installed below the lower flat plate 110 only
  • the present invention is not limited in this regard, and the press cylinder may be installed above the upper flat plate 120 only so that the upper flat plate 120 is moved vertically, or the press cylinder may be installed below the lower flat plate 110 and above the upper flat plate 120 together so that the upper flat plate 120 and the lower flat plate 110 are moved downward and upward, respectively, and the flat plates 110 and 120 are adhered closely together.
  • the cooling means (not shown) is configured to inject a cooling gas between the lower flat plate 110 and the upper flat plate 120. After the case assembly 200 is heated and the welding material is melted, the cooling means injects a cooling gas to cool the case assembly 200, and consequently solidify the melted welding material.
  • the atmosphere creating means (not shown) is configured to provide an oxidation preventing gas to create an atmosphere in the case bonding apparatus 100 so as to prevent oxidation of the surface of the case assembly 200 in the high frequency heating.
  • the oxidation preventing gas may be an argon gas or a nitrogen gas.
  • the present invention is not limited in this regard, and various gases may be used as the oxidation preventing gas to prevent oxidation of the surface of the case assembly 200 caused by the heating.
  • FIGs. 5 to 7 are cross-sectional views illustrating the operation of the apparatus 100 for bonding a case of a flat plate heat spreader according an embodiment of the present invention.
  • the case assembly 200 to be bonded is placed on the lower flat plate 110.
  • a welding material 210 for bonding the upper case and the lower case together is secured along a bonding surface between the upper case and the lower case of the case assembly 200.
  • a high frequency power is applied to the high frequency coil 122 in the upper flat plate 120 to heat the upper flat plate 120.
  • the high frequency coil 122 in the upper flat plate 120 is arranged on the same level as a plane (A) horizontal to a lower surface of the upper flat plate 120.
  • the lower surface of the upper flat plate 120 is uniformly heated in the high frequency heating. Accordingly, uniform heating is allowed regardless of shape of the case assembly 200 and form of the welding material 210 included in the case assembly 200.
  • the case assembly 200 interposed between the upper flat plate 120 and the lower flat plate 110 is heated by the high frequency coil 122 of the upper flat plate 120, and the welding material 212 included in the case assembly 200 is melted.
  • the melted welding material 212 is drawn into the bonding surface between the upper case and the lower case by a capillary force.
  • a cooling gas is injected into the heated case assembly 200 between the upper flat plate 120 and the lower flat plate 110 using the cooling means.
  • FIG. 8 is a flow chart illustrating steps of the method for bonding a case of a flat plate heat spreader according to an embodiment of the present invention.
  • a case assembly to be bonded in the case bonding process is prepared.
  • the case assembly includes an upper case and a lower case such that a space for receiving a heat spread medium in the case assembly is formed and a welding material is secured along a bonding portion between the upper case and the lower case.
  • the prepared case assembly is placed on the lower flat plate of the case bonding apparatus.
  • the lower flat plate has a flat upper surface, on which various shapes of case assemblies can be placed.
  • the upper flat plate also has a flat lower surface, and the high frequency coil in the upper flat plate is arranged on the same level as a plane horizontal to a lower surface of the upper flat plate.
  • the oxidation preventing gas is provided into the case bonding apparatus simultaneously with heating, which prevents oxidation of the surface of the case assembly caused by the heating. At this time, an argon gas or a nitrogen gas is provided to create an atmosphere.
  • the lower flat plate is moved upward, so that the lower flat plate is adhered to the upper flat plate.
  • the case assembly interposed between the upper flat plate and the lower flat plate is heated by the upper flat plate contacted therewith.
  • the case assembly of any shape can be heated uniformly by the high frequency coil arranged uniformly in the upper flat plate, and accordingly, the welding material included in the case assembly can be melted uniformly. And, after the welding material is melted, the melted welding material is drawn into the bonding portion between the upper case and the lower case of the case assembly by a capillary force (5)
  • a cooling gas is injected between the upper flat plate and the lower flat plate to cool the case assembly.
  • the case assembly is cooled, and accordingly, the melted welding material in the case assembly is also cooled and solidified.
  • the case assembly is bonded by solidification of the welding material.
  • the case bonding apparatus of the present invention can bond a case regardless of shape of the case, and thus reduces time and cost in comparison with a conventional apparatus that requires different molds depending on shape of the case.
  • the present invention can maintain uniformly a thermal distribution when bonding a case, thereby resulting in a high yield and the reduced defect rate of the case bonding process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Induction Heating (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un appareil de placage d'un dissipateur thermique à plaques plat par brasage, le boîtier étant formé d'un ensemble boîtier comprenant un boîtier supérieur et un boîtier inférieur de sorte qu'un espace destiné à recevoir un support de dissipation thermique situé dans l'ensemble boîtier est formé et qu'un matériau de soudage est fixé sur une partie de placage, l'appareil comprend une plaque plate inférieure disposant d'une surface supérieure plate, sur laquelle est placé l'ensemble boîtier; une plaque plate supérieure est formée dans la forme d'une plaque d'une épaisseur prédéterminée et possédant une bobine haute fréquence disposée uniformément à l'intérieur; et un moyen d'adhésion permettant de faire adhérer étroitement la plaque plate inférieure et la plaque plate supérieure à l'ensemble boîtier situé entre selon une position telle que la plaque plate supérieure est chauffé par application d'une puissance de fréquence élevée à la bobine de fréquence élevée.
PCT/KR2007/005622 2007-02-15 2007-11-08 Procédé et appareil permettant de placage de boîtier d'un dissipateur thermique à plaques plat par brasage WO2008100004A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0016096 2007-02-15
KR1020070016096A KR100826052B1 (ko) 2007-02-15 2007-02-15 판형 열전달 장치의 케이스 접합 방법 및 장치

Publications (1)

Publication Number Publication Date
WO2008100004A1 true WO2008100004A1 (fr) 2008-08-21

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ID=39572865

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2007/005622 WO2008100004A1 (fr) 2007-02-15 2007-11-08 Procédé et appareil permettant de placage de boîtier d'un dissipateur thermique à plaques plat par brasage

Country Status (2)

Country Link
KR (1) KR100826052B1 (fr)
WO (1) WO2008100004A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003212669A (ja) * 2002-01-25 2003-07-30 Ngk Insulators Ltd 異種材料接合体及びその製造方法
US6769599B1 (en) * 1998-08-25 2004-08-03 Pac-Tech-Packaging Technologies Gmbh Method and device for placing and remelting shaped pieces consisting of solder material
US20050258218A1 (en) * 2002-10-07 2005-11-24 Christian Schmaranzer Method for joining two metal sheets respectively consisting of an aluminum material and an iron or titanium materials by means of a braze welding joint

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6769599B1 (en) * 1998-08-25 2004-08-03 Pac-Tech-Packaging Technologies Gmbh Method and device for placing and remelting shaped pieces consisting of solder material
JP2003212669A (ja) * 2002-01-25 2003-07-30 Ngk Insulators Ltd 異種材料接合体及びその製造方法
US20050258218A1 (en) * 2002-10-07 2005-11-24 Christian Schmaranzer Method for joining two metal sheets respectively consisting of an aluminum material and an iron or titanium materials by means of a braze welding joint

Also Published As

Publication number Publication date
KR100826052B1 (ko) 2008-04-28

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