WO2008099872A1 - Système de module de circuit intégré - Google Patents
Système de module de circuit intégré Download PDFInfo
- Publication number
- WO2008099872A1 WO2008099872A1 PCT/JP2008/052415 JP2008052415W WO2008099872A1 WO 2008099872 A1 WO2008099872 A1 WO 2008099872A1 JP 2008052415 W JP2008052415 W JP 2008052415W WO 2008099872 A1 WO2008099872 A1 WO 2008099872A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- line
- module
- power source
- main
- module system
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
L'invention concerne un système de module de circuit intégré qui comprend : une première et une seconde ligne principale connectées aux deux extrémités d'une source d'alimentation principale en courant continu ; un module de circuit intégré ; une première et une seconde ligne de module connectées au module de circuit intégré ; et une source d'alimentation en courant continu distribuée agencée séparément de la source d'alimentation principale et ayant une cellule radicale organique ; et une première et une seconde ligne de distribution connectées respectivement aux deux extrémités de la source d'alimentation en courant continu distribuée. La première ligne principale est connectée à la première ligne de module et à la première ligne de distribution. La seconde ligne principale est connectée à la seconde ligne de module et à la seconde ligne de distribution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008558112A JPWO2008099872A1 (ja) | 2007-02-14 | 2008-02-14 | Icモジュールシステム |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007033341 | 2007-02-14 | ||
JP2007-033341 | 2007-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099872A1 true WO2008099872A1 (fr) | 2008-08-21 |
Family
ID=39690099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/052415 WO2008099872A1 (fr) | 2007-02-14 | 2008-02-14 | Système de module de circuit intégré |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2008099872A1 (fr) |
WO (1) | WO2008099872A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010068745A (ja) * | 2008-09-18 | 2010-04-02 | Fumakilla Ltd | 送風式薬剤放散装置 |
JP2010075085A (ja) * | 2008-09-25 | 2010-04-08 | Fumakilla Ltd | 送風式の薬剤放散装置 |
JP2013055874A (ja) * | 2011-09-05 | 2013-03-21 | Taida Electronic Ind Co Ltd | 電気エネルギー適応制御機能を備えた太陽光発電システムおよびその制御方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260435A (ja) * | 1988-08-25 | 1990-02-28 | Toshiba Corp | バックアップ電源装置 |
JPH0794901A (ja) * | 1993-06-30 | 1995-04-07 | Nec Corp | 素子分離型複合マイクロ波回路モジュール |
JP2002261449A (ja) * | 2000-12-27 | 2002-09-13 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュール及びその製造方法 |
JP2005018825A (ja) * | 2003-06-23 | 2005-01-20 | Renesas Technology Corp | 半導体記憶装置 |
JP2006166577A (ja) * | 2004-12-07 | 2006-06-22 | Ricoh Co Ltd | 電源供給制御方法及び電源装置 |
JP2007037291A (ja) * | 2005-07-27 | 2007-02-08 | Nec Corp | 自動車用蓄電システム |
-
2008
- 2008-02-14 JP JP2008558112A patent/JPWO2008099872A1/ja active Pending
- 2008-02-14 WO PCT/JP2008/052415 patent/WO2008099872A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260435A (ja) * | 1988-08-25 | 1990-02-28 | Toshiba Corp | バックアップ電源装置 |
JPH0794901A (ja) * | 1993-06-30 | 1995-04-07 | Nec Corp | 素子分離型複合マイクロ波回路モジュール |
JP2002261449A (ja) * | 2000-12-27 | 2002-09-13 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュール及びその製造方法 |
JP2005018825A (ja) * | 2003-06-23 | 2005-01-20 | Renesas Technology Corp | 半導体記憶装置 |
JP2006166577A (ja) * | 2004-12-07 | 2006-06-22 | Ricoh Co Ltd | 電源供給制御方法及び電源装置 |
JP2007037291A (ja) * | 2005-07-27 | 2007-02-08 | Nec Corp | 自動車用蓄電システム |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010068745A (ja) * | 2008-09-18 | 2010-04-02 | Fumakilla Ltd | 送風式薬剤放散装置 |
JP2010075085A (ja) * | 2008-09-25 | 2010-04-08 | Fumakilla Ltd | 送風式の薬剤放散装置 |
JP2013055874A (ja) * | 2011-09-05 | 2013-03-21 | Taida Electronic Ind Co Ltd | 電気エネルギー適応制御機能を備えた太陽光発電システムおよびその制御方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008099872A1 (ja) | 2010-05-27 |
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