WO2008099872A1 - Ic module system - Google Patents

Ic module system Download PDF

Info

Publication number
WO2008099872A1
WO2008099872A1 PCT/JP2008/052415 JP2008052415W WO2008099872A1 WO 2008099872 A1 WO2008099872 A1 WO 2008099872A1 JP 2008052415 W JP2008052415 W JP 2008052415W WO 2008099872 A1 WO2008099872 A1 WO 2008099872A1
Authority
WO
WIPO (PCT)
Prior art keywords
line
module
power source
main
module system
Prior art date
Application number
PCT/JP2008/052415
Other languages
French (fr)
Japanese (ja)
Inventor
Sadahiko Miura
Toru Mori
Koichi Takemura
Shigeyuki Iwasa
Jiro Iriyama
Yuki Kusachi
Yukiko Morioka
Kentaro Nakahara
Masahiro Suguro
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2008558112A priority Critical patent/JPWO2008099872A1/en
Publication of WO2008099872A1 publication Critical patent/WO2008099872A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Direct Current Feeding And Distribution (AREA)
  • Power Sources (AREA)

Abstract

An IC module system includes: a first and a second main line connected to both ends of a DC main power source; an IC module; a first and a second module line connected to the IC module; and a distributed DC power source arranged separately from the main power source and having an organic radical cell; and a first and a second distribution line respectively connected to both ends of the distributed DC power source. The first main line is connected to the first module line and the first distribution line. The second main line is connected to the second module line and the second distribution line.
PCT/JP2008/052415 2007-02-14 2008-02-14 Ic module system WO2008099872A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008558112A JPWO2008099872A1 (en) 2007-02-14 2008-02-14 IC module system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007033341 2007-02-14
JP2007-033341 2007-12-05

Publications (1)

Publication Number Publication Date
WO2008099872A1 true WO2008099872A1 (en) 2008-08-21

Family

ID=39690099

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052415 WO2008099872A1 (en) 2007-02-14 2008-02-14 Ic module system

Country Status (2)

Country Link
JP (1) JPWO2008099872A1 (en)
WO (1) WO2008099872A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010068745A (en) * 2008-09-18 2010-04-02 Fumakilla Ltd Blowing type chemical-radiating device
JP2010075085A (en) * 2008-09-25 2010-04-08 Fumakilla Ltd Air-blast chemical diffuser
JP2013055874A (en) * 2011-09-05 2013-03-21 Taida Electronic Ind Co Ltd Solar power generation system with electrical energy adaptive control function and control method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260435A (en) * 1988-08-25 1990-02-28 Toshiba Corp Backup power source equipment
JPH0794901A (en) * 1993-06-30 1995-04-07 Nec Corp Element separation type composite microwave circuit module
JP2002261449A (en) * 2000-12-27 2002-09-13 Matsushita Electric Ind Co Ltd Module with built-in component and its manufacturing method
JP2005018825A (en) * 2003-06-23 2005-01-20 Renesas Technology Corp Semiconductor storage device
JP2006166577A (en) * 2004-12-07 2006-06-22 Ricoh Co Ltd Power supply control method and power unit
JP2007037291A (en) * 2005-07-27 2007-02-08 Nec Corp Power storage system for automobile

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260435A (en) * 1988-08-25 1990-02-28 Toshiba Corp Backup power source equipment
JPH0794901A (en) * 1993-06-30 1995-04-07 Nec Corp Element separation type composite microwave circuit module
JP2002261449A (en) * 2000-12-27 2002-09-13 Matsushita Electric Ind Co Ltd Module with built-in component and its manufacturing method
JP2005018825A (en) * 2003-06-23 2005-01-20 Renesas Technology Corp Semiconductor storage device
JP2006166577A (en) * 2004-12-07 2006-06-22 Ricoh Co Ltd Power supply control method and power unit
JP2007037291A (en) * 2005-07-27 2007-02-08 Nec Corp Power storage system for automobile

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010068745A (en) * 2008-09-18 2010-04-02 Fumakilla Ltd Blowing type chemical-radiating device
JP2010075085A (en) * 2008-09-25 2010-04-08 Fumakilla Ltd Air-blast chemical diffuser
JP2013055874A (en) * 2011-09-05 2013-03-21 Taida Electronic Ind Co Ltd Solar power generation system with electrical energy adaptive control function and control method thereof

Also Published As

Publication number Publication date
JPWO2008099872A1 (en) 2010-05-27

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