WO2008099621A1 - レジスト下層膜形成用組成物、及びこれを用いたレジスト下層膜 - Google Patents
レジスト下層膜形成用組成物、及びこれを用いたレジスト下層膜 Download PDFInfo
- Publication number
- WO2008099621A1 WO2008099621A1 PCT/JP2008/050077 JP2008050077W WO2008099621A1 WO 2008099621 A1 WO2008099621 A1 WO 2008099621A1 JP 2008050077 W JP2008050077 W JP 2008050077W WO 2008099621 A1 WO2008099621 A1 WO 2008099621A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- under
- resist film
- composition
- resist
- film formation
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Silicon Polymers (AREA)
Abstract
反射防止膜としての機能を有するとともに、レジスト層との密着性が良好なレジスト下層膜を形成できるレジスト下層膜形成用組成物、及びこれを用いて形成されたレジスト下層膜を提供する。 特定の繰り返し単位を有するシロキサンポリマーAとシロキサンポリマーBとを含有するレジスト下層膜形成用組成物によれば、反射防止膜としての機能を有するとともに、レジスト層との密着性が良好なレジスト下層膜を形成できる。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-037158 | 2007-02-16 | ||
JP2007037158A JP5101904B2 (ja) | 2007-02-16 | 2007-02-16 | レジスト下層膜形成用組成物、及びこれを用いたレジスト下層膜 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099621A1 true WO2008099621A1 (ja) | 2008-08-21 |
Family
ID=39689867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050077 WO2008099621A1 (ja) | 2007-02-16 | 2008-01-08 | レジスト下層膜形成用組成物、及びこれを用いたレジスト下層膜 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5101904B2 (ja) |
WO (1) | WO2008099621A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5015891B2 (ja) * | 2008-10-02 | 2012-08-29 | 信越化学工業株式会社 | 金属酸化物含有膜形成用組成物、金属酸化物含有膜形成基板及びパターン形成方法 |
JP5015892B2 (ja) * | 2008-10-02 | 2012-08-29 | 信越化学工業株式会社 | ケイ素含有膜形成用組成物、ケイ素含有膜形成基板及びパターン形成方法 |
JP5038354B2 (ja) * | 2009-05-11 | 2012-10-03 | 信越化学工業株式会社 | ケイ素含有反射防止膜形成用組成物、ケイ素含有反射防止膜形成基板及びパターン形成方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005352107A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 犠牲膜形成用組成物、パターン形成方法、犠牲膜及びその除去方法 |
JP2005352104A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 反射防止膜材料、及びこれの製造方法、これを用いた反射防止膜、パターン形成 |
JP2005352110A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 犠牲膜形成用組成物、パターン形成方法、犠牲膜及びその除去方法 |
JP2006317864A (ja) * | 2005-05-16 | 2006-11-24 | Tokyo Ohka Kogyo Co Ltd | 反射防止膜形成用組成物、および配線形成方法 |
JP2007226170A (ja) * | 2006-01-27 | 2007-09-06 | Shin Etsu Chem Co Ltd | 反射防止膜材料、反射防止膜を有する基板及びパターン形成方法 |
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2007
- 2007-02-16 JP JP2007037158A patent/JP5101904B2/ja active Active
-
2008
- 2008-01-08 WO PCT/JP2008/050077 patent/WO2008099621A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005352107A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 犠牲膜形成用組成物、パターン形成方法、犠牲膜及びその除去方法 |
JP2005352104A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 反射防止膜材料、及びこれの製造方法、これを用いた反射防止膜、パターン形成 |
JP2005352110A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 犠牲膜形成用組成物、パターン形成方法、犠牲膜及びその除去方法 |
JP2006317864A (ja) * | 2005-05-16 | 2006-11-24 | Tokyo Ohka Kogyo Co Ltd | 反射防止膜形成用組成物、および配線形成方法 |
JP2007226170A (ja) * | 2006-01-27 | 2007-09-06 | Shin Etsu Chem Co Ltd | 反射防止膜材料、反射防止膜を有する基板及びパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5101904B2 (ja) | 2012-12-19 |
JP2008203365A (ja) | 2008-09-04 |
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