WO2008090621A1 - 半導体記憶装置の製造方法 - Google Patents
半導体記憶装置の製造方法 Download PDFInfo
- Publication number
- WO2008090621A1 WO2008090621A1 PCT/JP2007/051202 JP2007051202W WO2008090621A1 WO 2008090621 A1 WO2008090621 A1 WO 2008090621A1 JP 2007051202 W JP2007051202 W JP 2007051202W WO 2008090621 A1 WO2008090621 A1 WO 2008090621A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ingesbte
- memory device
- semiconductor memory
- temperature
- film
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229910000618 GeSbTe Inorganic materials 0.000 abstract 2
- 238000002425 crystallisation Methods 0.000 abstract 2
- 230000008025 crystallization Effects 0.000 abstract 2
- 238000011065 in-situ storage Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005191 phase separation Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 229910052714 tellurium Inorganic materials 0.000 abstract 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/026—Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/063—Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/524,049 US20100015755A1 (en) | 2007-01-25 | 2007-01-25 | Manufacturing method of semiconductor memory device |
PCT/JP2007/051202 WO2008090621A1 (ja) | 2007-01-25 | 2007-01-25 | 半導体記憶装置の製造方法 |
JP2008554944A JP5043044B2 (ja) | 2007-01-25 | 2007-01-25 | 半導体記憶装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/051202 WO2008090621A1 (ja) | 2007-01-25 | 2007-01-25 | 半導体記憶装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008090621A1 true WO2008090621A1 (ja) | 2008-07-31 |
Family
ID=39644203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/051202 WO2008090621A1 (ja) | 2007-01-25 | 2007-01-25 | 半導体記憶装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100015755A1 (ja) |
JP (1) | JP5043044B2 (ja) |
WO (1) | WO2008090621A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014022619A (ja) * | 2012-07-20 | 2014-02-03 | Hitachi Ltd | 低電力で動作する半導体記憶装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090035911A1 (en) * | 2007-07-30 | 2009-02-05 | Willy Rachmady | Method for forming a semiconductor device having abrupt ultra shallow epi-tip regions |
US8174876B2 (en) * | 2009-06-19 | 2012-05-08 | Hynix Semiconductor Inc. | Fusion memory device embodied with phase change memory devices having different resistance distributions and data processing system using the same |
JP5779138B2 (ja) * | 2012-06-07 | 2015-09-16 | 株式会社東芝 | 分子メモリ |
US9178144B1 (en) * | 2014-04-14 | 2015-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | RRAM cell with bottom electrode |
CN112292758A (zh) * | 2018-07-10 | 2021-01-29 | 国立研究开发法人产业技术综合研究所 | 积层构造体及积层构造体的制造方法以及半导体装置 |
WO2024034807A1 (ko) * | 2022-08-11 | 2024-02-15 | 포항공과대학교 산학협력단 | 비정질 텔루륨 옥사이드를 포함하는 반도체, 그를 포함하는 박막트랜지스터 및 그의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005117030A (ja) * | 2003-09-17 | 2005-04-28 | Mitsubishi Materials Corp | 半導体不揮発メモリー用相変化膜およびこの相変化膜を形成するためのスパッタリングターゲット |
JP2006140395A (ja) * | 2004-11-15 | 2006-06-01 | Renesas Technology Corp | 半導体メモリおよびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5687112A (en) * | 1996-04-19 | 1997-11-11 | Energy Conversion Devices, Inc. | Multibit single cell memory element having tapered contact |
KR100632948B1 (ko) * | 2004-08-06 | 2006-10-11 | 삼성전자주식회사 | 칼코겐화합물 스퍼터링 형성 방법 및 이를 이용한 상변화 기억 소자 형성 방법 |
US7638786B2 (en) * | 2004-11-15 | 2009-12-29 | Renesas Technology Corp. | Semiconductor and semiconductor manufacturing arrangements having a chalcogenide layer formed of columnar crystal grains perpendicular to a main substrate surface |
JP2006156886A (ja) * | 2004-12-01 | 2006-06-15 | Renesas Technology Corp | 半導体集積回路装置およびその製造方法 |
KR100688532B1 (ko) * | 2005-02-14 | 2007-03-02 | 삼성전자주식회사 | 텔루르 전구체, 이를 이용하여 제조된 Te-함유 칼코게나이드(chalcogenide) 박막, 상기 박막의 제조방법 및 상변화 메모리 소자 |
-
2007
- 2007-01-25 JP JP2008554944A patent/JP5043044B2/ja not_active Expired - Fee Related
- 2007-01-25 WO PCT/JP2007/051202 patent/WO2008090621A1/ja active Application Filing
- 2007-01-25 US US12/524,049 patent/US20100015755A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005117030A (ja) * | 2003-09-17 | 2005-04-28 | Mitsubishi Materials Corp | 半導体不揮発メモリー用相変化膜およびこの相変化膜を形成するためのスパッタリングターゲット |
JP2006140395A (ja) * | 2004-11-15 | 2006-06-01 | Renesas Technology Corp | 半導体メモリおよびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014022619A (ja) * | 2012-07-20 | 2014-02-03 | Hitachi Ltd | 低電力で動作する半導体記憶装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008090621A1 (ja) | 2010-05-13 |
JP5043044B2 (ja) | 2012-10-10 |
US20100015755A1 (en) | 2010-01-21 |
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