WO2008088068A1 - 微小構造体の製造方法，微小構造体およびマイクロデバイス - Google Patents

微小構造体の製造方法，微小構造体およびマイクロデバイス Download PDF

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Publication number
WO2008088068A1
WO2008088068A1 PCT/JP2008/050728 JP2008050728W WO2008088068A1 WO 2008088068 A1 WO2008088068 A1 WO 2008088068A1 JP 2008050728 W JP2008050728 W JP 2008050728W WO 2008088068 A1 WO2008088068 A1 WO 2008088068A1
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WO
WIPO (PCT)
Prior art keywords
structure body
fine structure
substrate
manufacturing
elastic member
Prior art date
Application number
PCT/JP2008/050728
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English (en)
French (fr)
Inventor
Isao Shimoyama
Kiyoshi Matsumoto
Eiji Iwase
Hiroaki Onoe
Original Assignee
The University Of Tokyo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by The University Of Tokyo filed Critical The University Of Tokyo
Priority to JP2008554101A priority Critical patent/JPWO2008088068A1/ja
Publication of WO2008088068A1 publication Critical patent/WO2008088068A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Manufacture Of Switches (AREA)

Abstract

微小部材となる構造体の材料や構造に限定されず、基板上の任意の位置に配置された構造体を選択的に基板から分離し、高い位置精度で弾性部材または被転写基板に転写することができるだけでなく、一度に多数の微小構造体を形成することができ、効率や生産性を向上させた微小構造体の製造方法，微小構造体およびマイクロデバイスを提供する。基板１に支持部４を介して一体成形された構造体３に、弾性部材５の粘着力を備えた突起部６を押し付けることにより弾性部材５に生じる弾性力を利用して、突起部６から構造体３に押圧力を付与する押印ステップと、前記押圧力により支持部４を破壊すると共に、弾性部材５における突起部６の粘着力により構造体３を保持し、基板１から分離させる分離ステップとを備えた製造方法により微小構造体またはマイクロデバイスを製造した。
PCT/JP2008/050728 2007-01-19 2008-01-21 微小構造体の製造方法，微小構造体およびマイクロデバイス WO2008088068A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008554101A JPWO2008088068A1 (ja) 2007-01-19 2008-01-21 微小構造体の製造方法，微小構造体およびマイクロデバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007010867 2007-01-19
JP2007-010867 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008088068A1 true WO2008088068A1 (ja) 2008-07-24

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ID=39636064

Family Applications (1)

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PCT/JP2008/050728 WO2008088068A1 (ja) 2007-01-19 2008-01-21 微小構造体の製造方法，微小構造体およびマイクロデバイス

Country Status (2)

Country Link
JP (1) JPWO2008088068A1 (ja)
WO (1) WO2008088068A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103023371A (zh) * 2012-12-10 2013-04-03 北京大学 一种微纳集成发电机及其制备方法
KR20140060148A (ko) * 2012-11-09 2014-05-19 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
CN105604736A (zh) * 2015-12-24 2016-05-25 中国电子科技集团公司第五十五研究所 一种适用于mems微推进器阵列芯片的清洁微装药工艺
KR20160080265A (ko) * 2014-12-29 2016-07-07 광주과학기술원 마이크로 디바이스의 전사장치, 마이크로 디바이스의 전사방법, 및 그 전사장치의 제조방법
KR101660908B1 (ko) * 2015-11-23 2016-09-29 경북대학교 산학협력단 플로팅 구조의 전극 패턴 형성 방법 및 상기 방법을 이용한 전사 인쇄 방법
US9782772B2 (en) 2014-10-31 2017-10-10 Samsung Electronics Co., Ltd. Method of bonding two surfaces and construct therefrom and microfluidic device containing the construct
WO2021132142A1 (ja) 2019-12-25 2021-07-01 Ｓｃｉｖａｘ株式会社 インプリント装置およびインプリント方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000218704A (ja) * 1999-01-28 2000-08-08 Fuji Xerox Co Ltd 微小構造体の製造方法
JP2006062011A (ja) * 2004-08-25 2006-03-09 Fuji Xerox Co Ltd 微小構造体およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000218704A (ja) * 1999-01-28 2000-08-08 Fuji Xerox Co Ltd 微小構造体の製造方法
JP2006062011A (ja) * 2004-08-25 2006-03-09 Fuji Xerox Co Ltd 微小構造体およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ONOE H. ET AL.: "3D Integration of Heterogeneous MEMS Structures by Stamping Transfer", THE 20TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2007), 21 January 2007 (2007-01-21), pages 175 - 178, XP031203799, DOI: doi:10.1109/MEMSYS.2007.4433045 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140060148A (ko) * 2012-11-09 2014-05-19 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
KR102044418B1 (ko) * 2012-11-09 2019-11-13 엘지디스플레이 주식회사 경량 박형의 액정표시장치 제조방법
CN103023371A (zh) * 2012-12-10 2013-04-03 北京大学 一种微纳集成发电机及其制备方法
US9782772B2 (en) 2014-10-31 2017-10-10 Samsung Electronics Co., Ltd. Method of bonding two surfaces and construct therefrom and microfluidic device containing the construct
KR20160080265A (ko) * 2014-12-29 2016-07-07 광주과학기술원 마이크로 디바이스의 전사장치, 마이크로 디바이스의 전사방법, 및 그 전사장치의 제조방법
KR101673580B1 (ko) 2014-12-29 2016-11-07 광주과학기술원 마이크로 디바이스의 전사장치, 마이크로 디바이스의 전사방법, 및 그 전사장치의 제조방법
KR101660908B1 (ko) * 2015-11-23 2016-09-29 경북대학교 산학협력단 플로팅 구조의 전극 패턴 형성 방법 및 상기 방법을 이용한 전사 인쇄 방법
CN105604736A (zh) * 2015-12-24 2016-05-25 中国电子科技集团公司第五十五研究所 一种适用于mems微推进器阵列芯片的清洁微装药工艺
CN105604736B (zh) * 2015-12-24 2017-09-26 中国电子科技集团公司第五十五研究所 一种适用于mems微推进器阵列芯片的清洁微装药工艺
WO2021132142A1 (ja) 2019-12-25 2021-07-01 Ｓｃｉｖａｘ株式会社 インプリント装置およびインプリント方法
KR20220120579A (ko) 2019-12-25 2022-08-30 싸이백스 가부시키가이샤 임프린트 장치 및 임프린트 방법

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Publication number Publication date
JPWO2008088068A1 (ja) 2010-05-13

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