WO2008087048A3 - Dispositif d'essai pour composants micromécaniques - Google Patents

Dispositif d'essai pour composants micromécaniques Download PDF

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Publication number
WO2008087048A3
WO2008087048A3 PCT/EP2008/000521 EP2008000521W WO2008087048A3 WO 2008087048 A3 WO2008087048 A3 WO 2008087048A3 EP 2008000521 W EP2008000521 W EP 2008000521W WO 2008087048 A3 WO2008087048 A3 WO 2008087048A3
Authority
WO
WIPO (PCT)
Prior art keywords
micro
test device
mechanical components
displaceable part
provoking
Prior art date
Application number
PCT/EP2008/000521
Other languages
German (de)
English (en)
Other versions
WO2008087048A2 (fr
Inventor
Steffen Kurth
Michael Boehme
Original Assignee
Fraunhofer Ges Forschung
Steffen Kurth
Michael Boehme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung, Steffen Kurth, Michael Boehme filed Critical Fraunhofer Ges Forschung
Publication of WO2008087048A2 publication Critical patent/WO2008087048A2/fr
Publication of WO2008087048A3 publication Critical patent/WO2008087048A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus

Abstract

L'invention concerne un dispositif d'essai pour composants micromécaniques dans lequel au moins un composant micromécanique présentant une partie mobile est placé sur un support et qui comprend un dispositif servant à provoquer une déviation ou des vibrations de la partie mobile, ainsi qu'un dispositif servant à détecter la déviation ou les vibrations. Le dispositif provoquant la déviation ou les vibrations présente des moyens servant à générer un champ électrostatique, éventuellement d'intensité variable, auquel est soumis la partie mobile du composant micromécanique.
PCT/EP2008/000521 2007-01-16 2008-01-16 Dispositif d'essai pour composants micromécaniques WO2008087048A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007002373.3 2007-01-16
DE102007002373 2007-01-16
DE102007016735A DE102007016735B4 (de) 2007-01-16 2007-04-03 Testeinrichtung für mikromechanische Bauelemente
DE102007016735.2 2007-04-03

Publications (2)

Publication Number Publication Date
WO2008087048A2 WO2008087048A2 (fr) 2008-07-24
WO2008087048A3 true WO2008087048A3 (fr) 2008-09-04

Family

ID=39509988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/000521 WO2008087048A2 (fr) 2007-01-16 2008-01-16 Dispositif d'essai pour composants micromécaniques

Country Status (2)

Country Link
DE (1) DE102007016735B4 (fr)
WO (1) WO2008087048A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2946971B1 (fr) * 2009-06-18 2011-07-15 Commissariat Energie Atomique Procede d'excitation d'un element mobile d'une microstructure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6424165B1 (en) * 2000-09-20 2002-07-23 Sandia Corporation Electrostatic apparatus for measurement of microfracture strength
US6567715B1 (en) * 2000-04-19 2003-05-20 Sandia Corporation Method and system for automated on-chip material and structural certification of MEMS devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2844181B2 (ja) 1996-02-08 1999-01-06 セイコーインスツルメンツ株式会社 材料試験デバイス、材料試験装置および材料試験方法
US5990473A (en) * 1998-02-04 1999-11-23 Sandia Corporation Apparatus and method for sensing motion in a microelectro-mechanical system
DE19909777C2 (de) 1999-03-05 2002-09-05 Infineon Technologies Ag Anordnung und Verfahren zum Testen mikromechanisch herstellbarer Bauelementstrukturen
US6708132B1 (en) * 2000-06-02 2004-03-16 Interscience, Inc. Microsystems integrated testing and characterization system and method
US6633426B2 (en) 2001-05-10 2003-10-14 Analog Devices, Inc. Optical-electrical MEMS devices and method
DE10139443A1 (de) * 2001-08-10 2003-03-06 Eads Deutschland Gmbh Verfahren und Vorrichtung zum Trimmen von Sensoren mit schwingenden Strukturen
US6940285B2 (en) * 2003-06-19 2005-09-06 International Business Machines Corporation Method and apparatus for testing a micro electromechanical device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6567715B1 (en) * 2000-04-19 2003-05-20 Sandia Corporation Method and system for automated on-chip material and structural certification of MEMS devices
US6424165B1 (en) * 2000-09-20 2002-07-23 Sandia Corporation Electrostatic apparatus for measurement of microfracture strength

Also Published As

Publication number Publication date
WO2008087048A2 (fr) 2008-07-24
DE102007016735A1 (de) 2008-07-17
DE102007016735B4 (de) 2010-06-17

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