WO2008084770A1 - 静電吸着装置 - Google Patents

静電吸着装置 Download PDF

Info

Publication number
WO2008084770A1
WO2008084770A1 PCT/JP2008/050018 JP2008050018W WO2008084770A1 WO 2008084770 A1 WO2008084770 A1 WO 2008084770A1 JP 2008050018 W JP2008050018 W JP 2008050018W WO 2008084770 A1 WO2008084770 A1 WO 2008084770A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatic chuck
sucking
insulation layer
electrostatic
wafer
Prior art date
Application number
PCT/JP2008/050018
Other languages
English (en)
French (fr)
Inventor
Shoji Kano
Waichi Yamamura
Original Assignee
Shin-Etsu Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co., Ltd. filed Critical Shin-Etsu Chemical Co., Ltd.
Publication of WO2008084770A1 publication Critical patent/WO2008084770A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　半導体ウエハ、ガラス基板等の被吸着物を吸着するための静電吸着装置において、支持基板の一面に形成された静電吸着用電極を覆って上記被吸着物を吸着する吸着面をなす絶縁層が形成され、該絶縁層は、動摩擦係数が０．３以下であり、更に、絶縁層の表面に多数の微小凹凸が形成されていることを特徴とする静電吸着装置。 　本発明によれば、ウエハ吸着面又は静電吸着装置載置面にキズがつくことを防止し、また、発塵を抑え、耐摩耗性に優れた長寿命の静電吸着装置を提供することができる。
PCT/JP2008/050018 2007-01-10 2008-01-07 静電吸着装置 WO2008084770A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-002138 2007-01-10
JP2007002138A JP2010097961A (ja) 2007-01-10 2007-01-10 静電吸着装置

Publications (1)

Publication Number Publication Date
WO2008084770A1 true WO2008084770A1 (ja) 2008-07-17

Family

ID=39608659

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050018 WO2008084770A1 (ja) 2007-01-10 2008-01-07 静電吸着装置

Country Status (2)

Country Link
JP (1) JP2010097961A (ja)
WO (1) WO2008084770A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3317726B1 (en) 2015-07-02 2022-03-02 ASML Netherlands B.V. A substrate holder, a lithographic apparatus and method of manufacturing devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135602A (ja) * 1997-10-30 1999-05-21 Shin Etsu Chem Co Ltd 静電吸着装置
JP2004014603A (ja) * 2002-06-04 2004-01-15 Ngk Spark Plug Co Ltd 吸着用チャック
JP2004356350A (ja) * 2003-05-28 2004-12-16 Kyocera Corp 静電チャック
JP2005072066A (ja) * 2003-08-27 2005-03-17 Shin Etsu Chem Co Ltd 静電吸着機能を有する加熱装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135602A (ja) * 1997-10-30 1999-05-21 Shin Etsu Chem Co Ltd 静電吸着装置
JP2004014603A (ja) * 2002-06-04 2004-01-15 Ngk Spark Plug Co Ltd 吸着用チャック
JP2004356350A (ja) * 2003-05-28 2004-12-16 Kyocera Corp 静電チャック
JP2005072066A (ja) * 2003-08-27 2005-03-17 Shin Etsu Chem Co Ltd 静電吸着機能を有する加熱装置

Also Published As

Publication number Publication date
JP2010097961A (ja) 2010-04-30

Similar Documents

Publication Publication Date Title
TW200730668A (en) Corrosion resistant component made by multilayer coating
WO2009041659A1 (ja) 太陽電池
HK1158368A1 (en) Electrostatic chuck, and method for manufacturing the chuck
TW200707695A (en) Electrostatic chuck
SG10201805121TA (en) Substrate support apparatus having reduced substrate particle generation
WO2012033326A3 (ko) 다공성 세라믹 표면을 밀봉하는 치밀한 희토류 금속 산화물 코팅막 및 이의 제조방법
WO2010077409A3 (en) Photovoltaic glazing assembly and method
TW200742035A (en) Low profile semiconductor package-on-package
UA103022C2 (en) Reflective article
TW200715627A (en) Organic electroluminscence element and manufacturing method of the same, and organic electroluminscence panel
JP2011506457A5 (ja)
WO2006017070A3 (en) Protective cotaing on a substrate and method of making thereof
EP3614442A3 (en) Semiconductor device having oxide semiconductor layer and manufactoring method thereof
SG131011A1 (en) Silicon based substrate with hafnium containing barrier layer
WO2005091370A8 (en) Method for manufacturing integrated circuit
WO2009066561A1 (ja) 有機エレクトロルミネッセンス装置およびその製造方法
WO2007027740A3 (en) Heat sink assembly and related methods for semiconductor vacuum processing systems
TW200603907A (en) Method for protecting substrate
TW200631078A (en) A method of making a semiconductor structure for high power semiconductor devices
NO20082281L (no) Pastamateriale og solcelleelement hvor dette anvendes
WO2010124059A3 (en) Crystalline thin-film photovoltaic structures and methods for forming the same
WO2007142865A3 (en) Thin film photovoltaic structure and fabrication
WO2013032260A3 (ko) 정전 척
TW200640283A (en) Method of manufacturing an organic electronic device
TW200717816A (en) Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08702899

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08702899

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP